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NXP Semiconductors MCF5471VR200

Part No.:
MCF5471VR200
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
388-BBGA
Datasheet:
AetrixMCF5471VR200.pdf
Description:
IC MCU 32BIT ROMLESS 388PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,726

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Product details

Overview

MCF5471VR200 from Freescale Semiconductor is a ColdFire V4e core microprocessor designed for high-performance embedded networking and industrial control applications. It operates at up to 200 MHz core frequency (310 MIPS @ 200 MHz), integrates a 32-Kbyte instruction cache, 32-Kbyte data cache, MMU, FPU compliant with IEEE-754 double-precision, and supports DDR/SDR SDRAM up to 1 GB via four chip selects.

For engineers reviewing the MCF5471VR200 datasheet, MCF5471VR200 pinout, MCF5471VR200 application, or MCF5471VR200 equivalent, key selection considerations include its 388-pin TEPBGA package, 1.5V core / 2.5V DDR / 3.3V I/O voltage domains, dual 10/100 Mbps FECs with dedicated 2-Kbyte FIFOs per channel, USB 2.0 device controller with integrated PHY, and support for PCI 2.2 at 33–66 MHz.

Technical Context

The MCF5471VR200 implements a limited superscalar ColdFire V4e core with Harvard architecture, separate 32-entry fully associative instruction and data translation lookahead buffers, and an integrated floating-point unit. Its internal XLB bus arbiter enables high-performance split transactions between the core, DMA, and peripherals.

It features a flexible multi-function FlexBus interface (33–66 MHz) with six chip selects for glueless boot flash/SRAM/peripheral interfacing, a 32-bit DDR SDRAM controller supporting 66–133 MHz operation, and a version 2.2 PCI interface supporting up to five external masters with configurable bus-to-XLB divider ratios (1:1, 1:2, 1:4).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ColdFire V4e - limited superscalar, Harvard, with MMU and IEEE-754 double-precision FPU
Max Core Frequency 200 MHz - delivers 310 MIPS (Dhrystone 2.1), enabling real-time deterministic processing in networking stacks
Memory Interface 32-bit DDR/SDR SDRAM controller - supports up to 1 GB across four chip selects with built-in refresh and initialization
PCI Compliance PCI Local Bus Specification v2.2 - 32-bit initiator/target, 33–66 MHz operation, supports up to five external PCI masters
USB Interface USB 2.0 device controller - integrated PHY, one control + six programmable endpoints (interrupt/bulk/isochronous), 4-Kbyte shared FIFO RAM
Networking Peripherals Dual 10/100 Mbps Fast Ethernet Controllers (FECs) - each with dedicated 2-Kbyte TX/RX FIFOs and MII/7-wire interface support
Package TEPBGA–388 - 27 mm × 27 mm body, 1.27 mm ball pitch, RoHS-compliant lead-free assembly

Pinout & Package

Package: TEPBGA–388 (27 mm × 27 mm, 1.27 mm ball pitch). Pinout is defined in Freescale Document MCF5475EC Rev. 4, Section 17 (Case Drawing) and Figure 31 (388-pin BGA Case Outline). Full pin mapping includes dedicated DDR SDRAM bus (SDDATA[31:0], SDADDR[12:0], SDCS[3:0], SDCLK[1:0], SDDQS[3:0]), PCI bus (PCIAD[31:0], PCICXBE[3:0], PCIFRM), FlexBus (AD[31:0], FBCS[5:0], R/W, OE), dual FEC MII interfaces, USB D+/D−/VBUS/PHY pins, and JTAG/BDM debug signals.

Pin/Terminal Circuit Role Design Meaning
SDADDR[12:0] DDR SDRAM Address Bus 13-bit multiplexed address lines for DDR memory row/column addressing; SSTL-2 compatible, 24 mA drive strength
SDDATA[31:0] DDR SDRAM Data Bus 32-bit bidirectional data path with DQS-strobed read/write; supports 133 MHz DDR operation and on-die termination control
FBCS[5:0] FlexBus Chip Selects Six independent chip-select outputs enabling glueless connection to boot ROM, SRAM, or peripheral devices at up to 66 MHz
FEC1_TXD[3:0] / FEC1_RXD[3:0] Fast Ethernet Channel 1 MII Data 4-bit nibble-wide transmit/receive data for first 10/100 Mbps Ethernet port; requires external PHY or direct MII connection
USB_D+ / USB_D− USB 2.0 Differential Pair Full-speed/high-speed differential signaling pair routed as 90 Ω controlled-impedance trace; integrated transceiver eliminates external PHY
TCK / TMS / TDI / TDO JTAG Boundary Scan Interface IEEE 1149.1-compliant test access port for silicon validation, programming, and debug; supports background debug mode (BDM)

Key Features

Feature Design Value
Integrated Cryptography Accelerator Hardware execution units for DES/3DES, AES, RC4, MD5/SHA-1/SHA-256/HMAC, and true random number generation - offloads CPU during secure boot or TLS handshake
Dual Fast Ethernet Controllers Two independent 10/100 Mbps FECs with 2-Kbyte dedicated TX/RX FIFOs each - enables concurrent LAN/WAN or redundant network interfaces without external buffer RAM
Flexible Clocking Architecture Configurable PLL with 30–66.67 MHz input range and selectable core/XLB/PCI clock dividers - allows precise tuning of performance vs. power across multiple subsystems
System Integration Unit (SIU) Centralized interrupt controller, watchdog timer, two 32-bit slice timers, four 32-bit general-purpose timers with PWM/compare - consolidates timing and event management for deterministic real-time response
32-Kbyte On-Chip System SRAM Low-latency tightly coupled memory arbitrated between internal bus masters - used for critical code/data storage, interrupt vectors, or DMA descriptor tables

Applications

Industrial Ethernet Gateway Secure Network Appliance

Use Scenario: Protocol translation between Modbus TCP and EtherNet/IP in factory automation systems with deterministic cycle times under 10 ms.

IC Role / Device Role / Timing Role: Primary application processor executing real-time OS, managing dual FECs for parallel industrial network interfaces, and running fieldbus protocol stacks.

Use Value: Integrated MMU and FPU enable safe memory partitioning and floating-point motion control math; dual 2-Kbyte FIFOs prevent packet loss during burst traffic.

Use Scenario: Firewall or VPN gateway for small business networks requiring TLS acceleration and stateful packet inspection.

IC Role / Device Role / Timing Role: Host processor running Linux-based security stack, leveraging hardware crypto accelerator for AES/SHA offload and USB 2.0 for configuration interface.

Use Value: Dedicated cryptography module reduces CPU load by >70% during SSL/TLS handshakes; 32-Kbyte system SRAM stores session keys and packet buffers with zero external latency.

Medical Imaging Controller Telecom Access Node

Use Scenario: Image acquisition and preprocessing unit in portable ultrasound devices requiring low-power, high-throughput data movement from ADCs to DDR memory.

IC Role / Device Role / Timing Role: Central controller coordinating DMA transfers from PSCs (for sensor interfaces) and DSPI (for timing-critical peripherals), feeding processed frames to DDR via high-bandwidth XLB.

Use Value: 32-Kbyte instruction/data caches minimize DDR accesses; intelligent 16-channel DMA engine handles concurrent sensor streams without CPU intervention.

Use Scenario: DSLAM line card or wireless backhaul node aggregating multiple E1/T1 or LTE fronthaul links into a Gigabit Ethernet uplink.

IC Role / Device Role / Timing Role: Embedded processor managing PCI-based telecom interface cards, FlexBus-connected framing logic, and USB-based field service diagnostics.

Use Value: PCI 2.2 interface supports legacy telecom daughter cards; USB 2.0 device mode enables plug-and-play firmware updates via standard host tools without custom drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCF5472VR266 Higher core frequency (266 MHz), identical pinout and peripheral set; requires tighter thermal design due to ~1.5W max power vs. ~1.2W for MCF5471VR200 Targeted at applications needing higher Dhrystone throughput (410 vs. 310 MIPS) without changing PCB layout or software abstraction layer Select when additional compute headroom is required for future firmware expansion or multi-threaded RTOS workloads.
MPC8313EVRAGDB PowerPC e300 core, different ISA, no ColdFire compatibility; adds PCIe x1 and SATA; lacks integrated USB PHY and crypto accelerator Suitable for Linux-based gateways where software ecosystem (e.g., OpenWrt) favors PowerPC toolchains and PCIe expansion is prioritized over USB/device-side crypto Choose only if migrating from ColdFire toolchain is acceptable and PCIe/SATA connectivity outweighs need for hardware crypto or USB device functionality.

Compared with MCF5471VR200, the MCF5472VR266 offers higher performance within identical hardware constraints, while the MPC8313EVRAGDB provides architectural divergence toward PCIe and Linux readiness at the cost of ColdFire software continuity and integrated security features.

Availability

MCF5471VR200 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure network appliances, medical imaging controllers, and telecom access nodes requiring stable component supply across extended product lifecycles.

Supply support for MCF5471VR200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5471VR200 belongs to the ColdFire MCF547x family, designed specifically for high-integration, cost-sensitive embedded applications requiring real-time determinism, rich peripheral sets, and hardware-accelerated security - targeting industrial control, communications infrastructure, and medical equipment.

FAQ

What is the maximum operating junction temperature for the MCF5471VR200?

The MCF5471VR200 has a maximum operating junction temperature of 105°C, as specified in Table 2 of the MCF5475EC datasheet Rev. 4. This limit must be maintained under all operating conditions, including worst-case ambient temperature and power dissipation. Thermal design should use the θJMA value of 19°C/W (388-pin TEPBGA, four-layer board) to ensure reliable long-term operation of the MCF5471VR200.

Does the MCF5471VR200 support both DDR and SDR SDRAM simultaneously?

No, the MCF5471VR200 SDRAM controller supports either DDR or SDR SDRAM operation-but not both concurrently. The mode is selected at reset via configuration pins and cannot be changed dynamically. DDR mode enables higher bandwidth (up to 133 MHz) and is required for applications needing >800 MB/s memory throughput; SDR mode offers simpler layout and lower power for cost-sensitive designs. This constraint applies strictly to the MCF5471VR200.

What voltage domains does the MCF5471VR200 require?

The MCF5471VR200 requires three distinct voltage domains: 1.5V ±0.07V for internal logic (IVDD), 2.5V ±0.2V for DDR SDRAM I/O (SDVDD), and 3.3V ±0.3V for PCI, FlexBus, and all other I/O (EVDD). The USB subsystem further requires five dedicated supplies: USBVDD, USB_PHYVDD, USB_PLLVDD, USB_OSCVDD, and USB_OSCAVDD-each with specific filtering per Figure 6 and Table 5 in the MCF5475EC datasheet. All domains must follow strict sequencing rules to avoid ESD diode conduction.

Is the USB interface on the MCF5471VR200 a full-speed or high-speed device controller?

The MCF5471VR200 integrates a USB 2.0 device controller with an integrated physical layer (PHY), supporting both full-speed (12 Mbps) and high-speed (480 Mbps) operation. The USB_D+ and USB_D− pins are routed as a 90 Ω differential pair per Section 4.3.1 of the MCF5475EC datasheet, and the internal PHY eliminates need for external transceivers. High-speed mode requires proper USBVBUS detection using the recommended voltage divider (Figure 4 or 5) to ensure reliable enumeration of the MCF5471VR200.

Can the MCF5471VR200 operate without external SDRAM?

Yes, the MCF5471VR200 can execute code from internal resources: 32-Kbyte instruction cache, 32-Kbyte data cache, and 32-Kbyte on-chip system SRAM. Booting from internal SRAM or FlexBus-connected flash (e.g., via FBCS0) is supported for minimal configurations. However, sustained application execution typically requires external SDRAM due to size limitations of on-chip memory. The MCF5471VR200 does not include embedded flash or ROM, so external non-volatile storage is mandatory for production firmware storage.

MCF5471VR200 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
388-BBGA
Series:
MCF547x
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.43V ~ 1.58V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5471VR200 FAQ

1.How can I place an order for MCF5471VR200 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5471VR200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5471VR200 reliable?

The price and inventory of MCF5471VR200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5471VR200 is usually 5 days.

3.What payment methods are accepted for MCF5471VR200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5471VR200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5471VR200?

MCF5471VR200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5471VR200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5471VR200?

For technical support, including MCF5471VR200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5471VR200 requirements.

6.How does Aetrix verify that MCF5471VR200 is sourced from the original manufacturer or authorized distributors?

All MCF5471VR200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5471VR200 meets industry standards.

7.What is the process for return or replacement of MCF5471VR200?

All MCF5471VR200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5471VR200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5471VR200 part is unused and in its original packaging.

Return procedure for MCF5471VR200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF5471VR200 Tags

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