NXP Semiconductors MCIMX27MOP4AR2

Overview

MCIMX27MOP4AR2 from NXP Semiconductors is an ARM926EJ-S-based multimedia applications processor operating at up to 400 MHz, featuring integrated video codec (MPEG-4 SP/H.264 BP/H.263 P3), LCD controller, CMOS sensor interface, and dual USB host + OTG. It targets portable media players, digital cameras, and wireless PDAs requiring low-power, high-performance embedded processing.

For engineers reviewing the MCIMX27MOP4AR2 datasheet, MCIMX27MOP4AR2 pinout, MCIMX27MOP4AR2 application, or MCIMX27MOP4AR2 equivalent, key selection considerations include its –40°C to +85°C industrial temperature grade, MAPBGA-473 (19 mm × 19 mm) package, DDR/SDRAM/NAND Flash memory support, and hardware-accelerated video decode/encode capability for D1 resolution @ 30 FPS.

Technical Context

The MCIMX27MOP4AR2 implements a Harvard-architected ARM926EJ-S core with 16 KB instruction and 16 KB data caches, MMU support for Linux/Windows CE, and dynamic process/temperature compensation (DPTC) for power optimization. Its on-chip AHB crossbar switch (MAX) routes traffic among six masters-including CPU I/D buses and DMA-and three AHB-Lite slave domains.

It integrates dedicated multimedia accelerators including eMMA_lt (PrP/PP for scaling/color space conversion), Video Codec (H.264 BP encode/decode), LCDC/SLCDC display controllers, and CSI for direct CMOS sensor interfacing-enabling real-time viewfinder processing without CPU or memory system involvement.

Key Specifications

Pinout & Package

MCIMX27MOP4AR2 uses a 473-ball MAPBGA package (Case 1931-04, 19 mm × 19 mm, 0.8 mm pitch), designed for industrial temperature operation (–40°C to +85°C). Ball assignment follows JEDEC MO-275AC standard with dedicated power, ground, I/O, and differential clock ball groups.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multimedia applications processor applications.

Compared with MCIMX27MOP4AR2, MCIMX27VOP4A offers identical functionality at lower cost but reduced thermal range and smaller package, while i.MX283 delivers architectural improvements and security upgrades at the expense of PCB redesign and software porting effort.

Availability

MCIMX27MOP4AR2 is available at Aetrix Electronics and suitable for portable media players, digital cameras, and industrial HMI terminals requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCIMX27MOP4AR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The i.MX family-of which MCIMX27MOP4AR2 is a member-was designed specifically for low-power, high-performance multimedia processing in battery-constrained portable devices, emphasizing hardware acceleration, thermal efficiency, and OS-ready subsystem integration.

FAQ

What is the maximum operating frequency of the MCIMX27MOP4AR2 processor core?

The MCIMX27MOP4AR2 features an ARM926EJ-S microprocessor core rated for operation up to 400 MHz under industrial temperature conditions (–40°C to +85°C). This frequency is achievable with proper power delivery (VDD_ARM = 1.2 V ±3%) and thermal management, and is validated across the full temperature range per NXP's electrical specifications in Rev. 2 (March 2019) of the MCIMX27EC datasheet.

Does the MCIMX27MOP4AR2 support hardware-accelerated H.264 video encoding?

Yes, the MCIMX27MOP4AR2 includes a dedicated Video Codec module supporting H.264 Baseline Profile encoding and decoding. It achieves D1 resolution (720×486) at 30 FPS with full hardware acceleration-offloading all motion estimation, transform, quantization, and entropy coding from the ARM926EJ-S core. This capability is confirmed in Section 1.1 and Module Description 2.3.39 of the official datasheet.

What package type and ball count does the MCIMX27MOP4AR2 use?

The MCIMX27MOP4AR2 uses a 473-ball MAPBGA package (JEDEC MO-275AC compliant), designated Case 1931-04, with 19 mm × 19 mm body size and 0.8 mm ball pitch. This package is specified for industrial temperature operation and differs from the 404-ball MAPBGA (Case 1816-01) used in commercial-grade variants like MCIMX27VOP4A.

Can the MCIMX27MOP4AR2 boot directly from NAND Flash memory?

Yes, the MCIMX27MOP4AR2 supports NAND Flash boot via its integrated NAND Flash Controller (NFC). When BOOT_MODE[1:0] pins are configured to 0b10, the processor executes internal boot ROM code that initializes the NFC and loads firmware from a predefined NAND block into internal SRAM. This is documented in Section 3.1 (Power-Up Sequence) and Table 1 (Ordering Information) of the MCIMX27EC datasheet.

What security features are integrated into the MCIMX27MOP4AR2?

The MCIMX27MOP4AR2 integrates SAHARA2 (symmetric/asymmetric crypto and RNG), SCC (Security Controller with Secure RAM), and RTIC (Run-Time Integrity Checker). These modules enable secure boot authentication, encrypted media playback, and runtime verification of peripheral memory contents-functions detailed in Sections 2.3.30, 2.3.31, and 2.3.29 of the official datasheet.