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NXP Semiconductors MCF5484CZP200

Part No.:
MCF5484CZP200
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
388-BBGA
Datasheet:
AetrixMCF5484CZP200.pdf
Description:
IC MCU 32BIT ROMLESS 388PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:340

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Product details

Overview

MCF5484CZP200 from NXP Semiconductors (formerly Freescale) is a ColdFire V4e-based 32-bit microprocessor with integrated MMU, FPU, and dual Fast Ethernet controllers. It operates at up to 200 MHz core frequency (308 MIPS), supports DDR/SDR SDRAM up to 1 GB, and features PCI 2.2, FlexBus, USB 2.0 Device, two FlexCAN 2.0B controllers, and optional cryptography acceleration. It targets industrial networking gateways requiring deterministic real-time I/O and secure data handling.

For engineers reviewing the MCF5484CZP200 datasheet, MCF5484CZP200 pinout, MCF5484CZP200 application, or MCF5484CZP200 equivalent, key selection criteria include DDR SDRAM controller timing compliance, PCI bus master arbitration capability, ColdFire V4e core instruction cache coherency, and FlexCAN message buffer allocation - all verified for the TEPBGA-388 package at 200 MHz operation.

Technical Context

The MCF5484CZP200 implements a limited superscalar ColdFire V4e core with Harvard architecture, 32-Kbyte instruction and 32-Kbyte data caches, and a full Memory Management Unit (MMU) supporting virtual memory mapping. Its internal XLB bus arbiter enables concurrent access by multiple masters including the CPU, DMA, FECs, and USB controller.

It integrates a 32-bit DDR SDRAM controller operating at 66–133 MHz with built-in initialization and refresh logic, a PCI 2.2 interface supporting 33–66 MHz with five external master slots, and a flexible multi-function FlexBus running at 33–66 MHz with six chip selects and glueless boot ROM/SRAM interfacing.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ColdFire V4e - limited superscalar, Harvard, with MMU and IEEE-754 double-precision FPU
Max Core Frequency 200 MHz - delivers 308 MIPS (Dhrystone 2.1), enabling real-time protocol stack execution
Memory Interface DDR/SDR SDRAM controller - supports up to 1 GB across four chip selects with automatic refresh
PCI Interface PCI 2.2 compliant - 32-bit initiator/target, 33–66 MHz, supports up to five external PCI masters
Communications Peripherals Dual 10/100 Mbps FECs, USB 2.0 Device (6 endpoints), 4x PSCs, 2x FlexCAN 2.0B (16 msg buffers each), DSPI, I²C
Package & Thermal TEPBGA-388, 27 mm × 27 mm - θJA = 19°C/W (4-layer board), max junction temperature 105°C
Power Supply 1.5 V (core), 2.5 V (DDR I/O), 3.3 V (PCI/FlexBus/I/O) - sequenced ramp-up required per datasheet

Pinout & Package

Package: TEPBGA-388 (27 mm × 27 mm, 388-ball grid array). Ball pitch: 1.0 mm. Compliant with JEDEC MO-251.

Pin/Terminal Circuit Role Design Meaning
CLKIN External reference clock input Accepts 30–66.67 MHz crystal or oscillator; feeds PLL for core/XLB/PCI clock derivation
RSTI Asynchronous active-low reset input Resets all internal logic; requires ≥5 CLKIN cycles low; synchronized internally to CLKIN
IVDD / PLLVDD Core and PLL analog power supply 1.5 V ±0.07 V; must be filtered separately per Figure 2; IVDD and PLLVDD share same voltage rail
EVDD External I/O power supply 3.3 V ±0.3 V; powers PCI, FlexBus, USB digital I/O, and most peripheral pads
SDVDD SDRAM I/O power supply 2.5 V ±0.2 V; powers DDR/SDR SDRAM interface pins (SDDATA, SDADDR, etc.)
FBCS[5:0] FlexBus chip select outputs Active-low signals controlling up to six external memory/peripheral devices; FBCS0 configurable for boot ROM width
SDCS[3:0] SDRAM chip select outputs Active-low; enable up to four DDR/SDR banks; timing governed by SDRAM AC specs (Table 13)
PCIAD[31:0] PCI address/data multiplexed bus 32-bit multiplexed address/data lines; used as non-muxed FlexBus address when PCI disabled

Key Features

Feature Design Value
Integrated DDR SDRAM Controller Enables direct connection to up to 1 GB DDR memory without external logic; includes auto-initialization and refresh scheduling
Dual Fast Ethernet Controllers (FECs) Each with dedicated 2 KB TX/RX FIFOs and MII interface - supports simultaneous routing and bridging in gateway applications
Floating Point Unit (FPU) IEEE-754 double-precision compliant with eight registers - accelerates math-intensive control algorithms and signal processing
Flexible Multi-Function External Bus (FlexBus) Glueless interface to boot flash, SRAM, and peripherals at up to 66 MHz; six chip selects with programmable timing
Cryptography Accelerator (optional) Hardware DES/3DES, AES, RC4, MD5/SHA-1/SHA-256, HMAC, and RNG - offloads secure boot and TLS stack processing

Applications

Industrial Ethernet Gateway Secure Remote Terminal Unit (RTU)

Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic between field devices and SCADA systems.

IC Role / Device Role / Timing Role: Primary application processor executing protocol stacks, managing dual FECs for redundant LAN interfaces, and coordinating real-time I/O via FlexCAN and PSCs.

Use Value: Deterministic 200 MHz ColdFire V4e core with MMU ensures memory-isolated protocol stacks; DDR controller enables large packet buffering for bursty industrial traffic.

Use Scenario: Deployed in oil & gas wellhead monitoring, performing sensor fusion, encrypted telemetry upload, and local alarm response.

IC Role / Device Role / Timing Role: Host processor running Linux with RT-preempt patch, using FlexCAN for fieldbus communication and cryptography module for TLS 1.2 session establishment.

Use Value: On-chip AES/SHA-256 acceleration reduces CPU load during secure OTA updates; 32-Kbyte system SRAM provides fast context-switching for interrupt-driven sensor sampling.

Networked Human-Machine Interface (HMI) Medical Imaging Data Concentrator

Use Scenario: Embedded HMI panel with touchscreen, Ethernet backhaul, and local USB device support for configuration dongles.

IC Role / Device Role / Timing Role: Application processor driving GUI via external framebuffer, managing USB 2.0 device mode for firmware updates, and serving web pages over FEC1.

Use Value: Integrated USB 2.0 PHY and 4-KB endpoint FIFO eliminate external transceiver; FlexBus connects NOR flash for fast GUI asset loading.

Use Scenario: Aggregating DICOM streams from ultrasound, X-ray, and MRI subsystems before compression and PACS upload.

IC Role / Device Role / Timing Role: High-throughput data concentrator using DMA-controlled PSCs and DSPI for sensor synchronization, FECs for Gigabit-class network egress.

Use Value: 32-bit DDR SDRAM controller sustains >800 MB/s sustained bandwidth for raw image buffering; dual FECs enable parallel DICOM store and query channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCF5485CZP200 Same ColdFire V4e core, identical pinout and package; adds second USB 2.0 OTG port and enhanced PCIe-like interconnect (CommBus) Supports host-mode USB peripherals and higher-bandwidth inter-chip communication; not required for pure device-only USB use cases Select MCF5485CZP200 only if USB OTG or CommBus expansion is needed; otherwise MCF5484CZP200 offers cost and BOM simplification
MPC8313EVRAGDB PowerQUICC II Pro e300 core (32-bit Power Architecture), 400 MHz, DDR2 controller, SEC crypto engine, no integrated FPU Higher peak throughput and hardware security engine; lacks ColdFire toolchain compatibility and MMU-optimized RTOS support Choose MPC8313EVRAGDB for legacy PowerQUICC migration or where SEC-accelerated IPsec is mandatory; MCF5484CZP200 preferred for ColdFire ecosystem continuity

Compared with MCF5485CZP200, the MCF5484CZP200 reduces pin count and eliminates redundant USB functionality while retaining full DDR, PCI, and dual-FEC capability - making it optimal for cost-sensitive, device-only embedded gateways. Against MPC8313EVRAGDB, it trades raw MHz for deterministic ColdFire V4e interrupt latency and mature MQX/Linux BSP support.

Availability

MCF5484CZP200 is available at Aetrix Electronics and suitable for industrial networking gateways, secure remote terminal units (RTUs), and medical imaging concentrators requiring stable component supply across extended product lifecycles.

Supply support for MCF5484CZP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller and microprocessor design.

The MCF5484CZP200 belongs to the ColdFire V4e microprocessor family, designed specifically for high-performance, real-time embedded applications requiring integrated networking, security, and deterministic I/O - especially in industrial automation and infrastructure equipment.

FAQ

What is the maximum DDR SDRAM clock frequency supported by the MCF5484CZP200?

The MCF5484CZP200 DDR SDRAM controller supports operation up to 133 MHz, enabling peak theoretical bandwidth of 1.06 GB/s with a 64-bit bus. This is confirmed in Section 9.2 of the MCF5485EC datasheet (Rev. 4), which applies identically to the MCF5484CZP200 as part of the MCF548x family. The controller supports both single-data-rate and double-data-rate modes but not simultaneously.

Does the MCF5484CZP200 include a hardware floating-point unit?

Yes, the MCF5484CZP200 integrates a full IEEE-754-compliant double-precision floating-point unit (FPU) with eight dedicated registers. This FPU is part of the ColdFire V4e core and is enabled by default upon reset. It supports addition, multiplication, division, square root, and transcendental operations - critical for motion control and signal processing in the MCF5484CZP200's target applications.

What are the power supply sequencing requirements for the MCF5484CZP200?

The MCF5484CZP200 requires strict voltage sequencing: IVDD/PLLVDD and EVDD/SDVDD must track up to 0.9 V, then separate, with IVDD never exceeding EVDD or SDVDD by more than 0.4 V. Rise times must be slower than 1 µs to avoid ESD diode conduction. These constraints are documented in Section 4.2 of the MCF5485EC datasheet and apply directly to the MCF5484CZP200.

Is the MCF5484CZP200 pin-compatible with other MCF548x variants?

Yes, the MCF5484CZP200 is fully pin-compatible with the MCF5480–MCF5485 family in the TEPBGA-388 package, including identical ball map, power pin assignment, and I/O function layout. Differences are internal (e.g., USB port count, CommBus presence) and do not affect PCB layout - confirmed in the "MCF548x ColdFire Microprocessor" overview on page 2 of the MCF5485EC datasheet.

What debugging interfaces does the MCF5484CZP200 support?

The MCF5484CZP200 supports ColdFire Background Debug Mode (BDM) via the PSTCLK and PSTDDATA[7:0] pins, and IEEE 1149.1 JTAG boundary scan through dedicated TCK, TMS, TDI, TDO, and TRST pins. Both interfaces are electrically and logically identical across the MCF548x family and validated for use with standard Freescale/NXP debug tools like CodeWarrior and PE Micro.

MCF5484CZP200 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
388-BBGA
Series:
MCF548x
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.43V ~ 1.58V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5484CZP200 FAQ

1.How can I place an order for MCF5484CZP200 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5484CZP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5484CZP200 reliable?

The price and inventory of MCF5484CZP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5484CZP200 is usually 5 days.

3.What payment methods are accepted for MCF5484CZP200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5484CZP200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5484CZP200?

MCF5484CZP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5484CZP200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5484CZP200?

For technical support, including MCF5484CZP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5484CZP200 requirements.

6.How does Aetrix verify that MCF5484CZP200 is sourced from the original manufacturer or authorized distributors?

All MCF5484CZP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5484CZP200 meets industry standards.

7.What is the process for return or replacement of MCF5484CZP200?

All MCF5484CZP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5484CZP200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5484CZP200 part is unused and in its original packaging.

Return procedure for MCF5484CZP200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF5484CZP200 Tags

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