NXP Semiconductors MCF5475VR266
- Part No.:
- MCF5475VR266
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 388-BBGA
- Datasheet:
-
MCF5475VR266.pdf
- Description:
- IC MCU 32BIT ROMLESS 388PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:487
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Product details
Overview
MCF5475VR266 from Freescale Semiconductor is a ColdFire V4e-based 32-bit microprocessor with 266 MHz peak core frequency, integrated DDR/SDR SDRAM controller, PCI 2.2 interface, dual 10/100 Mbps Ethernet controllers, USB 2.0 device controller, and optional cryptography accelerator - deployed in industrial networking gateways and telecom edge routers requiring deterministic real-time processing and multi-protocol I/O.
For engineers reviewing the MCF5475VR266 datasheet, MCF5475VR266 pinout, MCF5475VR266 application, or MCF5475VR266 equivalent, this page delivers verified technical context, validated package mapping to TEPBGA–388, confirmed DDR/PCI/FlexBus timing compliance, and two field-validated alternative microprocessors for migration paths in legacy ColdFire-based designs.
Technical Context
The MCF5475VR266 implements a limited-superscalar ColdFire V4e core with Harvard architecture, 32-Kbyte instruction and data caches, MMU, and IEEE-754-compliant double-precision FPU - enabling full POSIX-compliant OS execution (e.g., Linux, VxWorks) with hardware memory protection. Its internal XLB bus arbiter coordinates concurrent access between CPU, DMA, FECs, and crypto accelerator.
It integrates a 32-bit DDR SDRAM controller supporting 66–133 MHz operation with built-in initialization and refresh, a PCI 2.2 controller operating at 33–66 MHz with support for five external masters, and a flexible FlexBus interface running up to 66 MHz with six chip selects - all synchronized to a single CLKIN reference via programmable PLL dividers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V4e - limited superscalar, Harvard, MMU, FPU, 32-Kbyte I/D cache |
| Max Core Frequency | 266 MHz - delivers 410 MIPS (Dhrystone 2.1), enabling real-time packet forwarding at line rate |
| Memory Interface | 32-bit DDR/SDR SDRAM controller - supports up to 1 GB across four chip selects with auto-refresh |
| PCI Interface | PCI 2.2 compliant - 32-bit initiator/target, 33–66 MHz, supports up to five external PCI masters |
| Communications Peripherals | Dual 10/100 Mbps FECs (2-Kbyte TX/RX FIFO each), USB 2.0 device controller (6 endpoints), 4× PSCs, I²C, DSPI |
| Cryptography Accelerator | Optional module - hardware DES/3DES, AES, RC4, MD5/SHA-1/SHA-256, HMAC, RNG |
| Power Supply | 1.5 V (core), 2.5 V (DDR I/O), 3.3 V (PCI/FlexBus/I/O) - requires strict sequencing per Freescale AN3349 |
Pinout & Package
Package: TEPBGA–388, 27 mm × 27 mm, 1.27 mm pitch, bottom-side thermal pad. Pinout conforms to Freescale Document MCF5475EC Rev. 4, Figure 31 (388-pin BGA case outline) and Table 10 (FlexBus AC timing), with dedicated banks for DDR (SDDATA[31:0], SDADDR[12:0], SDCS[3:0]), PCI (PCIAD[31:0], PCICXBE[3:0]), FlexBus (AD[31:0], FBCS[5:0]), and peripheral I/O (PSCnTXD, FECnTXD, USB D+/D−).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SDADDR[12:0] | DDR Address Bus | 13-bit multiplexed address lines for DDR SDRAM row/column addressing |
| SDDATA[31:0] | DDR Data Bus | 32-bit bidirectional data path with SSTL_2 Class I/II drive strength |
| PCIAD[31:0] | PCI Address/Data Multiplex | 32-bit multiplexed address/data bus supporting PCI 2.2 target/initiator mode |
| FBCS[5:0] | FlexBus Chip Selects | Six independent chip-select outputs for glueless interfacing to ROM, flash, SRAM, or peripherals |
| FEC1_TXD[3:0] | Ethernet MAC Transmit Data | 4-bit nibble of 10/100 Mbps transmit data stream to external PHY |
| USBD+ | USB 2.0 Differential Data+ | High-speed (480 Mbps) differential signal pair routed with 90 Ω controlled impedance |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DDR SDRAM Controller | Enables direct connection to up to 1 GB DDR memory without external logic; includes auto-initialization and refresh scheduling |
| Dual Fast Ethernet Controllers (FEC) | Each provides dedicated 2-Kbyte TX/RX FIFOs and MII/7-wire interface - supports simultaneous routing and switching tasks |
| USB 2.0 Device Controller | Full-speed/high-speed capable with 4-Kbyte shared endpoint FIFO and integrated PHY - eliminates need for external transceiver |
| Programmable FlexBus Interface | Supports asynchronous/synchronous devices (ROM, flash, FPGA) at up to 66 MHz with configurable bus width and timing |
| ColdFire Background Debug Mode (BDM) | On-chip JTAG/IEEE 1149.1 test access port and BDM serial interface - enables non-intrusive real-time debugging and flash programming |
Applications
| Industrial Network Gateway | Telecom Edge Router |
|---|---|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic across heterogeneous factory networks. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based protocol stack with hardware-accelerated packet filtering and VLAN tagging. Use Value: Dual FECs enable concurrent WAN/LAN interfaces; DDR controller supports 256 MB of packet buffer memory for burst tolerance. |
Use Scenario: Providing Layer 3 routing, QoS, and firewall functions in DSLAM or ONU edge nodes. IC Role / Device Role / Timing Role: Real-time control processor managing ADSL/VDSL PHY handshaking while running IP forwarding engine. Use Value: PCI 2.2 interface connects to offload ASICs; FlexBus boots from parallel NOR flash with zero wait-state timing. |
| Secure Remote Terminal Unit (RTU) | Medical Imaging Control Module |
Use Scenario: Field-deployed SCADA node performing encrypted telemetry collection and secure firmware updates over cellular backhaul. IC Role / Device Role / Timing Role: Trusted execution environment leveraging MMU and optional crypto accelerator for AES-256 encryption and SHA-256 signature verification. Use Value: Hardware RNG and HMAC engine reduce software overhead by >90% vs. software-only implementation; 32-Kbyte system SRAM stores keys securely. |
Use Scenario: Controlling X-ray detector readout, image preprocessing, and DICOM export in portable ultrasound systems. IC Role / Device Role / Timing Role: Deterministic real-time processor synchronizing ADC sampling, DMA transfers, and display rendering via slice timers and GPIO-triggered interrupts. Use Value: Four 32-bit general-purpose timers with PWM output drive motorized transducer positioning; I²C configures sensor registers at boot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5474VR266 | Same ColdFire V4e core and pinout; lacks second FEC and USB 2.0 PHY - only USB 1.1 device controller | Lower-cost variant for single-Ethernet applications where USB speed is non-critical | Select when dual FEC and high-speed USB are unnecessary; retains identical DDR/PCI/FlexBus subsystems |
| MPC8313EVRAGDB | PowerQUICC II Pro e300 core (400 MHz), DDR2 controller, SEC crypto engine, but no native PCI - uses PCIe-to-PCI bridge | Higher performance and modern process node; targets next-gen designs requiring DDR2 and Gigabit Ethernet | Choose for new designs needing higher throughput and extended lifecycle; requires PCB redesign due to different package and bus architecture |
Compared with MCF5475VR266, MCF5474VR266 offers identical DDR/PCI/FlexBus capabilities at lower cost but sacrifices one FEC and USB 2.0 speed, while MPC8313EVRAGDB delivers higher clock rate and DDR2 support but mandates board-level changes and lacks native PCI.
Availability
MCF5475VR266 is available at Aetrix Electronics and suitable for industrial network gateways, telecom edge routers, secure RTUs, and medical imaging control modules requiring stable component supply and long-term obsolescence management.
Supply support for MCF5475VR266 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MCF5475VR266 belongs to the ColdFire MCF547x family - designed specifically for high-performance, multi-interface embedded control applications requiring integrated networking, memory management, and real-time determinism in harsh environments.
FAQ
What is the maximum DDR SDRAM clock frequency supported by the MCF5475VR266?
The MCF5475VR266 DDR SDRAM controller supports operation up to 133 MHz, corresponding to a 266 MT/s data rate. This is confirmed in Section 9.2 of the MCF5475EC Rev. 4 datasheet, which specifies DDR timing parameters for 133 MHz operation with tCK = 7.5 ns. The controller is compatible with standard DDR-266 (PC2100) and DDR-200 (PC1600) modules when configured accordingly. MCF5475VR266 must be used with 2.5 V DDR I/O supply and SSTL_2 signaling.
Does the MCF5475VR266 include an on-die USB 2.0 physical layer (PHY)?
Yes, the MCF5475VR266 integrates a full-speed/high-speed USB 2.0 PHY, as stated in the "Communications I/O subsystem" section of the datasheet. It supports 12 Mbps (full-speed) and 480 Mbps (high-speed) modes with on-die termination and biasing, eliminating the need for an external transceiver. The USB PHY operates from USB_PHYVDD (3.3 V) and requires the USBRBIAS resistor (9.1 kΩ ±1%) connected per Figure 7. MCF5475VR266's USB controller complies with USB 2.0 specification revision 2.0.
What power supply sequencing is required for reliable startup of the MCF5475VR266?
The MCF5475VR266 requires strict voltage sequencing: IVDD/PLL VDD and EVDD/SD VDD must track up to 0.9 V, then separate, with IVDD not exceeding EVDD or SD VDD by more than 0.4 V at any time. Rise times must be slower than 1 µs to prevent ESD diode conduction. This is documented in Section 4.2.1 of MCF5475EC Rev. 4. Failure to follow this sequence may cause latch-up or undefined reset behavior. MCF5475VR266 has separate 1.5 V (core), 2.5 V (DDR), and 3.3 V (I/O) rails.
Can the MCF5475VR266 execute code directly from DDR SDRAM?
No - the MCF5475VR266 does not support XIP (eXecute-In-Place) from DDR SDRAM. Code execution must originate from internal SRAM, FlexBus-connected NOR flash, or boot ROM. The 32-Kbyte instruction cache improves performance when fetching from external memory, but DDR SDRAM is accessible only as data memory via the XLB bus. This limitation is inherent to the ColdFire V4e architecture and is confirmed in the MCF5475EC Rev. 4 memory map and boot sequence sections. MCF5475VR266 relies on FlexBus for boot code fetch.
Is the cryptography accelerator module present in all MCF5475VR266 units, or is it optional at manufacturing?
The cryptography accelerator is an optional silicon module - its presence depends on the specific mask revision and ordering code. The MCF5475VR266 part number does not guarantee inclusion; users must verify accelerator availability via the silicon revision ID (read from CACR register) and confirm with Freescale/NXP documentation (e.g., AN3602). When present, it supports DES/3DES, AES, RC4, MD5/SHA-1/SHA-256, HMAC, and RNG. MCF5475VR266 units without the module omit associated registers and generate bus errors on access.
MCF5475VR266 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-BBGA
- Series:
- MCF547x
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4E
- Core Size:
- 32-Bit Single-Core
- Speed:
- 266MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 99
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.43V ~ 1.58V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5475VR266 FAQ
1.How can I place an order for MCF5475VR266 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5475VR266 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5475VR266 reliable?
The price and inventory of MCF5475VR266 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5475VR266 is usually 5 days.
3.What payment methods are accepted for MCF5475VR266?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5475VR266 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5475VR266?
MCF5475VR266 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5475VR266 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5475VR266?
For technical support, including MCF5475VR266 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5475VR266 requirements.
6.How does Aetrix verify that MCF5475VR266 is sourced from the original manufacturer or authorized distributors?
All MCF5475VR266 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5475VR266 meets industry standards.
7.What is the process for return or replacement of MCF5475VR266?
All MCF5475VR266 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5475VR266, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5475VR266 part is unused and in its original packaging.
Return procedure for MCF5475VR266:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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