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NXP Semiconductors MCF5471ZP200

Part No.:
MCF5471ZP200
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
388-BBGA
Datasheet:
AetrixMCF5471ZP200.pdf
Description:
IC MCU 32BIT ROMLESS 388PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,624

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Product details

Overview

MCF5471ZP200 from NXP Semiconductors (formerly Freescale) is a ColdFire V4e-based 32-bit microprocessor with integrated DDR SDRAM controller, PCI 2.2 interface, dual 10/100 Mbps Ethernet controllers, USB 2.0 device controller, and optional cryptography accelerator. It operates at up to 266 MHz core frequency (410 MIPS), features 32 KB instruction and 32 KB data caches, MMU, FPU compliant with IEEE-754 double-precision, and targets high-performance embedded networking and industrial control applications.

For engineers reviewing the MCF5471ZP200 datasheet, MCF5471ZP200 pinout, MCF5471ZP200 application, or MCF5471ZP200 equivalent, key selection considerations include DDR/SDR memory support up to 1 GB, 388-pin TEPBGA package with 27 mm × 27 mm footprint, 1.5 V core / 2.5 V DDR / 3.3 V I/O voltage domains, and hardware-accelerated DES/3DES/AES/SHA-256 cryptographic operations.

Technical Context

The MCF5471ZP200 implements a limited superscalar ColdFire V4e core with Harvard architecture, separate 32-entry fully associative TLBs for instruction and data, and integrated floating-point unit. Its system-level interconnect includes an internal XLB arbiter supporting split transactions and parking modes, enabling concurrent access by multiple bus masters including the CPU, DMA, and peripheral controllers.

Peripheral subsystems are tightly coupled: the FlexBus provides glueless 33–66 MHz interfacing to boot ROM, SRAM, and peripherals via six chip-selects; the DDR SDRAM controller supports 66–133 MHz operation with built-in initialization and refresh; and the communications I/O subsystem integrates dual FECs with 2 KB FIFOs each, USB 2.0 device controller with PHY, four PSCs, I²C, and DSPI-all sharing a unified DMA engine.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ColdFire V4e: limited superscalar, Harvard, MMU, IEEE-754 double-precision FPU
Max Core Frequency 266 MHz (410 MIPS @ Dhrystone 2.1); requires CLKIN 30–66.67 MHz with PLL multiplication
Memory Interfaces DDR/SDR SDRAM controller (66–133 MHz, up to 1 GB), FlexBus (33–66 MHz, 6 chip-selects)
Communications Peripherals Dual 10/100 Mbps FECs, USB 2.0 device controller (6 endpoints), 4× PSCs, I²C, DSPI, PCI 2.2 (33–66 MHz)
On-chip Memory 32 KB instruction cache, 32 KB data cache, 32 KB system SRAM, crypto accelerator RAM (4 KB endpoint + 1 KB descriptor)
Package & Power TEPBGA–388 (27 mm × 27 mm); 1.5 V core, 2.5 V DDR I/O, 3.3 V PCI/FlexBus/I/O; <1.5 W typical
Operating Temperature –40 °C to +85 °C ambient (industrial grade); max junction temperature 105 °C

Pinout & Package

Package: TEPBGA–388 (27 mm × 27 mm), ball pitch 1.0 mm, RoHS-compliant. Thermal resistance θJMA = 19 °C/W (4-layer board, natural convection).

Pin/Terminal Circuit Role Design Meaning
CLKIN Primary clock input Accepts 30–66.67 MHz crystal or oscillator; feeds PLL for core, XLB, and SDRAM clocks
RSTI Asynchronous reset input Active-low; synchronously sampled on rising CLKIN edge; minimum pulse width = 5 CLKIN cycles
IVDD / PLLVDD Core & PLL analog supply 1.5 V ± 0.07 V; requires individual RC filtering per PLLVDD pin per Figure 2 in datasheet
EVDD I/O power supply 3.3 V ± 0.3 V; powers PCI, FlexBus, USB digital logic, and most GPIO; must track IVDD within ±0.4 V
SDVDD DDR SDRAM I/O supply 2.5 V ± 0.2 V; powers DDR interface pins (SDDATA, SDADDR, etc.); SSTL2-compatible drive
USBVBUS USB VBUS sense input Accepts 3.3 V level (via external divider from 5 V); used for USB device enumeration and suspend detection

Key Features

Feature Design Value
Floating-point unit (FPU) IEEE-754 double-precision compliant with eight 64-bit registers; enables real-time signal processing without software emulation
DDR SDRAM controller Integrated initialization, auto-refresh, and programmable timing; supports up to four chip-selects and 1 GB address space
Dual Fast Ethernet controllers (FECs) Each with dedicated 2 KB TX/RX FIFOs, MII/7-wire interface, and full-duplex 10/100 Mbps operation
Cryptography accelerator Hardware execution of DES/3DES, AES-128/192/256, RC4, MD5/SHA-1/SHA-256, HMAC, and RNG - offloads CPU during secure comms
Flexible multi-function external bus (FlexBus) Glueless 33–66 MHz interface to boot flash, SRAM, and peripherals; six chip-selects with programmable bus width (8/16/32-bit)

Applications

Industrial Ethernet Gateway Secure Network Appliance

Use Scenario: Real-time protocol translation between Modbus TCP and EtherNet/IP in factory automation systems.

IC Role / Device Role / Timing Role: Primary application processor executing deterministic RTOS, managing dual FECs for concurrent network stacks, and running crypto for TLS 1.2 handshake.

Use Value: Integrated MMU and FPU enable safe memory partitioning and fast floating-point math for motion control algorithms; DDR controller supports large buffer pools for packet queuing.

Use Scenario: Embedded firewall or VPN concentrator in small-office networks with hardware-accelerated IPsec.

IC Role / Device Role / Timing Role: Main host processor handling TCP/IP stack, managing USB 2.0 for configuration, and offloading AES-256 encryption/decryption to crypto accelerator.

Use Value: Dedicated crypto module achieves >100 Mbps IPsec throughput without degrading application performance; 32 KB system SRAM buffers encrypted session state.

Medical Imaging Controller Telecom Access Node

Use Scenario: Image acquisition and preprocessing unit in portable ultrasound devices requiring low-latency DMA transfers from ADCs and display output.

IC Role / Device Role / Timing Role: High-bandwidth data mover using intelligent 16-channel DMA, PSCs for UART-based sensor interfaces, and DSPI for display timing control.

Use Value: FlexBus enables direct connection to FPGA-based image pipeline; 32 KB instruction/data caches reduce memory stalls during real-time FFT processing.

Use Scenario: DSLAM line card controller aggregating multiple ADSL2+ links with QoS-aware traffic shaping.

IC Role / Device Role / Timing Role: System-on-chip managing PCI bus to upstream switch, FECs for management LAN, and PSCs for out-of-band modem control.

Use Value: PCI 2.2 interface provides 133 MB/s upstream bandwidth; programmable slice timers generate precise 125 µs ATM cell intervals for traffic policing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCF5475ZP200 Same ColdFire V4e core, identical pinout and package; differs only in mask revision and minor errata fixes - fully compatible replacement Identical feature set and peripheral integration; validated for same industrial temperature range and DDR/PCI timing Select when latest silicon revision and documented errata resolution are required; no PCB or firmware changes needed
MPC8313EVRAGDB PowerQUICC II Pro e300c3 core (32-bit Power Architecture), 400 MHz max, integrated SEC crypto, but lacks MMU-enabled Linux support in base config Targets similar networking roles but uses different toolchain and OS porting effort; no native ColdFire binary compatibility Choose for higher clock speed and Power Architecture ecosystem; requires full software re-targeting and layout review due to different BGA footprint (620-pin vs 388-pin)

Compared with MCF5471ZP200, MCF5475ZP200 offers identical functionality with updated silicon errata, while MPC8313EVRAGDB provides higher peak performance and stronger crypto throughput but demands significant software and hardware redesign effort.

Availability

MCF5471ZP200 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure network appliances, medical imaging controllers, and telecom access nodes requiring stable component supply across extended product lifecycles.

Supply support for MCF5471ZP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in embedded processing from its Freescale acquisition.

The MCF5471ZP200 belongs to the ColdFire V4e microprocessor family, designed specifically for high-throughput, real-time embedded applications demanding integrated networking, memory management, and hardware security acceleration.

FAQ

What is the maximum DDR SDRAM clock frequency supported by the MCF5471ZP200?

The MCF5471ZP200 DDR SDRAM controller supports operation up to 133 MHz, enabling peak theoretical bandwidth of 2.1 GB/s in double-data-rate mode. This is achieved with a 64-bit data bus and requires proper PCB layout adherence to DDR timing specifications in Table 13 of the MCF5475EC datasheet. The controller is not compatible with DDR2 or DDR3 standards.

Does the MCF5471ZP200 include a memory management unit (MMU)?

Yes, the MCF5471ZP200 includes a full-featured MMU supporting demand-paged virtual memory, essential for running Linux or other protected-mode operating systems. It implements a 32-bit address space with programmable page sizes and supports both supervisor and user modes - a key differentiator from earlier ColdFire generations without MMU.

Can the MCF5471ZP200 operate without external SDRAM?

Yes, the MCF5471ZP200 can execute code from internal resources: 32 KB system SRAM is available at reset and may be used for boot code or critical real-time tasks. However, full functionality - including Linux boot, large application images, and Ethernet packet buffering - requires external DDR or SDR SDRAM connected via the dedicated memory bus.

What voltage domains does the MCF5471ZP200 require?

The MCF5471ZP200 requires three distinct voltage domains: 1.5 V ± 0.07 V for IVDD/PLLVDD (core and PLL analog), 2.5 V ± 0.2 V for SDVDD (DDR I/O), and 3.3 V ± 0.3 V for EVDD (PCI, FlexBus, USB digital, and general I/O). Strict sequencing per Figure 3 in the datasheet is mandatory to prevent ESD diode conduction.

Is the cryptography accelerator in the MCF5471ZP200 enabled by default?

No, the cryptography accelerator module is optional and must be explicitly enabled via the CRYPTOEN bit in the SIU_SIUSCR register. When disabled, associated clock and power domains are gated. Its presence is confirmed in the MCF547x family datasheet, but functional validation requires firmware initialization and correct key scheduling per algorithm mode (AES, SHA, etc.) as defined in the reference manual.

MCF5471ZP200 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
388-BBGA
Series:
MCF547x
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.43V ~ 1.58V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5471ZP200 FAQ

1.How can I place an order for MCF5471ZP200 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5471ZP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5471ZP200 reliable?

The price and inventory of MCF5471ZP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5471ZP200 is usually 5 days.

3.What payment methods are accepted for MCF5471ZP200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5471ZP200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5471ZP200?

MCF5471ZP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5471ZP200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5471ZP200?

For technical support, including MCF5471ZP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5471ZP200 requirements.

6.How does Aetrix verify that MCF5471ZP200 is sourced from the original manufacturer or authorized distributors?

All MCF5471ZP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5471ZP200 meets industry standards.

7.What is the process for return or replacement of MCF5471ZP200?

All MCF5471ZP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5471ZP200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5471ZP200 part is unused and in its original packaging.

Return procedure for MCF5471ZP200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF5471ZP200 Tags

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