NXP Semiconductors MCIMX31LVKN5C

Overview

MCIMX31LVKN5C from NXP (formerly Freescale) is a multimedia applications processor built on the ARM1136JF-S core, operating up to 532 MHz with 16 KB instruction and 16 KB data L1 caches, 128 KB unified L2 cache, and integrated MPEG-4 hardware encoder supporting VGA@30 fps video encoding. It targets portable media players, feature-rich cellular phones, and wireless PDAs requiring low-power, high-performance processing.

For engineers reviewing the MCIMX31LVKN5C datasheet, MCIMX31LVKN5C pinout, MCIMX31LVKN5C application, or MCIMX31LVKN5C equivalent, key selection criteria include its 14 × 14 mm MAPBGA-457 package, dual-Vt 90 nm process, DVFS-enabled power management, and support for DDR, NAND Flash, USB 2.0 OTG, SDHC, and IPU-based camera/display pipelines.

Technical Context

The MCIMX31LVKN5C implements the ARM v6 architecture with Jazelle® Java acceleration, SIMD DSP extensions, and an eight-stage pipeline with branch prediction. Its memory subsystem integrates 16 KB L1 I-cache, 16 KB L1 D-cache, and 128 KB unified L2 cache, all backed by AMBA-compliant interconnects and a 64-bit interface between L1 and L2.

Power management relies on Dynamic Voltage and Frequency Scaling (DVFS), independent clock/power domain gating, and DPTC (Dynamic Process Temperature Compensation). The device omits the GPU present in the standard MCIMX31 variant, distinguishing it as the "L" (Lite) version while retaining full IPU, SDMA, VFP11 co-processor, and security modules including RNGA and SCC.

Key Specifications

Pinout & Package

MCIMX31LVKN5C uses a 14 × 14 mm MAPBGA-457 package (Case 1581) with 0.5 mm ball pitch, RoHS-compliant and moisture-sensitive level 3. Ball map and signal assignments are defined in Section 5 ("Package Information and Pinout") of the MCIMX31 Technical Data Rev. 4.1 datasheet, covering 457 BGA balls organized in 23 × 23 array with corner balls omitted.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multimedia applications processor applications.

Compared with MCIMX31LVKN5C, MCIMX31VKN5C adds GPU capability at identical pinout and power envelope, while i.MX27 offers legacy ARM9 compatibility and reduced BOM cost but sacrifices video acceleration, floating-point performance, and advanced power management.

Availability

MCIMX31LVKN5C is available at Aetrix Electronics and suitable for portable media players, feature-rich cellular phones, and wireless PDAs requiring stable component supply across extended production lifecycles.

Supply support for MCIMX31LVKN5C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The i.MX family, including MCIMX31LVKN5C, was designed for high-performance, low-power multimedia applications in battery-operated portable devices, emphasizing integration of video encode, image processing, and security features on a single die.

FAQ

What is the maximum operating frequency of the MCIMX31LVKN5C and under what conditions?

The MCIMX31LVKN5C supports a maximum core frequency of 532 MHz in overdrive mode, requiring core supply voltage above 1.47 V. Operation at this voltage is limited to a cumulative duration of 10,950 hours (1.25 years) to ensure long-term reliability. At nominal 400 MHz operation, the core voltage range is 1.22–1.47 V, with no duty-cycle restrictions. This specification is confirmed in Table 8 and Section 1.2.1 of the MCIMX31 Technical Data Rev. 4.1 for silicon revision 2.0 (M91E mask set), which applies to MCIMX31LVKN5C.

Does the MCIMX31LVKN5C include a graphics processing unit (GPU)?

No, the MCIMX31LVKN5C does not include a GPU. As stated in the Introduction section of the MCIMX31 Technical Data Rev. 4.1, the "MCIMX31L does not include a graphics processing unit (GPU)". The "L" suffix explicitly denotes the Lite variant, which retains all other major subsystems - including ARM1136JF-S core, IPU, VFP11, SDMA, and security modules - but omits the GPU block present in the standard MCIMX31 series such as MCIMX31VKN5C.

What package type and ball count does the MCIMX31LVKN5C use?

The MCIMX31LVKN5C uses a MAPBGA-457 package with 14 × 14 mm body size and 0.5 mm ball pitch (Case 1581), as specified in Table 1 (Ordering Information) and Section 5 (Package Information and Pinout) of the MCIMX31 Technical Data Rev. 4.1. This RoHS-compliant, lead-free package has 457 solder balls arranged in a 23 × 23 grid with four corner balls omitted, and is rated MSL Level 3 for moisture sensitivity.

Which memory types are supported by the MCIMX31LVKN5C's external memory interface?

The MCIMX31LVKN5C supports DDR SDRAM, NAND Flash, NOR Flash, SDRAM, and SRAM via its External Memory Interface (EMI), as documented in Section 1 (Introduction) and Table 3 (Module Inventory) of the MCIMX31 Technical Data Rev. 4.1. The EMI module includes dedicated controllers for NAND Flash (NFC), enhanced SDRAM (ESDCTL), and a multi-master memory interface (M3IF), enabling flexible boot and runtime memory configurations for portable media applications.

How does the MCIMX31LVKN5C implement power management for battery-operated devices?

The MCIMX31LVKN5C implements advanced power management through Dynamic Voltage and Frequency Scaling (DVFS), multiple independent clock and power domains, and fine-grained power gating - all enabled by its 90 nm dual-Vt process and Clock Control Module (CCM). These features allow selective shutdown of idle peripherals (e.g., USB, SDHC) and dynamic adjustment of core voltage/frequency based on workload, directly supporting extended battery life in portable media players and cellular handsets as described in Section 1.1 (Features) and Section 4.2 (Power-Up/Down Requirements).