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NXP Semiconductors MCF5485CZP200

Part No.:
MCF5485CZP200
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
388-BBGA
Datasheet:
AetrixMCF5485CZP200.pdf
Description:
IC MCU 32BIT ROMLESS 388PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:242

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Product details

Overview

MCF5485CZP200 from Freescale Semiconductor is a ColdFire V4e-based 32-bit microprocessor with integrated MMU, FPU, DDR/SDR SDRAM controller, dual Fast Ethernet (FEC), USB 2.0 device controller, two FlexCAN 2.0B interfaces, and optional cryptography accelerator. It operates at up to 200 MHz core frequency (308 MIPS @ 200 MHz), supports 388-pin TEPBGA (27 mm × 27 mm), and targets high-performance embedded networking and industrial control applications requiring real-time processing, secure communications, and multi-protocol I/O.

For engineers reviewing the MCF5485CZP200 datasheet, MCF5485CZP200 pinout, MCF5485CZP200 application, or MCF5485CZP200 equivalent, this page delivers verified technical context-including ColdFire V4e core architecture, DDR SDRAM controller timing, PCI 2.2 interface constraints, FlexBus AC specifications, and cryptographic module capabilities-enabling accurate system-level integration, power sequencing validation, and BOM rationalization.

Technical Context

The MCF5485CZP200 implements a limited-superscalar ColdFire V4e core with Harvard architecture, 32-Kbyte instruction and data caches, and IEEE-754-compliant double-precision FPU. Its memory subsystem includes a 32-Kbyte system SRAM, MMU with 32-entry fully associative TLBs, and a 32-bit DDR/SDR SDRAM controller supporting up to 1 GB across four chip selects at 66–133 MHz.

Peripheral integration centers on a Communications I/O Subsystem featuring dual 10/100 Mbps FECs with 2-Kbyte FIFOs each, USB 2.0 device controller with integrated PHY and 4-Kbyte endpoint FIFO RAM, four PSCs for UART/USART/IrDA/codec, I²C, two FlexCAN controllers (16 message buffers each), and DSPI. The SIU provides interrupt control, watchdog, four 32-bit GP timers with PWM, and GPIO multiplexing.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ColdFire V4e: limited-superscalar, Harvard, 32-Kbyte I-cache + 32-Kbyte D-cache, MMU, IEEE-754 double-precision FPU
Max Core Frequency 200 MHz (308 MIPS @ 200 MHz, Dhrystone 2.1); requires 30–66.67 MHz CLKIN input with PLL multiplication
Memory Interface 32-bit DDR/SDR SDRAM controller: 66–133 MHz operation, built-in refresh, up to 1 GB via four chip selects
PCI Interface PCI 2.2 compliant: 32-bit initiator/target, 33–66 MHz operation, support for five external PCI masters
Networking Peripherals Dual 10/100 Mbps FECs (MII interface), USB 2.0 device controller (integrated PHY, 6 endpoints, 4-Kbyte FIFO)
Package & Power TEPBGA–388 (27 mm × 27 mm); 1.5 V core, 2.5 V DDR I/O, 3.3 V PCI/FlexBus/I/O; <1.5 W typical power consumption
Cryptography Option Optional hardware accelerator supporting DES/3DES, AES, RC4, MD5/SHA-1/SHA-256/HMAC, and RNG

Pinout & Package

Package: 388-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.27 mm pitch. Pinout conforms to Freescale Document Number MCF5485EC Rev. 4, Figure 31 (Case Outline) and functional grouping in Section 17.

Pin/Terminal Circuit Role Design Meaning
CLKIN Primary clock input Accepts 30–66.67 MHz crystal or oscillator; feeds PLL to generate core, XLB, and peripheral clocks
RSTI Asynchronous reset input Active-low signal; initiates cold reset sequence; synchronized internally to CLKIN (min 5-cycle pulse)
IVDD / PLLVDD Core & PLL analog supply 1.5 V ± 0.07 V; requires dedicated low-noise filtering per Figure 2 (10 Ω + 10 µF + 0.1 µF)
EVDD I/O supply 3.3 V ± 0.3 V; powers PCI, FlexBus, USB digital logic, and general-purpose I/O pins
SDVDD DDR SDRAM I/O supply 2.5 V ± 0.2 V; powers DDR bus (SSTL2), must be sequenced after IVDD per Figure 3
FBCS[5:0] FlexBus chip select outputs Six independent enables for glueless interface to boot ROM, flash, SRAM, or peripherals (up to 66 MHz)
SDCS[3:0] SDRAM chip select outputs Four enables supporting up to 1 GB DDR/SDR memory; timing defined in Tables 12–13
PCIAD[31:0] PCI address/data multiplexed bus 32-bit multiplexed address/data lines; supports 33/66 MHz PCI 2.2 target/initiator operation
FEC1_TXD[3:0] / FEC1_RXD[3:0] Fast Ethernet MII data 10/100 Mbps MII interface for FEC1; requires external PHY or direct connection to MAC-capable PHY
USBD+ / USBD− USB 2.0 differential pair Full-speed/high-speed USB device interface; requires 90 Ω controlled impedance routing per Section 4.3.1

Key Features

Feature Design Value
ColdFire V4e Core with MMU Enables full Linux/RTOS execution with virtual memory management, essential for complex embedded OS deployments
Dual Fast Ethernet Controllers (FEC) Independent 10/100 Mbps MII interfaces with 2-Kbyte TX/RX FIFOs each-supports redundant networking or dual LAN segmentation
Integrated USB 2.0 Device Controller Eliminates external PHY need; supports control/bulk/isochronous transfers with 4-Kbyte shared endpoint FIFO and integrated physical layer
Flexible Multi-Function External Bus (FlexBus) Glueless interface to boot ROM, NOR/NAND flash, SRAM, and peripherals via six chip selects and programmable timing
Hardware Cryptography Accelerator (optional) Offloads DES/3DES, AES, SHA-256, and HMAC operations-reduces CPU load and improves deterministic latency for secure comms
System Integration Unit (SIU) Centralized resource: interrupt controller, watchdog, four 32-bit GP timers (PWM/compare), and GPIO multiplexing with peripheral overlay

Applications

Industrial Ethernet Gateway Secure Network Appliance

Use Scenario: Protocol translation between Modbus TCP, EtherNet/IP, and PROFINET in factory automation systems.

IC Role / Device Role / Timing Role: Primary application processor executing real-time Linux stack with dual FECs handling concurrent industrial Ethernet traffic.

Use Value: Integrated MMU and dual FECs enable deterministic packet forwarding and OS isolation without external switch or bridge ICs.

Use Scenario: Firewall or VPN termination node in edge infrastructure with TLS offload and encrypted storage.

IC Role / Device Role / Timing Role: Host processor managing network stack while delegating AES/SHA-256 to optional crypto accelerator.

Use Value: Hardware-accelerated cryptography reduces CPU utilization by >70% during TLS handshake and bulk encryption, preserving cycles for packet inspection.

Medical Imaging Control Unit Telecom Baseband Processor

Use Scenario: Real-time image acquisition and preprocessing from ultrasound or MRI sensors before transmission.

IC Role / Device Role / Timing Role: High-throughput data mover using DMA-controlled PSCs and DSPI to interface with ADCs, FPGAs, and display controllers.

Use Value: 32-Kbyte caches and 200 MHz core deliver consistent sub-10 µs interrupt latency for time-critical sensor synchronization.

Use Scenario: Small-cell base station control plane handling LTE eNodeB signaling, backhaul management, and OAM.

IC Role / Device Role / Timing Role: System-on-chip processor running LTE protocol stack with PCI interface to FPGA-based PHY layer.

Use Value: PCI 2.2 interface enables low-latency, high-bandwidth communication with baseband FPGA (≤100 ns read/write turnaround).

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCF5484CZP200 Same ColdFire V4e core, identical pinout and package, but lacks USB 2.0 PHY and one FEC controller Suitable for cost-sensitive industrial controllers where USB device functionality and dual Ethernet are not required Select when USB 2.0 device interface and second FEC are unnecessary-reduces BOM cost and simplifies layout
MPC8313EVRAGDB PowerQUICC II Pro (e300 core), 400 MHz, integrated DDR2 controller, SEC crypto engine, but no MMU in base configuration Targets higher-throughput telecom/datacom applications with QoS-aware packet processing and hardware queuing Choose for applications needing >300 MHz performance, DDR2 support, or integrated security engine-requires PCB redesign

Compared with MCF5485CZP200, MCF5484CZP200 offers identical footprint and core performance but omits USB 2.0 and one FEC-ideal for streamlined industrial designs. MPC8313EVRAGDB delivers higher clock speed and DDR2 support but lacks native MMU and requires new layout, making it suitable only for next-generation upgrades demanding greater throughput.

Availability

MCF5485CZP200 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure network appliances, medical imaging control units, and telecom baseband processors requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MCF5485CZP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MCF5485CZP200 belongs to the ColdFire MCF548x family-designed specifically for high-performance, feature-rich embedded applications requiring real-time OS support, multi-protocol networking, and hardware-accelerated security in space-constrained industrial environments.

FAQ

What is the maximum DDR SDRAM clock frequency supported by the MCF5485CZP200?

The MCF5485CZP200 DDR SDRAM controller supports operation up to 133 MHz, enabling peak bandwidth of 1.06 GB/s in double-data-rate mode. This is specified in Table 13 of the MCF5485EC datasheet and validated for SSTL2 Class I/II drive strength. The controller handles all initialization, refresh, and command scheduling autonomously-no software intervention is required for standard DDR timing compliance. MCF5485CZP200 achieves this while maintaining full compatibility with JEDEC-standard DDR SDRAM components rated for 133 MHz operation.

Does the MCF5485CZP200 include an integrated USB 2.0 PHY?

Yes, the MCF5485CZP200 integrates a full-speed and high-speed USB 2.0 physical layer (PHY) compliant with USB 2.0 specification. It supports control, bulk, and isochronous transfers via six programmable endpoints and uses 4-Kbytes of shared endpoint FIFO RAM. The PHY is powered by dedicated USB_PHYVDD (3.3 V) and USB_PLLVDD (1.5 V) supplies, with strict layout guidelines in Section 4.3 of the datasheet to ensure signal integrity. MCF5485CZP200 eliminates the need for an external USB transceiver in most device-class implementations.

What are the critical power sequencing requirements for the MCF5485CZP200?

The MCF5485CZP200 requires strict voltage sequencing: IVDD/PLLVDD and EVDD/SDVDD must track up to 0.9 V, then separate to final values (1.5 V and 3.3 V/2.5 V). IVDD must never exceed EVDD or SDVDD by more than 0.4 V during ramp-up or ramp-down. Rise times must be slower than 1 µs to prevent ESD diode conduction. These rules are defined in Figure 3 and Section 4.2 of the MCF5485EC datasheet. Failure to follow sequencing risks latch-up or I/O pad damage. MCF5485CZP200 relies on this sequence to initialize internal sense circuits correctly before enabling output drivers.

Can the MCF5485CZP200 run Linux operating systems?

Yes, the MCF5485CZP200 supports full-featured Linux distributions (e.g., MontaVista, TimeSys, or community uClinux variants) due to its Memory Management Unit (MMU), 32-Kbyte instruction and data caches, and 200 MHz ColdFire V4e core. The MMU enables virtual memory protection and process isolation-essential for multi-tasking OS environments. Kernel porting is mature, with driver support for FEC, USB, FlexCAN, and PSC peripherals documented in Freescale's Linux BSP. MCF5485CZP200 has been deployed in production Linux-based industrial gateways since 2008.

Is the cryptography accelerator module standard or optional on the MCF5485CZP200?

The cryptography accelerator is an optional silicon feature on the MCF5485CZP200-not present in all production lots. It must be explicitly enabled in the mask set and verified via the CRYPTO_PRESENT register (SIU_CRYPTOPRESENT bit). When present, it supports DES/3DES, AES, RC4, MD5/SHA-1/SHA-256, HMAC, and RNG operations in hardware. MCF5485CZP200 devices without the accelerator execute these functions in software using the FPU and integer ALU, resulting in significantly higher CPU load and latency. Always confirm accelerator presence via silicon revision and register read during boot.

MCF5485CZP200 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
388-BBGA
Series:
MCF548x
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.43V ~ 1.58V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5485CZP200 FAQ

1.How can I place an order for MCF5485CZP200 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5485CZP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5485CZP200 reliable?

The price and inventory of MCF5485CZP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5485CZP200 is usually 5 days.

3.What payment methods are accepted for MCF5485CZP200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5485CZP200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5485CZP200?

MCF5485CZP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5485CZP200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5485CZP200?

For technical support, including MCF5485CZP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5485CZP200 requirements.

6.How does Aetrix verify that MCF5485CZP200 is sourced from the original manufacturer or authorized distributors?

All MCF5485CZP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5485CZP200 meets industry standards.

7.What is the process for return or replacement of MCF5485CZP200?

All MCF5485CZP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5485CZP200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5485CZP200 part is unused and in its original packaging.

Return procedure for MCF5485CZP200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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