NXP Semiconductors MCF5470VR200

Overview

MCF5470VR200 from Freescale Semiconductor is a ColdFire V4e-core microprocessor designed for high-performance embedded networking and industrial control applications. It operates at up to 200 MHz core frequency (312 MIPS @ 200 MHz), integrates a 32-Kbyte instruction cache, 32-Kbyte data cache, MMU, FPU compliant with IEEE-754 double-precision, and supports DDR/SDR SDRAM up to 1 GB via four chip selects.

For engineers reviewing the MCF5470VR200 datasheet, MCF5470VR200 pinout, MCF5470VR200 application, or MCF5470VR200 equivalent, key selection considerations include its 388-pin TEPBGA package, 1.5V core/2.5V DDR/3.3V I/O voltage domains, integrated dual 10/100 Mbps FECs with 2-Kbyte FIFOs per channel, USB 2.0 device controller with PHY, and PCI 2.2 interface supporting 33–66 MHz operation.

Technical Context

The MCF5470VR200 implements a limited superscalar ColdFire V4e core with Harvard architecture, separate 32-entry fully associative instruction and data translation lookahead buffers, and an integrated floating-point unit. Its internal XLB bus arbiter enables high-performance split transactions between multiple masters including the CPU, DMA, and peripheral controllers.

It features a flexible multi-function external bus (FlexBus) operating at 33–66 MHz with six chip selects, a 32-bit DDR/SDR SDRAM controller supporting 66–133 MHz operation and built-in initialization/refresh, and a version 2.2 PCI interface supporting up to five external PCI masters with configurable bus-to-XLB divider ratios (1:1, 1:2, 1:4).

Key Specifications

Pinout & Package

Package: TEPBGA–388, 27 mm × 27 mm, 1.27 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5470VR200, MCF5475VR266 delivers +26% peak MIPS within identical footprint and software compatibility, while MPC8313EVRAGDB trades integrated USB/FEC for PCIe/SATA and PowerPC toolchain alignment-making it suitable for different OS and expansion priorities.

Availability

MCF5470VR200 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure network appliances, medical imaging control units, and telecom base station controllers requiring stable component supply across extended product lifecycles.

Supply support for MCF5470VR200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5470VR200 belongs to the ColdFire V4e microprocessor family, engineered for deterministic real-time performance in resource-constrained networking and control systems with integrated security and high-bandwidth memory interfaces.

FAQ

What is the maximum operating junction temperature for the MCF5470VR200?

The MCF5470VR200 has a maximum operating junction temperature of 105°C, as specified in the Freescale MCF547x datasheet Rev. 4. This limit must be maintained under all operating conditions-including worst-case ambient temperature, power dissipation, and PCB thermal design-to ensure reliable long-term operation. Thermal resistance θJMA for the 388-pin TEPBGA package is 19°C/W under natural convection on a four-layer board.

Does the MCF5470VR200 support both DDR and SDR SDRAM simultaneously?

No, the MCF5470VR200 SDRAM controller supports either DDR or SDR SDRAM-not both simultaneously. The mode is selected at boot time via configuration registers, and the I/O drivers are programmable for SSTL2 (DDR) or SSTL3 (SDR) drive strength. External memory topology must be homogeneous: one bank of DDR SDRAM or one bank of SDR SDRAM, up to 1 GB total across four chip selects.

What are the power supply sequencing requirements for the MCF5470VR200?

The MCF5470VR200 requires strict voltage sequencing: IVDD/PLL VDD and EVDD/SD VDD must track up to 0.9V during power-up, then separate to final values (1.5V core, 3.3V I/O, 2.5V DDR). IVDD must never exceed EVDD or SD VDD by more than 0.4V at any time. During power-down, IVDD/PLL VDD must drop to 0V before EVDD/SD VDD. Rise/fall times must be slower than 1 µs to avoid ESD diode conduction.

How many USB endpoints does the MCF5470VR200 support, and what types are configurable?

The MCF5470VR200 USB 2.0 device controller supports one control endpoint and six programmable endpoints, which can be independently configured as interrupt, bulk, or isochronous. Endpoint descriptors and 4-Kbyte shared FIFO RAM are managed by hardware, enabling simultaneous audio streaming (isochronous), HID reporting (interrupt), and firmware updates (bulk) without CPU intervention-critical for real-time USB device applications using MCF5470VR200.

Is the MCF5470VR200 pin-compatible with other MCF547x family members like MCF5472 or MCF5474?

Yes, the MCF5470VR200 is pin-compatible with all MCF547x variants (MCF5471–MCF5475) in the 388-pin TEPBGA package. Differences are limited to speed grade (e.g., 200 MHz vs. 266 MHz), enabled peripherals (e.g., crypto accelerator optional), and minor electrical specs-allowing drop-in replacement in existing designs when thermal and power delivery constraints permit the higher-frequency variant.