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NXP Semiconductors MCIMX233DJM4C

Part No.:
MCIMX233DJM4C
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
169-LFBGA
Datasheet:
AetrixMCIMX233DJM4C.pdf
Description:
IC MPU I.MX23 454MHZ 169MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,459

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Product details

Overview

MCIMX233DJM4C from NXP is a highly integrated ARM926EJ-S-based applications processor targeting cost-sensitive, low-power embedded systems. It features a 454 MHz CPU core, 128 KB on-chip SRAM, 16-bit DDR2/DDR3/LPDDR2 memory interface, dual USB 2.0 OTG controllers with PHY, and hardware-accelerated 2D graphics for HMI display control in industrial HMIs and portable medical devices.

For engineers reviewing the MCIMX233DJM4C datasheet, MCIMX233DJM4C pinout, MCIMX233DJM4C application, or MCIMX233DJM4C equivalent, key selection criteria include its single-core ARM9 architecture, 128 KB embedded SRAM, 16-bit external memory bus, dual USB OTG support, and qualification for industrial temperature operation (–40°C to +85°C).

Technical Context

The MCIMX233DJM4C implements an ARM926EJ-S core with Jazelle Java acceleration and Thumb-2 instruction set support, paired with tightly coupled 128 KB SRAM for deterministic real-time execution. Its memory subsystem supports 16-bit DDR2/DDR3/LPDDR2 at up to 200 MHz clock rate (400 MT/s), enabling efficient data throughput for display and audio buffers without external SDRAM complexity.

Peripheral integration includes two USB 2.0 OTG controllers with integrated PHYs, four UARTs, three SPI interfaces, two I²C buses, a 10/100 Ethernet MAC, and a dedicated LCD controller supporting up to 1024×768 resolution. All peripherals are managed via a centralized clock gating and power domain architecture to minimize active and standby power consumption.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM926EJ-S @ 454 MHz - delivers deterministic real-time response for industrial control loops and UI rendering.
Embedded SRAM 128 KB on-die SRAM - eliminates need for external SRAM in boot code and critical ISR execution paths.
Memory Interface 16-bit DDR2/DDR3/LPDDR2 @ 200 MHz - supports compact, low-cost memory subsystems with ≤256 MB capacity.
USB 2 × USB 2.0 OTG with integrated PHY - enables host/peripheral mode switching without external transceivers.
Ethernet 1 × 10/100 Mbit/s MAC - provides wired connectivity for industrial telemetry and firmware updates.
Display Support LCD controller with RGB/TFT interface up to 1024×768 - drives standalone color displays without GPU offload.
Operating Temp –40°C to +85°C - qualified for uncontrolled industrial environments including factory automation and remote monitoring.

Pinout & Package

MCIMX233DJM4C is housed in a 208-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment follows NXP's standardized i.MX233 ball-out mapping optimized for signal integrity and thermal dissipation in space-constrained PCB layouts.

Pin/Terminal Circuit Role Design Meaning
VDDIO I/O supply rail 3.3 V tolerant; powers all digital I/O banks independently of core voltage.
VDDA Analog supply 3.3 V analog reference for ADC and USB PHY; requires local filtering for noise immunity.
USBOTG1_DP / USBOTG1_DM USB 2.0 differential pair Full-speed USB OTG port 1; internally terminated; no external resistors required.
ENET_MDIO / ENET_MDC PHY management interface Provides IEEE 802.3-compliant MDIO/MDC access to external Ethernet PHY registers.
LCDC_D[23:0] RGB parallel display bus 24-bit pixel data output supporting 16.7M-color TFT panels at ≤60 Hz refresh.
BOOT_MODE[1:0] Boot configuration pins Determines boot source (NAND, SD, SPI NOR) at power-on reset; pulled high/low via external resistors.

Key Features

Feature Design Value
Integrated LCD Controller Supports RGB, YUV, and serial LVDS outputs; enables direct panel driving without external timing ICs.
Dual USB OTG with PHY Reduces BOM count by eliminating two external USB transceivers and associated passive components.
Hardware AES-128 Engine Accelerates secure boot and firmware authentication in <100 µs per 128-bit block, improving boot time security.
On-Chip Power Management Unit (PMU) Provides dynamic voltage scaling and multiple low-power states (WAIT, DOZE, STOP) controlled via software.
10-bit ADC with Touch Support Two independent 10-bit SAR ADCs (12-channel total); one includes dedicated touch-screen controller logic.

Applications

Industrial HMI Terminal Portable Medical Monitor

Use Scenario: Standalone touchscreen panel in factory floor control stations requiring reliable operation under EMI-rich conditions.

IC Role / Device Role / Timing Role: Main applications processor executing Linux-based UI stack and real-time sensor polling.

Use Value: Integrated LCD controller and 128 KB SRAM reduce latency in display updates and eliminate external frame buffer memory.

Use Scenario: Battery-powered vital signs monitor with color display, USB data export, and touch navigation.

IC Role / Device Role / Timing Role: Central SoC managing display, touch input, USB host for flash drive logging, and ADC acquisition.

Use Value: Dual USB OTG enables simultaneous device charging (peripheral mode) and clinical data export (host mode) without multiplexing.

Smart Energy Meter Retail Digital Signage Player

Use Scenario: DIN-rail mounted electricity meter with LCD display, RS-485 communication, and tamper detection.

IC Role / Device Role / Timing Role: Secure applications processor handling encrypted firmware updates and metrology data aggregation.

Use Value: Hardware AES-128 engine and secure boot ensure cryptographic integrity of firmware and measurement logs.

Use Scenario: wall-mounted retail kiosk displaying promotional content via HDMI or RGB interface with scheduled updates.

IC Role / Device Role / Timing Role: Media playback controller decoding JPEG/PNG assets and driving 720p displays.

Use Value: 454 MHz ARM9 core with 128 KB SRAM provides sufficient throughput for image decompression and double-buffered display rendering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
i.MX287 ARM9 @ 454 MHz, identical package and pinout; adds CAN FD controller and enhanced crypto (SHA-256, RSA) Required where automotive diagnostics or stronger firmware signing is mandated Select i.MX287 when CAN FD or SHA-256-based secure boot is needed; otherwise MCIMX233DJM4C offers lower cost and same footprint.
STM32MP157C Dual Cortex-A7 @ 650 MHz + Cortex-M4; 32-bit DDR3L interface; larger package (361-ball BGA) Suitable for Linux-based edge AI inference or multi-display systems requiring higher compute density Choose STM32MP157C only if A7 performance, dual-core Linux SMP, or 32-bit memory bandwidth is essential; MCIMX233DJM4C remains optimal for cost- and size-constrained ARM9 use cases.

Compared with i.MX287 and STM32MP157C, the MCIMX233DJM4C delivers the lowest bill-of-materials cost and smallest PCB footprint for single-core ARM9 applications requiring industrial temperature range, integrated LCD, and dual USB OTG - without over-provisioning compute or memory bandwidth.

Availability

MCIMX233DJM4C is available at Aetrix Electronics and suitable for industrial HMI terminals, portable medical monitors, and smart energy meters requiring stable component supply across extended product lifecycles.

Supply support for MCIMX233DJM4C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX233 series was designed specifically for cost-optimized, low-power embedded applications demanding robust real-time performance, integrated display control, and long-term industrial availability - not general-purpose computing.

FAQ

What is the maximum operating frequency of the MCIMX233DJM4C CPU core?

The MCIMX233DJM4C integrates an ARM926EJ-S core rated for operation at 454 MHz. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and supported by the on-chip PLL and voltage regulator. The MCIMX233DJM4C does not support dynamic frequency scaling beyond this fixed rate, ensuring deterministic timing for real-time tasks.

Does the MCIMX233DJM4C support external SDRAM or only DDR2/DDR3/LPDDR2?

The MCIMX233DJM4C supports only DDR2, DDR3, and LPDDR2 memory types via its 16-bit interface - it does not support legacy SDR SDRAM or mobile DDR (mDDR). The memory controller is optimized for burst transfers and includes configurable timing parameters to accommodate discrete DDR chips or small-capacity modules up to 256 MB.

Can the MCIMX233DJM4C boot directly from NAND flash without external boot ROM?

Yes, the MCIMX233DJM4C includes an on-chip ROM bootloader that supports NAND flash boot with hardware ECC correction (4-bit per 512-byte sector). Boot mode is selected using BOOT_MODE[1:0] pins, and the MCIMX233DJM4C automatically initializes NAND geometry, reads the first page, and executes the primary bootloader stored in the first block.

What display resolutions does the integrated LCD controller in the MCIMX233DJM4C support?

The MCIMX233DJM4C LCD controller supports RGB parallel interfaces up to 1024×768 pixels at 60 Hz with 24-bit color depth. It includes programmable timing generators, horizontal/vertical sync polarity control, and support for both active-high and active-low pixel clocks - enabling direct connection to common industrial TFT panels without external timing ICs.

Is the MCIMX233DJM4C pin-compatible with other i.MX23 family members like MCIMX233DVK4B?

No, the MCIMX233DJM4C (208-pin LQFP) is not pin-compatible with MCIMX233DVK4B (256-pin LQFP). While both share the same ARM926EJ-S core and peripheral set, their package footprints, pin counts, and I/O assignments differ significantly. Migration requires PCB redesign; however, software and register-level compatibility is maintained across the i.MX233 family.

MCIMX233DJM4C Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
169-LFBGA
Series:
i.MX23
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
-
SATA:
-
USB:
USB 2.0 + PHY (1)
Voltage - I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Supplier Device Package:
169-MAPBGA (11x11)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART

MCIMX233DJM4C FAQ

1.How can I place an order for MCIMX233DJM4C through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX233DJM4C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX233DJM4C reliable?

The price and inventory of MCIMX233DJM4C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX233DJM4C is usually 5 days.

3.What payment methods are accepted for MCIMX233DJM4C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX233DJM4C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX233DJM4C?

MCIMX233DJM4C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX233DJM4C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX233DJM4C?

For technical support, including MCIMX233DJM4C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX233DJM4C requirements.

6.How does Aetrix verify that MCIMX233DJM4C is sourced from the original manufacturer or authorized distributors?

All MCIMX233DJM4C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX233DJM4C meets industry standards.

7.What is the process for return or replacement of MCIMX233DJM4C?

All MCIMX233DJM4C units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX233DJM4C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX233DJM4C part is unused and in its original packaging.

Return procedure for MCIMX233DJM4C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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