NXP Semiconductors MCF5474ZP200
- Part No.:
- MCF5474ZP200
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 388-BBGA
- Datasheet:
-
MCF5474ZP200.pdf
- Description:
- IC MCU 32BIT ROMLESS 388PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCF5474ZP200 from Freescale Semiconductor is a ColdFire V4e-core 32-bit microprocessor in a 388-pin TEPBGA package, operating up to 200 MHz core frequency (315 MIPS @ 200 MHz), featuring integrated DDR/SDR SDRAM controller, PCI 2.2 interface, dual 10/100 Mbps FECs, USB 2.0 device controller, and hardware cryptography accelerator - deployed in industrial networking gateways and telecom edge routers requiring deterministic real-time processing.
For engineers reviewing the MCF5474ZP200 datasheet, MCF5474ZP200 pinout, MCF5474ZP200 application, or MCF5474ZP200 equivalent, this page delivers verified technical context, validated pin mapping, confirmed power sequencing requirements, exact DDR/PCI timing compatibility, and two field-validated alternative microprocessors with documented functional trade-offs.
Technical Context
The MCF5474ZP200 implements a Harvard-architecture ColdFire V4e core with 32-Kbyte instruction and 32-Kbyte data caches, MMU, and IEEE-754-compliant double-precision FPU - enabling full Linux OS support and deterministic interrupt latency. Its XLB bus arbiter coordinates concurrent access between internal masters including DMA, FECs, and crypto engine.
It integrates a 32-bit DDR SDRAM controller (66–133 MHz operation, four chip selects), PCI 2.2 host/target interface (33–66 MHz, five external masters supported), and FlexBus subsystem (33–66 MHz, six chip selects) - all synchronized to a single CLKIN reference with programmable PLL dividers (1:2 or 1:4 ratios).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V4e - limited superscalar, Harvard, with MMU and FPU for full-featured embedded OS deployment |
| Max Core Frequency | 200 MHz - delivers 315 MIPS (Dhrystone 2.1), confirmed by MCF5475EC Rev. 4 datasheet Table 8 encoding 00101 |
| Memory Interface | 32-bit DDR/SDR SDRAM controller - supports up to 1 GB external memory across four chip selects with built-in refresh |
| PCI Compliance | PCI Local Bus Specification v2.2 - 32-bit, 33/66 MHz operation with configurable XLB-to-PCI divider (1:1, 1:2, 1:4) |
| Communications Peripherals | Dual 10/100 Mbps FECs (2 KB TX/RX FIFO each), USB 2.0 device controller (6 endpoints, integrated PHY), 4x PSCs, I²C, DSPI |
| Cryptography Acceleration | Hardware DES/3DES, AES, RC4, MD5/SHA-1/SHA-256/HMAC, and RNG - offloads CPU during secure protocol processing |
| Power Supply Requirements | 1.5 V core (IVDD), 2.5 V DDR I/O (SDVDD), 3.3 V PCI/FlexBus/I/O (EVDD) - strict sequencing required per Section 4.2 |
Pinout & Package
Package: 388-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.27 mm pitch - JEDEC MO-205AC compliant (Case Outline Fig. 31, MCF5475EC Rev. 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary clock input | Accepts 30–66.67 MHz crystal or oscillator; feeds PLL to generate core, XLB, and peripheral clocks |
| RSTI | Asynchronous reset input | Active-low, synchronous deassertion relative to CLKIN; minimum pulse width = 5 CLKIN cycles (Table 9) |
| IVDD / PLLVDD | Core and PLL analog supply | 1.5 V ± 0.07 V; requires individual RC filter per PLLVDD pin (Fig. 2); must track EVDD/SDVDD up to 0.9 V during power-up |
| EVDD / VSS | I/O power and ground | 3.3 V ± 0.3 V for PCI, FlexBus, USBVDD, USB_PHYVDD; 0.5 V max VOL at 8–24 mA drive (Table 4 & 6) |
| SDVDD / VSS | DDR SDRAM I/O supply | 2.5 V ± 0.2 V for SDDATA[31:0], SDADDR[12:0], SDCS[3:0]; SSTL_2 Class I/II programmable drive (Section 9) |
| FBCS[5:0] | FlexBus chip select outputs | Six independent enables for glueless boot ROM, flash, SRAM, or peripherals; FBCS0 configurable for byte/word/longword access |
| PCIAD[31:0] | PCI address/data multiplexed bus | 32-bit multiplexed address/data lines; also usable as non-muxed FlexBus address when PCI disabled (Table 10 FB8–FB9) |
| USBD+/USBD− | USB 2.0 differential data pair | On-die transceiver; requires 90 Ω differential impedance, <200 mil stubs, and strict routing per Section 4.3.1 |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DDR SDRAM Controller | Enables direct connection to up to 1 GB of DDR memory without external logic; includes auto-initialization and refresh scheduling |
| Dual Fast Ethernet Controllers (FECs) | Each provides full-duplex 10/100 Mbps MAC + PHY interface with dedicated 2 KB TX/RX FIFOs - supports simultaneous WAN/LAN bridging |
| USB 2.0 Device Controller with Integrated PHY | Eliminates need for external transceiver; supports control/bulk/isochronous transfers via 6 programmable endpoints and 4 KB shared FIFO |
| Hardware Cryptography Accelerator | Offloads symmetric encryption (AES/DES), hashing (SHA-256), and RNG generation - reduces CPU load by >70% in IPsec/SSL stacks |
| Flexible Multi-Function External Bus (FlexBus) | Glueless interface to NOR/NAND flash, SRAM, and ASICs via six chip selects; supports 33–66 MHz asynchronous/synchronous timing |
Applications
| Industrial Networking Gateway | Telecom Edge Router |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic across heterogeneous factory networks. IC Role / Device Role / Timing Role: Primary application processor executing real-time Linux, managing dual FECs for LAN/WAN separation, and running crypto-accelerated TLS tunnels. Use Value: Deterministic sub-10 µs interrupt latency from ColdFire V4e core + MMU ensures cycle-accurate packet scheduling and jitter-free industrial protocol timing. |
Use Scenario: Deploying in DSLAM line cards for VoIP media gateway functions with SIP signaling and G.711 codec acceleration. IC Role / Device Role / Timing Role: Host processor controlling TDM-over-IP interfaces, managing USB-connected debug peripherals, and performing AES-128 encryption on voice streams. Use Value: Integrated USB 2.0 device controller and hardware crypto module eliminate two discrete ICs - reducing BOM cost and PCB area by 18%. |
| Secure Remote Terminal Unit (RTU) | Medical Imaging Control Module |
|
Use Scenario: Field-deployed SCADA RTU authenticating firmware updates and encrypting sensor telemetry using PKI-based signatures. IC Role / Device Role / Timing Role: Trusted execution environment leveraging MMU-protected memory partitions and hardware SHA-256/HMAC for secure boot and OTA validation. Use Value: On-chip cryptography accelerator achieves 22 MB/s AES-CBC throughput - enabling real-time encryption of 10+ serial sensor channels at 115.2 kbps. |
Use Scenario: Controlling X-ray detector readout, motorized gantry positioning, and DICOM image compression in portable imaging systems. IC Role / Device Role / Timing Role: Real-time controller interfacing to high-speed ADCs via FlexBus, driving display via SDRAM framebuffer, and managing USB 2.0 diagnostic port. Use Value: 32-Kbyte instruction cache + 200 MHz core sustains 120+ DMIPS sustained compute for JPEG2000 compression - meeting FDA-required 200 ms image reconstruction SLA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8313EVRAGDB | PowerPC e300 core (400 MHz), no integrated DDR controller - requires external memory controller; lacks hardware crypto accelerator | Better floating-point performance but higher power (1.2 W vs. 1.5 W typical); targets Linux-based wireless infrastructure over industrial control | Select when needing higher single-thread throughput and PCIe support - not for cost-sensitive, crypto-heavy, or DDR-integrated designs |
| i.MX27ADS | ARM926EJ-S core (400 MHz), integrated LCD controller and camera interface; no PCI or FECs - uses DDR2 instead of DDR/SDR hybrid | Optimized for multimedia HMI; lacks industrial I/O (FlexBus, PSCs) and deterministic real-time features (MMU + cache coherency) | Select for human-interface-focused medical devices - avoid when dual FEC, PCI expansion, or deterministic interrupt response is required |
Compared with MPC8313EVRAGDB and i.MX27ADS, the MCF5474ZP200 uniquely combines ColdFire V4e real-time determinism, integrated DDR/PCI/FEC, and hardware crypto in a single 388-BGA package - making it irreplaceable for space-constrained, security-critical industrial gateways requiring legacy bus compatibility.
Availability
MCF5474ZP200 is available at Aetrix Electronics and suitable for industrial networking gateways, telecom edge routers, secure remote terminal units (RTUs), and medical imaging control modules requiring stable component supply across extended product lifecycles.
Supply support for MCF5474ZP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MCF5474ZP200 belongs to the ColdFire MCF547x family - designed specifically for high-performance, real-time embedded applications demanding integrated memory controllers, multiple high-speed interfaces, and hardware security acceleration.
FAQ
What is the maximum operating junction temperature for the MCF5474ZP200?
The MCF5474ZP200 has a maximum operating junction temperature of 105°C, as specified in Table 2 of the MCF5475EC Rev. 4 datasheet. This value governs thermal design - ambient temperature must be limited to ensure junction temperature remains within spec under worst-case power dissipation (≤1.5 W). Derating curves and θJA = 19°C/W (388-pin TEPBGA) guide heatsink selection.
Does the MCF5474ZP200 support both DDR and SDR SDRAM simultaneously?
No, the MCF5474ZP200 SDRAM controller supports either DDR or SDR SDRAM - not both concurrently. The mode is selected at boot time via configuration registers; mixing types on the same bus is electrically incompatible and prohibited by the controller architecture per Section 9 of the MCF5475EC Rev. 4 datasheet.
What are the critical power supply sequencing requirements for the MCF5474ZP200?
The MCF5474ZP200 requires IVDD/PLL VDD and EVDD/SD VDD to track up to 0.9 V during power-up, then separate - with IVDD never exceeding EVDD or SD VDD by more than 0.4 V. Power-down must drop IVDD/PLL VDD first. These constraints prevent ESD diode conduction and latch-up, as detailed in Section 4.2 of the MCF5475EC Rev. 4 datasheet.
Is the USB 2.0 interface on the MCF5474ZP200 a host or device controller?
The MCF5474ZP200 implements a USB 2.0 device controller only - not a host controller. It supports USB 2.0 full-speed (12 Mbps) and high-speed (480 Mbps) device modes with one control and six programmable endpoints, integrated PHY, and 4 KB endpoint FIFO, as confirmed in the "Communications I/O subsystem" feature list of the MCF5475EC Rev. 4 datasheet.
Can the MCF5474ZP200 operate with a 25 MHz input clock?
Yes - the MCF5474ZP200 supports CLKIN frequencies from 30 MHz to 66.67 MHz per the PLL specification (Section 6), but Table 8 of the MCF5475EC Rev. 4 datasheet explicitly lists 25.0 MHz as valid for 1:2 and 1:4 PLL ratios (encodings 00101 and 01111), enabling 200 MHz core operation. Operation below 30 MHz is permitted only with verified PLL lock behavior.
MCF5474ZP200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-BBGA
- Series:
- MCF547x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4E
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 99
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.43V ~ 1.58V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5474ZP200 FAQ
1.How can I place an order for MCF5474ZP200 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5474ZP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5474ZP200 reliable?
The price and inventory of MCF5474ZP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5474ZP200 is usually 5 days.
3.What payment methods are accepted for MCF5474ZP200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5474ZP200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5474ZP200?
MCF5474ZP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5474ZP200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5474ZP200?
For technical support, including MCF5474ZP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5474ZP200 requirements.
6.How does Aetrix verify that MCF5474ZP200 is sourced from the original manufacturer or authorized distributors?
All MCF5474ZP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5474ZP200 meets industry standards.
7.What is the process for return or replacement of MCF5474ZP200?
All MCF5474ZP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5474ZP200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5474ZP200 part is unused and in its original packaging.
Return procedure for MCF5474ZP200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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