Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MCF5475ZP200

Part No.:
MCF5475ZP200
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
388-BBGA
Datasheet:
AetrixMCF5475ZP200.pdf
Description:
IC MCU 32BIT ROMLESS 388PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,806

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MCF5475ZP200 from Freescale Semiconductor is a ColdFire V4e core microprocessor designed for high-performance embedded networking and industrial control applications. It operates at up to 266 MHz core frequency (410 MIPS), integrates a 32-Kbyte instruction cache, 32-Kbyte data cache, MMU, FPU compliant with IEEE-754 double-precision, and supports DDR/SDR SDRAM up to 1 GB via four chip selects.

For engineers reviewing the MCF5475ZP200 datasheet, MCF5475ZP200 pinout, MCF5475ZP200 application, or MCF5475ZP200 equivalent, key selection considerations include its 388-pin TEPBGA package, 1.5V core/2.5V DDR/3.3V I/O voltage domains, dual 10/100 Mbps FECs with dedicated 2-Kbyte FIFOs per channel, USB 2.0 device controller with integrated PHY, and optional cryptography accelerator supporting AES, DES/3DES, SHA-256, and RNG.

Technical Context

The MCF5475ZP200 implements a limited superscalar ColdFire V4e core with Harvard architecture, separate 32-entry fully-associative instruction and data translation lookahead buffers, and integrated memory management unit enabling full Linux OS support. Its internal XLB bus arbiter manages concurrent access from multiple masters including the CPU, DMA, FECs, and USB subsystem.

It features a flexible multi-function FlexBus interface operating at 33–66 MHz with six chip selects, a PCI 2.2 controller supporting 33–66 MHz with five external master slots, and a communications I/O subsystem comprising two FECs, one USB 2.0 device controller, four PSCs, I²C, and DSPI-all backed by an intelligent 16-channel DMA controller.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ColdFire V4e limited superscalar processor with Harvard memory architecture and MMU
Max Core Frequency 266 MHz (410 MIPS @ Dhrystone 2.1), enabled by PLL with 30–66.67 MHz input range
FPU Compliance IEEE-754 double-precision floating-point unit with eight registers
Memory Interface 32-bit DDR/SDR SDRAM controller supporting 66–133 MHz operation and up to 1 GB across four chip selects
PCI Interface PCI 2.2 compliant, 32-bit target/initiator, 33–66 MHz operation with 1:1/1:2/1:4 XLB divider ratios
USB Interface USB 2.0 device controller with integrated PHY, 1 control + 6 programmable endpoints, 4 KB shared FIFO RAM
Package TEPBGA–388, 27 mm × 27 mm, 1.27 mm ball pitch
Power Supply 1.5 V (core logic), 2.5 V (DDR I/O), 3.3 V (PCI/FlexBus/other I/O); total power < 1.5 W

Pinout & Package

Package: TEPBGA–388 (27 mm × 27 mm, 1.27 mm ball pitch). Pinout is defined in Freescale Document Number MCF5475EC Rev. 4, Section 17 (Case Drawing) and Figure 31 (388-pin BGA Case Outline). Full pin mapping includes dedicated banks for DDR SDRAM (SDDATA[31:0], SDADDR[12:0], SDCS[3:0], SDCLK[1:0], SDDQS[3:0]), FlexBus (AD[31:0], FBCS[5:0], R/W, OE), PCI (PCIAD[31:0], PCICXBE[3:0], PCIFRM), FEC (ENMDIO, ENMDC, ENTXD[3:0]), USB (USBD+, USBD−, USBVBUS), and system control (RSTI, CLKIN, PSTCLK).

Pin/Terminal Circuit Role Design Meaning
SDDATA[31:0] DDR/SDR SDRAM data bus 32-bit bidirectional data path supporting SSTL_2/SSTL_3 I/O standards; requires matched trace lengths and 45 Ω termination
SDADDR[12:0], SDBA[1:0] DDR/SDR SDRAM address & bank select 13-bit address + 2-bit bank address lines; driven synchronously with SDCLK for row/column activation
SDCLK[1:0], SDDQS[3:0] DDR clock & data strobe Differential SDCLK pair drives timing; SDDQS[3:0] are source-synchronous strobes for 4-byte-wide data capture
FBCS[5:0] FlexBus chip select outputs Six independent chip selects; FBCS0 configurable for boot ROM access with byte/word/longword width support
PCIAD[31:0] PCI address/data multiplexed bus 32-bit multiplexed address/data lines; used as non-muxed FlexBus address when PCI mode disabled
ENMDIO, ENMDC FEC serial management interface Open-drain MDIO/MDC signals compliant with IEEE 802.3 clause 22; require 1.5–10 kΩ pull-up resistors
USBD+, USBD− USB 2.0 differential data pair 90 Ω differential impedance required; routed on top layer over continuous ground plane with ≤ 200 mil stubs
RSTI Asynchronous active-low reset input Internally synchronized to CLKIN; minimum pulse width = 5 CLKIN cycles; initiates full hardware reset sequence

Key Features

Feature Design Value
ColdFire V4e Core with MMU Enables full pre-emptive RTOS and Linux kernel execution with virtual memory management and process isolation
Dual 10/100 Mbps FECs Each with dedicated 2-Kbyte TX/RX FIFOs and MII/7-wire interface support-eliminates external PHY buffering needs
Integrated USB 2.0 PHY Reduces BOM count and layout complexity; supports control/bulk/isochronous transfers without external transceiver
Optional Cryptography Accelerator Hardware offload for AES-128/192/256, DES/3DES, SHA-1/SHA-256, HMAC, and true random number generation
32-Kbyte System SRAM On-die low-latency memory arbitrated between XLB masters-ideal for critical real-time code or interrupt handlers
Flexible Clock Architecture Configurable PLL with 1:2 or 1:4 core-to-bus ratios enables deterministic timing across DDR, PCI, and FlexBus domains

Applications

Industrial Ethernet Gateway Secure Network Appliance

Use Scenario: Protocol translation between Modbus TCP and EtherNet/IP in factory automation systems.

IC Role / Device Role / Timing Role: Primary application processor executing real-time Linux, managing dual FECs for simultaneous network stacks, and running deterministic control loops via GP timers.

Use Value: Integrated MMU and dual FECs eliminate external switch ICs and reduce latency jitter below 50 µs for time-critical motion control synchronization.

Use Scenario: Firewall or VPN endpoint in small business edge routers requiring TLS acceleration and packet inspection.

IC Role / Device Role / Timing Role: Host processor running OpenWrt with cryptographic offload to dedicated accelerator module for IPsec ESP processing.

Use Value: Hardware AES/SHA-256 engine achieves >100 Mbps encrypted throughput while freeing CPU for deep packet inspection and QoS scheduling.

Medical Imaging Controller Telecom Baseband Processor

Use Scenario: Image acquisition and preprocessing in portable ultrasound devices using raw sensor data streams.

IC Role / Device Role / Timing Role: High-throughput data mover coordinating DDR SDRAM burst writes from PSC-linked ADCs and real-time FIR filtering via FPU.

Use Value: 32-Kbyte instruction/data caches + 266 MHz core sustain 1.2 GB/s sustained SDRAM bandwidth for 16-bit 40-MHz pixel pipelines.

Use Scenario: Channel bonding and framing in DSLAM line cards handling multiple ADSL2+ subscribers.

IC Role / Device Role / Timing Role: Communications subsystem controller managing four PSCs for G.hs/G.dmt framing, FEC error correction, and PCI backplane interfacing.

Use Value: Four independent PSCs with 512-byte FIFOs per channel enable concurrent TDM voice, ATM, and PTM data handling without DMA bottlenecks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8313EVRAGDB PowerPC e300 core @ 400 MHz; lacks integrated DDR controller (requires external memory controller); no built-in USB PHY Better suited for high-throughput packet forwarding but requires external PHY, SDRAM controller, and crypto co-processor Select when needing higher single-thread integer performance and PCIe interface, accepting increased board complexity
i.MX27ADS ARM926EJ-S core @ 400 MHz; includes LCD controller and camera interface; no PCI or FEC; lower DDR bandwidth Optimized for multimedia HMI and video encode/decode-not suitable for industrial Ethernet or PCI-based expansion Select for cost-sensitive human-interface applications where FEC, PCI, and hardware crypto are unnecessary

Compared with MPC8313EVRAGDB and i.MX27ADS, the MCF5475ZP200 uniquely combines ColdFire V4e deterministic real-time execution, dual FECs with integrated FIFOs, PCI 2.2 host capability, and optional crypto acceleration in a single 388-ball BGA-making it optimal for space-constrained, multi-protocol embedded gateways requiring Linux support and hardware security.

Availability

MCF5475ZP200 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure network appliances, medical imaging controllers, and telecom baseband processors requiring stable component supply and long-term lifecycle assurance.

Supply support for MCF5475ZP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5475ZP200 belongs to the ColdFire V4e microprocessor family, designed specifically for high-performance, real-time embedded applications requiring Linux-capable processing, multi-protocol connectivity (FEC/PCI/USB), and hardware-accelerated security.

FAQ

What is the maximum DDR SDRAM clock frequency supported by the MCF5475ZP200?

The MCF5475ZP200 supports DDR SDRAM operation up to 133 MHz, corresponding to a 266 MT/s data rate. This is achieved through its integrated DDR SDRAM controller with built-in initialization, refresh, and programmable drive strength for SSTL_2/SSTL_3 I/O standards. The controller supports up to four chip selects and addresses up to 1 GB of external memory. All timing parameters-including tRCD, tRP, and tRAS-are configurable via memory controller registers per JEDEC DDR specifications.

Does the MCF5475ZP200 include an integrated USB physical layer?

Yes, the MCF5475ZP200 includes a fully integrated USB 2.0 physical layer (PHY) supporting high-speed (480 Mbps) and full-speed (12 Mbps) operation. It provides dedicated USBD+ and USBD− pins with on-die termination and biasing, eliminating the need for an external transceiver. The USB controller supports one control endpoint and six programmable endpoints (interrupt, bulk, or isochronous), backed by 4 KB of shared endpoint FIFO RAM and 1 KB of descriptor RAM.

What voltage domains does the MCF5475ZP200 require, and how must they be sequenced during power-up?

The MCF5475ZP200 requires three distinct voltage domains: 1.5 V for core logic (IVDD/PLL VDD), 2.5 V for DDR SDRAM I/O (SD VDD), and 3.3 V for PCI, FlexBus, and general-purpose I/O (EVDD). Per Freescale MCF5475EC Rev. 4 Section 4.2.1, IVDD/PLL VDD and EVDD/SD VDD must track up to 0.9 V, then separate-IVDD must not exceed EVDD or SD VDD by more than 0.4 V at any time. All supplies must ramp with ≤1 µs rise time to avoid ESD clamp conduction.

Can the MCF5475ZP200 execute Linux, and what memory management features enable this?

Yes, the MCF5475ZP200 supports full Linux kernel execution due to its integrated Memory Management Unit (MMU) with separate 32-entry fully-associative instruction and data translation lookahead buffers. The MMU enables virtual memory addressing, process isolation, and demand-paged memory management-essential for POSIX-compliant OS environments. Combined with 32-Kbyte instruction and data caches and 266 MHz core performance, it delivers sufficient throughput for real-time Linux distributions such as MontaVista or Wind River Linux.

What debugging interfaces are available on the MCF5475ZP200?

The MCF5475ZP200 provides two standardized debugging interfaces: a ColdFire Background Debug Mode (BDM) port with PSTCLK and PSTDDATA[7:0] signals for real-time emulation and flash programming, and a JTAG/IEEE 1149.1 test access port supporting boundary scan, device identification, and debug halt control. Both interfaces are accessible via the 388-ball TEPBGA package and are documented in Sections 14 and 23 of the MCF5475EC datasheet.

MCF5475ZP200 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
388-BBGA
Series:
MCF547x
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.43V ~ 1.58V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5475ZP200 FAQ

1.How can I place an order for MCF5475ZP200 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5475ZP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5475ZP200 reliable?

The price and inventory of MCF5475ZP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5475ZP200 is usually 5 days.

3.What payment methods are accepted for MCF5475ZP200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5475ZP200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5475ZP200?

MCF5475ZP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5475ZP200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5475ZP200?

For technical support, including MCF5475ZP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5475ZP200 requirements.

6.How does Aetrix verify that MCF5475ZP200 is sourced from the original manufacturer or authorized distributors?

All MCF5475ZP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5475ZP200 meets industry standards.

7.What is the process for return or replacement of MCF5475ZP200?

All MCF5475ZP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5475ZP200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5475ZP200 part is unused and in its original packaging.

Return procedure for MCF5475ZP200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF5475ZP200 Tags

  • MCF5475ZP200
  • MCF5475ZP200 PDF
  • MCF5475ZP200 Datasheet
  • MCF5475ZP200 Specifications
  • MCF5475ZP200 Images
  • NXP Semiconductors
  • NXP Semiconductors MCF5475ZP200
  • Buy MCF5475ZP200
  • MCF5475ZP200 Price
  • MCF5475ZP200 Distributor
  • MCF5475ZP200 Supplier
  • MCF5475ZP200 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER