Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MCIMX353DJQ5C

Part No.:
MCIMX353DJQ5C
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
400-LFBGA
Datasheet:
AetrixMCIMX353DJQ5C.pdf
Description:
IC MPU I.MX35 532MHZ 400LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:845

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MCIMX353DJQ5C from NXP Semiconductors (formerly Freescale) is an ARM1136JF-S-based multimedia applications processor operating at 532 MHz, featuring 16 KB L1 instruction cache, 16 KB L1 data cache, and 128 KB L2 cache. It integrates an Image Processing Unit (IPU), dual CAN interfaces, USB 2.0 OTG with internal HS PHY, 10/100 Mbps Ethernet MAC, and supports mobile DDR, DDR2, SDRAM, NAND/NOR Flash - designed for industrial HMI and display controller systems.

For engineers reviewing the MCIMX353DJQ5C datasheet, MCIMX353DJQ5C pinout, MCIMX353DJQ5C application, or MCIMX353DJQ5C equivalent, key selection considerations include its -20°C to +70°C industrial temperature grade, MAPBGA-5284 (17 × 17 mm, 0.8 mm pitch) package, absence of OpenVG GPU (distinguishing it from i.MX357), and silicon revision 2.1 ball map compatibility requirements.

Technical Context

The MCIMX353DJQ5C implements a hierarchical memory architecture with L1/L2 caches and a multiported crossbar switch, enabling efficient bandwidth management between ARM1136JF-S core and peripherals like EMI, SDMA, and IPU. Its AP domain handles OS execution and rich UI rendering via dedicated hardware acceleration blocks including IPU for camera interface, color space conversion, and display blending.

Power management leverages clock gating, power gating, and well biasing to reduce leakage-supporting multiple low-power modes (WAIT/STOP) controlled by CCM. The device uses dual PLLs (MPLL/PPLL) for frequency synthesis and includes three I²C modules (up to 400 kbps), two CSPI interfaces (52 Mbps each), and three UARTs (4.0 Mbps each), all routed through IOMUX for flexible pin assignment.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureARM1136JF-S, ARM v6, r1p3 revision - enables Thumb/Jazelle/NEON-like SIMD instructions and VFP11 co-processor support for floating-point-intensive tasks.
Clock Speed532 MHz maximum - delivers deterministic real-time performance for industrial HMIs requiring responsive touch and graphics updates.
Memory Subsystem16 KB L1 instruction cache + 16 KB L1 data cache + 128 KB unified L2 cache - reduces external memory bandwidth demand and improves instruction/data fetch latency.
Integrated PeripheralsImage Processing Unit (IPU), dual FlexCAN, USB 2.0 OTG (480 Mbps), FEC Ethernet MAC (10/100 Mbps), eSDHCv2 (SDIO/MMC/CE-ATA) - enables single-chip connectivity for displays, cameras, storage, and fieldbus networks.
External Memory SupportMobile DDR, DDR2 (4-bank), SDRAM (133 MHz), SLC/MLC NAND, NOR Flash, PSRAM - allows flexible BOM optimization across cost, density, and boot reliability requirements.
Operating Temperature-20°C to +70°C - qualified for extended industrial environments where ambient thermal cycling exceeds commercial-grade limits.
Silicon RevisionRevision 2.1 - requires Table 95/97 ball map; incompatible layout with revision 2.0 packages (e.g., MCIMX353DVM5B).

Pinout & Package

MCIMX353DJQ5C is housed in a RoHS-compliant, lead-free MAPBGA package (Case 5284), 17 mm × 17 mm body size, 0.8 mm ball pitch, MSL Level 3. This 528-ball grid array supports high-density routing for industrial PCBs with strict signal integrity requirements.

Pin/TerminalCircuit RoleDesign Meaning
EXT_ARMCLKExternal ARM Clock InputAccepts external clock source for ARM core timing; used when internal oscillator is disabled or for synchronous system clocking.
I2C1_CLKExternal Peripheral Clock SourceProvides configurable clock reference for I²C1 peripheral operation; selectable via ALT6 mux mode.
CAPTURE / CSPI1_SS132 kHz External Clock InputEnables RTC operation during deep-sleep modes when 24 MHz oscillator is powered down; dual-function pin with alternate roles.
CLKOProgrammable Clock OutputOutputs selected internal clock (e.g., CCM-derived) for debug, test, or synchronization of external logic.
GPIO1_0PMIC Power-Ready SignalIndicates stable power rail status from PMIC; used to gate processor initialization sequence until supply conditions are met.
GPIO1_1Tamper-Detect InputTriggers security violation interrupt upon assertion; permanently enabled after configuration until next reset - critical for secure boot enforcement.

Key Features

FeatureDesign Value
Image Processing Unit (IPU)Offloads ARM11 core from video preprocessing (color space conversion), post-processing (MPEG-4/H.264 deblocking), camera sensor interface (up to 30 Mpixels/s), and display blending - enabling smooth 1024×1024 UI rendering without CPU saturation.
Dual FlexCAN InterfacesSupports ISO 11898-1 compliant CAN 2.0B communication at up to 1 Mbps - suitable for industrial automation nodes requiring deterministic fieldbus messaging and error handling.
USB 2.0 OTG with Internal HS PHYEnables host/peripheral role switching without external transceiver; full-speed and high-speed (480 Mbps) operation simplifies design of portable HMIs with plug-and-play peripheral attachment.
Advanced Power ManagementCombines clock/power gating, well biasing, and WAIT/STOP modes to reduce subthreshold leakage by ~10× - extends battery life in portable industrial terminals and lowers thermal load in sealed enclosures.
Flexible Memory ControllerSupports heterogeneous memory types (NAND/NOR/DDR2/mobile DDR/SDRAM) on shared bus - allows boot-from-NAND, runtime code execution from DDR2, and persistent logging in NOR - optimizing system-level reliability and cost.

Applications

Industrial HMI TerminalMedical Display Controller

Use Scenario: Touch-enabled operator interface in factory-floor PLC panels with real-time alarm visualization and trend graphing.

IC Role / Device Role / Timing Role: Central applications processor executing Linux-based GUI stack, driving parallel RGB display (1024×1024), and managing CAN-connected I/O modules.

Use Value: IPU accelerates graphics overlay and video scaling; dual CAN ensures deterministic control loop messaging; -20°C to +70°C rating sustains operation in unconditioned plant environments.

Use Scenario: Portable ultrasound imaging device requiring real-time sensor data acquisition, image enhancement, and local display.

IC Role / Device Role / Timing Role: Real-time image processing engine interfacing with parallel camera sensor (YUV/YCC), applying post-filtering algorithms, and outputting processed frames to LCD.

Use Value: IPU performs MPEG-4 deblocking and deringing in hardware; 532 MHz ARM11 core executes embedded Linux and medical software stack; USB OTG enables DICOM export to flash drives.

Retail Kiosk ControllerBuilding Automation Gateway

Use Scenario: Self-service checkout terminal with barcode scanner, receipt printer, and payment card reader integration.

IC Role / Device Role / Timing Role: Host controller managing multiple peripherals via USB OTG, UART (printer), SPI (scanner), and I²C (secure element), while running Android-based UI.

Use Value: Three UARTs support legacy peripherals; eSDHCv2 enables fast SD card-based firmware updates; 128 KB L2 cache improves multitasking responsiveness under concurrent I/O loads.

Use Scenario: Smart HVAC gateway aggregating Modbus RTU, BACnet MS/TP, and KNX traffic into IP-based building management system.

IC Role / Device Role / Timing Role: Protocol translation hub using dual CAN for fieldbus bridging, Ethernet for upstream IP communication, and GPIO for discrete alarm monitoring.

Use Value: Dual FlexCAN interfaces natively support industrial fieldbus protocols; FEC Ethernet MAC provides deterministic 100 Mbps uplink; JTAG and secure debug enable remote firmware validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multimedia applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCIMX353CJQ5CSame silicon revision (2.1), identical feature set, but rated for -40°C to +85°C industrial temperature range.Required for extended-temperature deployments (e.g., outdoor kiosks, transportation systems) where ambient extremes exceed -20°C to +70°C.Select MCIMX353CJQ5C when operating environment exceeds +70°C or drops below -20°C; otherwise MCIMX353DJQ5C offers optimal cost/performance balance for standard industrial zones.
i.MX6ULL G0ARM Cortex-A7 core (up to 900 MHz), integrated GPU (Vivante GC7000UL), newer Linux BSP support, but larger 14×14 mm BGA package and higher power envelope.Better suited for GUI-rich applications requiring OpenGL ES acceleration and long-term software maintenance beyond i.MX35's end-of-life roadmap.Choose i.MX6ULL G0 for new designs needing active vendor support, GPU-accelerated UI, and future-proof BSP longevity; retain MCIMX353DJQ5C for legacy-compatible, cost-sensitive, or thermally constrained upgrades.

Compared with MCIMX353CJQ5C, the MCIMX353DJQ5C trades extended temperature capability for lower unit cost and identical functionality in milder environments; versus i.MX6ULL G0, it offers smaller footprint and lower power draw but lacks GPU and modern toolchain support - making it ideal for stable, maintenance-light industrial HMIs where feature parity and thermal margin are sufficient.

Availability

MCIMX353DJQ5C is available at Aetrix Electronics and suitable for industrial HMI terminals, medical display controllers, retail kiosks, and building automation gateways requiring stable component supply, long-lifecycle assurance, and RoHS-compliant manufacturing.

Supply support for MCIMX353DJQ5C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's embedded processor heritage.

The i.MX35 product line was engineered specifically for cost-sensitive, power-efficient industrial and consumer multimedia applications - emphasizing integration of display, camera, connectivity, and real-time control in a single ARM11-based SoC.

FAQ

What is the maximum operating frequency of the MCIMX353DJQ5C?

The MCIMX353DJQ5C operates at a maximum frequency of 532 MHz. This speed is guaranteed under specified core voltage (1.33–1.47 V) and temperature (-20°C to +70°C) conditions per the official Freescale MCIMX35SR2CEC datasheet Rev. 10. The ARM1136JF-S core achieves this performance with integrated L1/L2 caches and optimized pipeline architecture, enabling deterministic execution for industrial HMI workloads. MCIMX353DJQ5C maintains timing compliance without overclocking or binning.

Does the MCIMX353DJQ5C include a graphics processing unit (GPU)?

No, the MCIMX353DJQ5C does not include an OpenVG 1.1 GPU. According to Table 2 in the MCIMX35SR2CEC datasheet, GPU functionality is explicitly excluded from the MCIMX353 variant (including MCIMX353DJQ5C), distinguishing it from the i.MX357 family. Graphics acceleration relies solely on the Image Processing Unit (IPU) for 2D operations such as blending, rotation, and color space conversion. MCIMX353DJQ5C retains full IPU capabilities for display and camera pipelines.

What package type and ball count does the MCIMX353DJQ5C use?

The MCIMX353DJQ5C uses a MAPBGA package designated Case 5284 - a 17 mm × 17 mm body with 0.8 mm ball pitch and 528 I/O balls. It is RoHS-compliant, lead-free, and rated MSL Level 3. This package matches other i.MX353/357 variants in the same revision (2.1), but layout is incompatible with revision 2.0 devices due to revised ball mapping per Tables 95 and 97 in the datasheet. MCIMX353DJQ5C requires precise adherence to its specific footprint.

Which external memory types are supported by the MCIMX353DJQ5C?

The MCIMX353DJQ5C supports SDRAM (up to 133 MHz), mobile DDR, DDR2 (4-bank architecture), SLC and MLC NAND Flash, NOR Flash, and SRAM via its External Memory Interface (EMI). These interfaces are implemented in dedicated controller blocks: SDRAM CTRL, NANDFC, WEIM, and M3IF arbitration. MCIMX353DJQ5C enables boot-from-NAND configurations and mixed-memory systems - for example, executing code from DDR2 while storing logs in NOR Flash - validated in the i.MX35 Reference Manual.

What is the difference between MCIMX353DJQ5C and MCIMX353DVM5B?

The MCIMX353DJQ5C and MCIMX353DVM5B share identical functionality and temperature grade (-20°C to +70°C), but differ in silicon revision and package ball map: MCIMX353DJQ5C uses revision 2.1 (Tables 95/97), while MCIMX353DVM5B uses revision 2.0 (Tables 94/96). Their layouts are incompatible - PCBs designed for one cannot accommodate the other without redesign. MCIMX353DJQ5C supersedes MCIMX353DVM5B in new designs requiring revision 2.1 errata fixes and updated qualification.

MCIMX353DJQ5C Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
400-LFBGA
Series:
i.MX35
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM1136JF-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
532MHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, KPP, LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-20°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Security Features:
Secure Fusebox, Secure JTAG, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
400-LFBGA (17x17)
Additional Interfaces:
1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART

MCIMX353DJQ5C FAQ

1.How can I place an order for MCIMX353DJQ5C through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX353DJQ5C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX353DJQ5C reliable?

The price and inventory of MCIMX353DJQ5C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX353DJQ5C is usually 5 days.

3.What payment methods are accepted for MCIMX353DJQ5C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX353DJQ5C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX353DJQ5C?

MCIMX353DJQ5C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX353DJQ5C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX353DJQ5C?

For technical support, including MCIMX353DJQ5C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX353DJQ5C requirements.

6.How does Aetrix verify that MCIMX353DJQ5C is sourced from the original manufacturer or authorized distributors?

All MCIMX353DJQ5C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX353DJQ5C meets industry standards.

7.What is the process for return or replacement of MCIMX353DJQ5C?

All MCIMX353DJQ5C units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX353DJQ5C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX353DJQ5C part is unused and in its original packaging.

Return procedure for MCIMX353DJQ5C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCIMX353DJQ5C Tags

  • MCIMX353DJQ5C
  • MCIMX353DJQ5C PDF
  • MCIMX353DJQ5C Datasheet
  • MCIMX353DJQ5C Specifications
  • MCIMX353DJQ5C Images
  • NXP Semiconductors
  • NXP Semiconductors MCIMX353DJQ5C
  • Buy MCIMX353DJQ5C
  • MCIMX353DJQ5C Price
  • MCIMX353DJQ5C Distributor
  • MCIMX353DJQ5C Supplier
  • MCIMX353DJQ5C Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER