NXP Semiconductors MCIMX233DJM4CR2
- Part No.:
- MCIMX233DJM4CR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 169-LFBGA
- Datasheet:
-
MCIMX233DJM4CR2.pdf
- Description:
- IC MPU I.MX23 454MHZ 169MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,259
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX233DJM4CR2 from NXP is an ARM926EJ-S™-based 454 MHz multimedia applications processor with integrated DC-DC power management, stereo analog audio ADC/DAC + headphone amplifier, 1.5 W mono speaker amplifier, 12-bit LRADC, and LCDIF supporting 24-bit VGA (640×480). It targets cost-sensitive portable media players and graphical HMI panels powered by single Li-Ion battery.
For engineers reviewing the MCIMX233DJM4CR2 datasheet, MCIMX233DJM4CR2 pinout, MCIMX233DJM4CR2 application, or MCIMX233DJM4CR2 equivalent, key selection considerations include its 169-ball MAPBGA package, -10°C to +70°C industrial temperature range, integrated 20-bit BCH NAND ECC, PXP pixel pipeline for hardware-accelerated display post-processing, and dual I2S interfaces for multi-audio-path designs.
Technical Context
The MCIMX233DJM4CR2 implements an Arm926EJ-S core at up to 454 MHz with 16 KB I-cache and 16 KB D-cache, coupled with on-chip 32 KB SRAM and boot ROM. Its integrated power management includes a 4-channel DC-DC converter, Li-Ion battery charger, and silicon temperature/speed sensors.
It supports external DDR1/mDDR memory and NAND flash with hardware 20-bit BCH or 8-bit Reed-Solomon error correction. The LCD interface provides both 8-bit serial and 24-bit parallel modes, while the Pixel Processing Pipeline (PXP) enables hardware scaling, alpha blending, rotation, and color space conversion without CPU overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm926EJ-S™ @ 454 MHz - delivers deterministic real-time response for embedded UI and media decode tasks |
| Memory Interface | DDR1/mDDR + NAND with 20-bit BCH ECC - enables reliable boot and storage in consumer-grade flash under thermal stress |
| Audio Subsystem | Stereo ADC/DAC + 1.5 W mono speaker amp + dual I2S - supports simultaneous headset output and loudspeaker playback without external codecs |
| Display Engine | LCDIF + PXP pipeline - accelerates 24-bit VGA frame processing (scaling/rotation/alpha) in hardware, reducing DRAM bandwidth by >40% |
| Power Management | Integrated 4-output DC-DC + Li-Ion charger - powers SoC, DDR, NAND, and peripherals from single-cell battery; eliminates 5+ external PMIC components |
| Connectivity | HS USB 2.0 PHY + 2x UART + 2x SPI + 2x I2S + SDIO - enables direct connection to USB peripherals, wireless modules (Wi-Fi/Bluetooth), and managed NAND storage |
| ADC & Touch | 12-bit LRADC with 6 channels - provides resistive touch screen control and system monitoring (battery voltage, temperature) with no external ADC required |
Pinout & Package
MCIMX233DJM4CR2 is housed in a 169-ball MAPBGA package with 0.8 mm pitch, designed for 6-layer PCB routing and thermal dissipation in compact portable devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | I/O supply rail | 3.3 V tolerant; powers all GPIO, USB, LCD, and peripheral interfaces |
| VDDA | Analog supply | Independent 3.3 V rail for ADC/DAC/amp circuits; reduces digital noise coupling into audio path |
| VDDARM | CPU core supply | Adjustable 1.2–1.4 V rail controlled by internal DC-DC; enables dynamic voltage scaling for power optimization |
| USB_DP / USB_DM | USB 2.0 differential pair | Integrated PHY eliminates need for external transceiver; supports host/device mode with suspend/resume |
| LRADC_IN0–5 | Analog input channels | 6 dedicated pins for resistive touchscreen X/Y measurement and auxiliary analog sensing (Vbat, temp) |
| SPK_OUT_P/N | Mono speaker amplifier output | Differential 1.5 W Class-D output; drives 4 Ω or 8 Ω speakers directly without external amplifier |
| I2S1_TX/RX/CLK/WS | Primary serial audio interface | Full-duplex I2S supporting 16/24-bit stereo at up to 96 kHz; connects to external DAC or audio codec |
| LCD_D0–23 | 24-bit parallel RGB data bus | Supports 24-bit-per-pixel VGA (640×480) displays with programmable polarity and timing |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DC-DC power management | Reduces BOM count by eliminating discrete regulators and battery charger ICs; supports seamless transition between USB and battery power |
| PXP hardware graphics accelerator | Offloads display composition tasks (scaling, alpha blending, rotation) from CPU, freeing ~15% MIPS for application logic |
| 20-bit BCH NAND ECC engine | Enables use of low-cost SLC/MLC NAND in production systems with >100k program/erase cycles and field-reliable wear leveling |
| Dual I2S interfaces | Allows concurrent audio playback (I2S1) and recording (I2S2) paths, enabling VoIP handset full-duplex operation without time-division multiplexing |
| 12-bit LRADC with touch controller | Provides 6-channel analog sensing and 4-wire resistive touchscreen support with built-in debouncing and coordinate calculation |
Applications
| Portable Media Players | Graphical Remote Controls |
|---|---|
Use Scenario: Battery-powered handheld device playing MP3/WMA files with 4.3" WQVGA display and tactile touch overlay. IC Role / Device Role / Timing Role: Main applications processor executing media decode, managing NAND storage, driving LCD via 24-bit parallel interface, and amplifying audio to mono speaker. Use Value: Integrated 1.5 W speaker amp and PXP enable rich UI with smooth transitions and local audio playback-no external audio or graphics ICs required. | Use Scenario: IR+BLE remote with color TFT display, capacitive or resistive touch, and voice prompt feedback. IC Role / Device Role / Timing Role: System-on-chip handling UI rendering, button/touch input via LRADC, BLE co-processor communication over UART/SDIO, and stereo audio playback via I2S. Use Value: Dual I2S and integrated stereo DAC eliminate need for separate audio codec; 20-bit NAND ECC ensures firmware update reliability over 10-year product lifecycle. |
| Home Automation HMI Panels | VoIP Handsets |
Use Scenario: Wall-mounted industrial HMI panel controlling lighting, HVAC, and security with 7" resistive touchscreen and local status LEDs. IC Role / Device Role / Timing Role: Real-time controller running lightweight Linux, reading touch coordinates via LRADC_IN0–3, driving 800×480 LCD in 24-bit mode, and managing GPIO for relay/LED control. Use Value: On-chip PWM (5 channels) and RTC (24 MHz + 32 kHz) support precise LED dimming and time-stamped event logging without external timers. | Use Scenario: SIP-based desk phone with HD voice, speakerphone, and OLED/LCD display, powered by USB or PoE-derived 5 V. IC Role / Device Role / Timing Role: Central processor running VoIP stack, performing echo cancellation using DSP extensions, encoding/decoding G.711/G.722 via software, and driving speaker/headset via analog audio subsystem. Use Value: Stereo ADC/DAC + mono speaker amp + S/PDIF output provide three independent audio paths-enabling simultaneous headset, speakerphone, and digital recording without multiplexing latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multimedia applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX233CJM4CR2 | Same 169-ball MAPBGA package and feature set, but rated for -40°C to +85°C extended temperature range | Required for industrial outdoor or automotive cabin-mounted HMIs exposed to wider thermal cycling | Select when operating ambient exceeds +70°C or requires AEC-Q200-aligned thermal qualification |
| i.MX283 (MCIMX283CVM4B) | ARM9 @ 454 MHz, but adds crypto acceleration (AES/SHA), Ethernet MAC, and enhanced LCDIF with overlay planes; larger 289-ball BGA | Targets secure connected devices needing TLS offload, wired network, or multi-layer GUI compositing | Choose when cryptographic services, 10/100 Ethernet, or advanced display layering are mandatory |
Compared with MCIMX233CJM4CR2, the MCIMX233DJM4CR2 trades extended temperature tolerance for lower cost in commercial indoor applications; versus i.MX283, it offers identical CPU performance and media features at reduced package size and BOM cost-but lacks crypto engines and Ethernet, making it optimal for cost-constrained, battery-powered UI endpoints.
Availability
MCIMX233DJM4CR2 is available at Aetrix Electronics and suitable for portable media players, graphical remote control devices, and home automation HMI panels requiring stable component supply across long-lifecycle consumer electronics programs.
Supply support for MCIMX233DJM4CR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX233 series was designed specifically for ultra-low-power, cost-sensitive multimedia endpoints-integrating power, audio, display, and connectivity functions into a single chip to replace multi-chip solutions in portable consumer electronics.
FAQ
What is the operating temperature range for MCIMX233DJM4CR2?
The MCIMX233DJM4CR2 is specified for industrial operation from -10°C to +70°C. This range supports deployment in enclosed consumer devices such as portable media players and indoor home automation panels where ambient conditions remain within typical room-temperature envelopes. It is not qualified for extended temperature environments like automotive under-hood or outdoor industrial enclosures-those require the MCIMX233CJM4CR2 variant.
Does MCIMX233DJM4CR2 support NAND flash with hardware error correction?
Yes, MCIMX233DJM4CR2 includes a dedicated hardware ECC engine supporting both 20-bit BCH and 8-bit Reed-Solomon correction. This enables reliable boot and data storage on SLC, MLC, and managed NAND devices without software overhead. The controller handles correction transparently during read/write operations, improving NAND endurance and field failure rates in high-volume consumer products.
Can MCIMX233DJM4CR2 drive a 24-bit RGB LCD display directly?
Yes, MCIMX233DJM4CR2's LCDIF supports 24-bit parallel RGB output at VGA resolution (640×480) with programmable timing, polarity, and data format. When used with the integrated PXP graphics accelerator, it can perform hardware scaling and alpha blending-reducing CPU load and DRAM bandwidth. No external timing controller or level shifter is needed for standard 3.3 V LVCMOS RGB interfaces.
How many I2S interfaces does MCIMX233DJM4CR2 provide, and what are their roles?
MCIMX233DJM4CR2 integrates two independent I2S interfaces. I2S1 is typically used for primary audio playback (e.g., to a DAC or headset), while I2S2 supports simultaneous recording or secondary playback (e.g., speakerphone path). Both support 16/24-bit stereo at sample rates up to 96 kHz, enabling full-duplex audio in VoIP handsets or multi-zone audio accessories without time-division multiplexing.
Is there an integrated speaker amplifier in MCIMX233DJM4CR2, and what is its output capability?
Yes, MCIMX233DJM4CR2 includes a Class-D mono speaker amplifier delivering 1.5 W into 4 Ω or 8 Ω loads. It accepts digital audio via I2S or analog input via dedicated line-in pins, and includes volume control, mute, and thermal shutdown protection. This eliminates the need for external amplifier ICs in portable speakers, media players, and smart remotes-reducing BOM cost and PCB area.
MCIMX233DJM4CR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 169-LFBGA
- Series:
- i.MX23
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 454MHz
- Co-Processors/DSP:
- Data; DCP
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD, Touchscreen
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 2.0 + PHY (1)
- Voltage - I/O:
- 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
- Operating Temperature:
- -10°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Hardware ID
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 169-MAPBGA (11x11)
- Additional Interfaces:
- I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
MCIMX233DJM4CR2 FAQ
1.How can I place an order for MCIMX233DJM4CR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX233DJM4CR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX233DJM4CR2 reliable?
The price and inventory of MCIMX233DJM4CR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX233DJM4CR2 is usually 5 days.
3.What payment methods are accepted for MCIMX233DJM4CR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX233DJM4CR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX233DJM4CR2?
MCIMX233DJM4CR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX233DJM4CR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX233DJM4CR2?
For technical support, including MCIMX233DJM4CR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX233DJM4CR2 requirements.
6.How does Aetrix verify that MCIMX233DJM4CR2 is sourced from the original manufacturer or authorized distributors?
All MCIMX233DJM4CR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX233DJM4CR2 meets industry standards.
7.What is the process for return or replacement of MCIMX233DJM4CR2?
All MCIMX233DJM4CR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX233DJM4CR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX233DJM4CR2 part is unused and in its original packaging.
Return procedure for MCIMX233DJM4CR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX233DJM4CR2 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

