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NXP Semiconductors MCIMX233DJM4B

Part No.:
MCIMX233DJM4B
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
169-LFBGA
Datasheet:
AetrixMCIMX233DJM4B.pdf
Description:
IC MPU I.MX23 454MHZ 169MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,936

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Product details

Overview

MCIMX233DJM4B from NXP is an ARM926EJ-S™-based 454 MHz multimedia applications processor with integrated DC-DC power management, stereo analog audio ADC/DAC + headphone amplifier, 1.5 W mono speaker amplifier, 12-bit LRADC, and LCDIF supporting 24-bit VGA (640×480) displays - deployed in portable media players and graphical HMI panels.

For engineers reviewing the MCIMX233DJM4B datasheet, MCIMX233DJM4B pinout, MCIMX233DJM4B application, or MCIMX233DJM4B equivalent, key selection considerations include its 169-pin MAPBGA package, -10°C to +70°C industrial temperature range, integrated NAND ECC (20-bit BCH), PXP graphics pipeline, and dual I2S interface for multi-audio-path designs.

Technical Context

The MCIMX233DJM4B implements a single-core ARM926EJ-S CPU running at up to 454 MHz with 16 KB instruction and 16 KB data L1 cache, booting directly from SLC/MLC/managed NAND via hardware-accelerated 20-bit BCH or 8-bit Reed-Solomon error correction. It integrates a pixel processing pipeline (PXP) for hardware-accelerated display frame pre-processing including scaling, alpha blending, rotation, and color space conversion.

Its power architecture includes a multi-channel DC-DC converter supporting Li-Ion battery input (3.0–4.2 V), USB/wall adapter 5 V direct input, on-chip battery charging, and four independent low-dropout regulators (LDOs). The device features two I2S interfaces, two UARTs (one debug + one application), and a 128-pin-compatible subset of peripherals versus the full 169-pin feature set - though MCIMX233DJM4B itself uses the 169-pin MAPBGA.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM926EJ-S™ @ 454 MHz - enables real-time multimedia decoding and GUI rendering without external co-processors
Internal Memory32 KB SRAM + 64 KB ROM - provides fast boot code execution and minimal RAM footprint for bootloader and firmware initialization
NAND SupportHardware ECC: 20-bit BCH or 8-bit Reed-Solomon - ensures reliable boot and storage integrity for consumer-grade NAND flash
Display InterfaceLCDIF with 24-bit parallel mode - supports VGA-resolution (640×480) TFT panels with RGB888 timing for rich UIs
Audio InterfacesDual I2S + S/PDIF Tx + stereo ADC/DAC + 1.5 W mono amp - enables simultaneous playback, recording, and speaker output in compact audio systems
Power InputSingle Li-Ion (3.0–4.2 V) or 5 V USB/wall - eliminates need for external PMIC and simplifies power tree design
Temperature Range-10°C to +70°C - qualified for industrial and consumer portable equipment operating in non-automotive environments

Pinout & Package

MCIMX233DJM4B is housed in a 169-ball MAPBGA package with 0.8 mm ball pitch, designed for high-density PCB layouts requiring full peripheral access. Pin assignments are defined in NXP document IMX233RM (i.MX233 Reference Manual), Rev. 4, Section 4.2 "Signal Descriptions".

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_3V3I/O supply railSupplies 3.3 V to all general-purpose I/O banks - must be decoupled per NXP layout guidelines
VDDA_3V3Analog supplyProvides clean 3.3 V to ADC/DAC and audio amplifiers - requires separate filtering from digital rails
USB_DP / USB_DMUSB 2.0 PHY differential pairIntegrated high-speed USB host/device transceiver - no external PHY required for basic enumeration
LCD_D0–LCD_D23RGB888 data bus24-bit parallel LCD interface supporting VGA resolution - enables direct connection to TFT modules without timing bridge ICs
SDA / SCLI²C bus signalsTwo-wire interface for EEPROM, touch controller, or PMIC configuration - supports standard/fast-mode speeds

Key Features

FeatureDesign Value
Pixel Processing Pipeline (PXP)Hardware-accelerated image post-processing (scaling, alpha blending, rotation) reduces CPU load and memory bandwidth for GUI rendering
Integrated DC-DC + LDOsFour-channel DC-DC plus four LDOs manage entire system power - eliminates discrete PMIC and cuts BOM count by ≥5 components
Boot-from-NAND with BCHDirect boot from raw NAND using 20-bit BCH ECC - removes need for external boot ROM or SPI flash in cost-sensitive designs
Touchscreen-Ready LCDIFIntegrated resistive touchscreen controller with 6-channel 12-bit LRADC - supports 4-wire analog touch panels without external ADC
Dual I2S + S/PDIFSimultaneous stereo audio playback (I2S), recording (I2S), and digital coaxial output (S/PDIF) - enables multi-format audio I/O in single SoC

Applications

Portable Media PlayersGraphical Remote Controls

Use Scenario: Battery-powered handheld devices playing MP3/WMA files with local storage and OLED/LCD display.

IC Role / Device Role / Timing Role: Main applications processor handling audio decode, file system, UI rendering, and display timing via LCDIF and PXP.

Use Value: Integrated stereo DAC, headphone amp, and 1.5 W speaker driver eliminate external audio codecs and amplifiers - reducing total component count by ≥4.

Use Scenario: IR/RF remotes with color TFT screens, touch navigation, and voice feedback for smart home hubs.

IC Role / Device Role / Timing Role: System-on-chip managing touch input (LRADC), display refresh (LCDIF), audio prompt playback (I2S), and wireless comms (UART/USB).

Use Value: On-chip 12-bit LRADC and resistive touch support enable precise 4-wire touch detection without external controller - cutting layer count and BOM cost.

Industrial HMI PanelseBook Readers

Use Scenario: Factory-floor operator interfaces with monochrome or grayscale LCDs, pushbutton/touch input, and serial connectivity.

IC Role / Device Role / Timing Role: Real-time controller executing deterministic UI updates, reading GPIO inputs, and driving segmented or dot-matrix displays.

Use Value: Dual UARTs (debug + application) and 32 KB SRAM allow robust firmware operation with local logging and field-upgradable code - no external RAM required.

Use Scenario: E-ink-based readers with page-turn buttons, SD card storage, and low-power sleep modes between page flips.

IC Role / Device Role / Timing Role: Low-power applications processor managing e-ink waveform timing, SDIO storage, button interrupts, and battery monitoring (via LRADC).

Use Value: Integrated Li-Ion charger and silicon temperature sensor enable accurate battery state-of-charge estimation and thermal throttling - extending usable runtime by ~12% vs discrete solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multimedia applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCIMX233CJM4CSame 169-ball MAPBGA package and feature set, but rated for -40°C to +85°C extended temperature rangeSuitable for automotive cabin modules or outdoor industrial enclosures requiring wider thermal toleranceSelect MCIMX233CJM4C when ambient operating temperature exceeds +70°C or falls below -10°C
i.MX283 (MCIMX283CVM4B)ARM9 @ 454 MHz, but adds security engine (AES-128, SHA-1, OTP), enhanced USB OTG, and improved NAND ECC (up to 40-bit)Better suited for secure boot, encrypted content delivery, and higher-reliability NAND storage in medical or payment terminalsChoose i.MX283 when cryptographic acceleration or stronger NAND reliability is mandatory - not a drop-in replacement due to different pinout and power sequencing

Compared with MCIMX233DJM4B, MCIMX233CJM4C offers identical functionality with extended temperature qualification, while i.MX283 adds security and NAND robustness at the cost of higher BOM complexity and non-interchangeable packaging - making MCIMX233DJM4B optimal for cost-sensitive, thermally moderate portable media and HMI designs.

Availability

MCIMX233DJM4B is available at Aetrix Electronics and suitable for portable media players, graphical remote control devices, and industrial HMI panels requiring stable component supply across long-lifecycle production programs.

Supply support for MCIMX233DJM4B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The i.MX233 product line delivers cost-optimized ARM9-based SoCs targeting battery-powered consumer and industrial devices needing integrated power, audio, display, and NAND boot - with emphasis on BOM reduction and rapid GUI deployment.

FAQ

What is the maximum operating frequency of the MCIMX233DJM4B?

The MCIMX233DJM4B features an ARM926EJ-S™ core rated for operation up to 454 MHz under specified voltage and temperature conditions. This frequency is achieved with 1.2 V core supply and validated across the -10°C to +70°C industrial temperature range. The MCIMX233DJM4B does not support dynamic frequency scaling beyond this fixed maximum, and sustained operation at 454 MHz requires adherence to NXP's thermal design guidelines in IMX233RM Section 5.3.

Does the MCIMX233DJM4B support booting directly from NAND flash?

Yes, the MCIMX233DJM4B supports direct boot from SLC, MLC, and managed NAND devices using on-chip hardware ECC engines - configurable for either 20-bit BCH or 8-bit Reed-Solomon correction. Boot ROM firmware validates NAND pages during startup, enabling reliable cold-boot without external boot ROM or SPI flash. This capability is confirmed in the MCIMX233DJM4B reference manual (IMX233RM Rev. 4, Section 11.4.1) and applies specifically to the MCIMX233DJM4B variant.

What audio interfaces are integrated into the MCIMX233DJM4B?

The MCIMX233DJM4B integrates stereo analog audio ADC/DAC with headphone amplifier, a 1.5 W mono Class-D speaker amplifier, two I2S interfaces, S/PDIF transmitter, and a 12-bit low-resolution ADC (LRADC) for touch and auxiliary analog sensing. These interfaces operate concurrently - for example, I2S0 can drive headphones while I2S1 handles microphone input, and S/PDIF outputs digital audio to external receivers - all without external codec ICs.

Is the MCIMX233DJM4B pin-compatible with other i.MX233 variants like MCIMX233DAG4C?

No, the MCIMX233DJM4B is not pin-compatible with MCIMX233DAG4C. MCIMX233DJM4B uses a 169-ball MAPBGA package, while MCIMX233DAG4C uses a 128-lead LQFP package with significantly reduced peripheral availability - including only one I2S interface, no mono speaker amplifier, and fewer UARTs and ADC channels. The two packages have entirely different pinouts, land patterns, and thermal profiles, requiring distinct PCB designs.

What display resolutions does the MCIMX233DJM4B's LCDIF support?

The MCIMX233DJM4B's LCD interface (LCDIF) supports up to 24-bit-per-pixel VGA resolution (640 × 480) in parallel RGB888 mode, as well as 8-bit serial interfaces for smaller displays. It includes hardware timing generators compliant with common TFT panel requirements and supports active matrix addressing with programmable polarity inversion. The LCDIF does not support HDMI, LVDS, or MIPI DSI outputs - external bridge ICs are required for those interfaces.

MCIMX233DJM4B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
169-LFBGA
Series:
i.MX23
Packaging:
Bulk
Product Status:
Obsolete
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
-
SATA:
-
USB:
USB 2.0 + PHY (1)
Voltage - I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Supplier Device Package:
169-MAPBGA (11x11)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

MCIMX233DJM4B FAQ

1.How can I place an order for MCIMX233DJM4B through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX233DJM4B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX233DJM4B reliable?

The price and inventory of MCIMX233DJM4B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX233DJM4B is usually 5 days.

3.What payment methods are accepted for MCIMX233DJM4B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX233DJM4B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX233DJM4B?

MCIMX233DJM4B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX233DJM4B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX233DJM4B?

For technical support, including MCIMX233DJM4B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX233DJM4B requirements.

6.How does Aetrix verify that MCIMX233DJM4B is sourced from the original manufacturer or authorized distributors?

All MCIMX233DJM4B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX233DJM4B meets industry standards.

7.What is the process for return or replacement of MCIMX233DJM4B?

All MCIMX233DJM4B units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX233DJM4B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX233DJM4B part is unused and in its original packaging.

Return procedure for MCIMX233DJM4B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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