NXP Semiconductors MCF5473ZP200
- Part No.:
- MCF5473ZP200
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 388-BBGA
- Datasheet:
-
MCF5473ZP200.pdf
- Description:
- IC MCU 32BIT ROMLESS 388PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCF5473ZP200 from NXP Semiconductors (formerly Freescale) is a ColdFire V4e-based 32-bit microprocessor with integrated DDR SDRAM controller, PCI 2.2 interface, dual 10/100 Mbps Ethernet controllers, USB 2.0 device controller, and optional cryptography accelerator. It operates at up to 200 MHz core frequency (312 MIPS @ 200 MHz), features 32-Kbyte instruction and data caches, MMU, FPU compliant with IEEE-754 double-precision, and supports industrial networking and embedded control applications.
For engineers reviewing the MCF5473ZP200 datasheet, MCF5473ZP200 pinout, MCF5473ZP200 application, or MCF5473ZP200 equivalent, this page delivers verified technical context, validated package mapping (TEPBGA–388), confirmed pinout references, real-world use cases in networked industrial systems, and two rigorously cross-checked alternative microprocessors for migration planning.
Technical Context
The MCF5473ZP200 implements the ColdFire V4e core - a limited superscalar Harvard architecture processor with separate 32-Kbyte instruction and data caches, MMU, and IEEE-754-compliant double-precision FPU. Its internal XLB bus arbiter enables concurrent master access to DDR SDRAM, FlexBus, and PCI resources.
It integrates a 32-bit DDR/SDR SDRAM controller (66–133 MHz), PCI 2.2 interface (33–66 MHz, 32-bit initiator/target), FlexBus subsystem (up to 66 MHz, six chip-selects), and communications I/O including dual FECs, USB 2.0 device PHY, four PSCs, I²C, and DSPI - all synchronized via a programmable PLL accepting 30–66.67 MHz input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V4e - limited superscalar Harvard core with MMU and IEEE-754 double-precision FPU |
| Max Core Frequency | 200 MHz - delivers 312 MIPS (Dhrystone 2.1), enabling real-time deterministic execution in industrial control |
| Memory Interface | 32-bit DDR/SDR SDRAM controller - supports up to 1 GB external memory across four chip-selects with built-in refresh |
| PCI Interface | PCI 2.2 compliant - 32-bit initiator/target operation at 33/66 MHz with support for five external PCI masters |
| Communications Peripherals | Dual 10/100 Mbps FECs (2-Kbyte RX/TX FIFO each), USB 2.0 device controller (6 endpoints), 4× PSCs, I²C, DSPI |
| Power Supply Rails | 1.5 V (core logic), 2.5 V (DDR I/O), 3.3 V (PCI/FlexBus/USB digital/analog I/O) |
| Thermal Rating | Junction temperature max 105 °C; θJMA = 19 °C/W (388-pin TEPBGA, 4-layer board, natural convection) |
Pinout & Package
Package: TEPBGA–388, 27 mm × 27 mm, ball pitch 1.0 mm. Pinout conforms to MCF547x family layout per Freescale Document MCF5475EC Rev. 4, Figure 31 (388-pin BGA case outline) and functional grouping in Section 1 "Maximum Ratings" and Table 4 "DC Electrical Specifications".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary clock input | Accepts 30–66.67 MHz crystal or oscillator signal; feeds PLL for core, XLB, and peripheral clock derivation |
| RSTI | Asynchronous reset input | Active-low input synchronized internally to CLKIN; minimum pulse width = 5 CLKIN cycles |
| SDADDR[12:0], SDDATA[31:0] | DDR SDRAM address/data bus | 13-bit address + 32-bit bidirectional data; SSTL-2/SSTL-3 programmable drive strength for DDR/SDR compatibility |
| PCIAD[31:0] | PCI address/data multiplexed bus | 32-bit multiplexed address/data lines supporting PCI 2.2 target/initiator mode at 33/66 MHz |
| FEC1_TXD[3:0], FEC1_RXD[3:0] | Fast Ethernet Media Independent Interface (MII) | Direct connection to external PHY; supports 10/100 Mbps full-duplex with 2-Kbyte dedicated FIFOs per channel |
| USBD+, USBD− | USB 2.0 differential data pair | On-chip PHY supports high-speed (480 Mbps) signaling; requires 90-Ω controlled impedance routing per USB layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| ColdFire V4e Core with FPU | IEEE-754 double-precision floating-point unit enables real-time math-intensive tasks (e.g., motor control algorithms, signal processing) without software emulation overhead |
| Dual Fast Ethernet Controllers (FECs) | Independent 2-Kbyte RX/TX FIFOs per channel reduce CPU intervention and support simultaneous TCP/IP stack operation on redundant networks |
| Integrated Cryptography Accelerator (optional) | Hardware DES/3DES, AES, RC4, MD5/SHA-1/SHA-256, HMAC, and RNG offload encryption/decryption from main CPU in secure communication protocols |
| Flexible Multi-Function External Bus (FlexBus) | Six chip-selects and glueless interfacing to boot flash, SRAM, and peripherals simplify system expansion and reduce BOM cost |
| System Integration Unit (SIU) | Includes interrupt controller, watchdog timer, two 32-bit slice timers, four 32-bit GP timers with PWM/compare, and GPIO multiplexing - consolidates timing and I/O management |
Applications
| Industrial Ethernet Gateway | Secure Network Appliance |
|---|---|
Use Scenario: Protocol translation between Modbus TCP and EtherNet/IP in factory automation systems. IC Role / Device Role / Timing Role: Primary application processor executing real-time protocol stacks, managing dual FECs for redundant LAN ports, and coordinating FlexBus-connected fieldbus interface modules. Use Value: Integrated MMU and 32-Kbyte caches enable deterministic latency for time-critical packet forwarding; dual FEC hardware acceleration sustains line-rate 100 Mbps throughput. |
Use Scenario: Firewall or VPN endpoint in edge infrastructure requiring authenticated TLS tunneling and encrypted data storage. IC Role / Device Role / Timing Role: Host processor running Linux with cryptographic offload enabled for AES-256 and SHA-256 operations via optional crypto accelerator module. Use Value: Hardware crypto engine reduces CPU utilization by >70% during SSL handshake and bulk data encryption, preserving MIPS for application logic and UI responsiveness. |
| Programmable Logic Controller (PLC) CPU Module | Medical Imaging Control Subsystem |
Use Scenario: Central controller in modular PLC chassis handling I/O scanning, ladder logic execution, and HMI communication. IC Role / Device Role / Timing Role: Real-time deterministic execution engine with MMU-enforced memory protection, FlexBus interfacing to local I/O backplane, and USB 2.0 for configuration download. Use Value: ColdFire V4e core delivers sub-100 µs interrupt latency; 32-Kbyte caches minimize cache-miss stalls during cyclic scan execution; SIU timers provide precise I/O update synchronization. |
Use Scenario: Embedded subsystem controlling X-ray detector readout, image buffering, and DICOM export in portable imaging devices. IC Role / Device Role / Timing Role: High-bandwidth data mover managing DDR SDRAM frame buffers, DMA-controlled PSC interfaces to ADCs, and USB 2.0 host port for DICOM transfer. Use Value: 32-bit DDR SDRAM controller sustains >1.2 GB/s peak bandwidth for real-time image streaming; intelligent 16-channel DMA relieves CPU from pixel data movement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5475ZP266 | Same ColdFire V4e core, identical pinout and peripheral set, but rated for 266 MHz core (410 MIPS) and higher DDR/PCI clock limits | Requires tighter power delivery (1.5 V ±0.07 V), enhanced thermal design (θJMA = 19 °C/W), and supports higher-bandwidth SDRAM configurations | Select when higher compute throughput or extended DDR timing margins are required; PCB layout and power design must meet stricter specs. |
| MPC8313EVRAGDB | PowerQUICC II Pro e300c3 core (32-bit Power Architecture), 400 MHz, integrated DDR2 controller, SEC crypto engine, no ColdFire ISA compatibility | Supports Linux RT, PCIe, SATA, and Gigabit Ethernet - broader connectivity but different toolchain, boot flow, and driver model | Choose for new designs prioritizing long-term roadmap, Linux ecosystem, and higher I/O bandwidth; not drop-in compatible with MCF5473ZP200 firmware or hardware. |
Compared with MCF5473ZP200, MCF5475ZP266 offers higher performance within the same architectural and pinout footprint, while MPC8313EVRAGDB provides a modern Power Architecture alternative with expanded I/O and security features - both require distinct software adaptation and hardware validation.
Availability
MCF5473ZP200 is available at Aetrix Electronics and suitable for industrial networking gateways, secure edge appliances, programmable logic controllers, and medical imaging subsystems requiring stable component supply and long-lifecycle support.
Supply support for MCF5473ZP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in embedded processing from its acquisition of Freescale Semiconductor in 2015.
The MCF5473ZP200 belongs to the ColdFire V4e microprocessor family designed for high-performance, real-time embedded applications demanding integrated networking, memory management, and deterministic execution - especially in industrial control and communications infrastructure.
FAQ
What is the maximum operating junction temperature for the MCF5473ZP200?
The MCF5473ZP200 has a maximum operating junction temperature of 105 °C, as specified in Table 2 of Freescale Document MCF5475EC Rev. 4. This rating applies under natural convection conditions on a four-layer PCB (2s2p) with θJMA = 19 °C/W. Thermal design must ensure sustained operation remains below this limit to guarantee reliability and parametric compliance.
Does the MCF5473ZP200 include an integrated USB 2.0 PHY?
Yes, the MCF5473ZP200 includes a fully integrated USB 2.0 physical layer (PHY) supporting high-speed (480 Mbps) operation. As documented in the "Communications I/O subsystem" section of MCF5475EC Rev. 4, it features dedicated USBD+/USBD− pins, USBVBUS detection, and on-die termination - eliminating the need for an external transceiver in standard USB device implementations.
What DDR SDRAM speeds does the MCF5473ZP200 support?
The MCF5473ZP200 supports DDR SDRAM operation at 66–133 MHz, corresponding to data rates up to 266 MT/s. The controller is compatible with standard DDR SDRAM components and includes built-in initialization, refresh, and programmable drive strength (SSTL-2/SSTL-3 Class I/II) per Section 9 of MCF5475EC Rev. 4.
Is the cryptography accelerator module standard or optional on the MCF5473ZP200?
The cryptography accelerator module is optional on the MCF5473ZP200. As stated in the "Features list" of MCF5475EC Rev. 4, it is described as "Optional Cryptography accelerator module" with dedicated execution units for DES/3DES, AES, RC4, MD5/SHA-1/SHA-256, HMAC, and RNG - present only in silicon variants configured with this feature enabled.
What is the function of the XLB bus in the MCF5473ZP200 architecture?
The XLB (eXternal Local Bus) in the MCF5473ZP200 is an internal high-performance split-transaction bus arbiter that interconnects the ColdFire V4e core, DDR SDRAM controller, PCI interface, FlexBus controller, and other internal masters. It enables concurrent memory accesses and low-latency peripheral arbitration - critical for sustaining throughput across multiple high-bandwidth subsystems in the MCF5473ZP200.
MCF5473ZP200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-BBGA
- Series:
- MCF547x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4E
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 99
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.43V ~ 1.58V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5473ZP200 FAQ
1.How can I place an order for MCF5473ZP200 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5473ZP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5473ZP200 reliable?
The price and inventory of MCF5473ZP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5473ZP200 is usually 5 days.
3.What payment methods are accepted for MCF5473ZP200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5473ZP200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5473ZP200?
MCF5473ZP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5473ZP200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5473ZP200?
For technical support, including MCF5473ZP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5473ZP200 requirements.
6.How does Aetrix verify that MCF5473ZP200 is sourced from the original manufacturer or authorized distributors?
All MCF5473ZP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5473ZP200 meets industry standards.
7.What is the process for return or replacement of MCF5473ZP200?
All MCF5473ZP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5473ZP200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5473ZP200 part is unused and in its original packaging.
Return procedure for MCF5473ZP200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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