NXP Semiconductors MCIMX355AJQ5C

Overview

MCIMX355AJQ5C from NXP Semiconductors (formerly Freescale) is an AEC-Q100 Grade 3 qualified automotive application processor based on the ARM1136JF-S core operating at 532 MHz, featuring 16-Kbyte L1 instruction and data caches, 128-Kbyte L2 cache, integrated Image Processing Unit (IPU), OpenVG 1.1 GPU, dual CAN interfaces, USB 2.0 OTG with internal HS PHY, and Ethernet MAC - deployed in infotainment head units for real-time video decode, navigation rendering, and hands-free telephony.

For engineers reviewing the MCIMX355AJQ5C datasheet, MCIMX355AJQ5C pinout, MCIMX355AJQ5C application, or MCIMX355AJQ5C equivalent, key selection criteria include AEC-Q100 Grade 3 qualification, 532 MHz ARM11 performance, IPU-accelerated camera preprocessing, dual CAN bus support for vehicle network integration, and 17 × 17 mm MAPBGA-5284 packaging with 0.8 mm pitch.

Technical Context

The MCIMX355AJQ5C implements a hierarchical memory architecture with L1/L2 caches and 128 KB on-chip SRAM to reduce external memory bandwidth pressure. Its ARM1136JF-S core supports Thumb®, Jazelle® Java acceleration, and VFP11 co-processor for floating-point-intensive graphics and audio processing.

Functional domain partitioning separates the Application Processor (AP) domain - hosting ARM11, IPU, GPU, and multimedia peripherals - from the Shared Domain - managing SDMA, EMI, FEC, and connectivity modules via SPBA arbitration. Power management employs clock gating, power gating, and well biasing to achieve subthreshold leakage reduction by ~10× in 90 nm process.

Key Specifications

Pinout & Package

MCIMX355AJQ5C uses a 17 × 17 mm MAPBGA package (Case 5284), RoHS-compliant, lead-free, MSL Level 3, with 0.8 mm ball pitch and 456 I/O balls. Ball map corresponds to silicon revision 2.1 (Table 95/97); layout incompatible with revision 2.0.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive application processor applications.

Compared with MCIMX355AVM5B, MCIMX355AJQ5C enables migration to silicon revision 2.1 with improved reliability and updated errata fixes, while MCIMX356AJQ5C extends storage interface capability at no penalty to multimedia or networking performance - making MCIMX355AJQ5C the most balanced choice for cost-sensitive, video-enabled infotainment systems.

Availability

MCIMX355AJQ5C is available at Aetrix Electronics and suitable for automotive infotainment head units, telematics control units, digital navigation systems, and in-vehicle audio hubs requiring stable component supply across extended product lifecycles.

Supply support for MCIMX355AJQ5C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX35 family was developed by Freescale (now NXP) specifically for AEC-Q100 Grade 3 automotive infotainment applications - emphasizing real-time multimedia processing, functional safety readiness, and robust CAN/Ethernet connectivity in thermally constrained environments.

FAQ

What is the maximum operating temperature rating for the MCIMX355AJQ5C?

The MCIMX355AJQ5C is AEC-Q100 Grade 3 qualified with an ambient operating temperature range of –40 °C to +85 °C. This rating is validated across all electrical specifications and applies to the full 532 MHz operation - no derating required within this envelope. Thermal characteristics in Section 4.6 of the MCIMX35SR2AEC datasheet confirm junction-to-case resistance and recommended PCB copper area for passive cooling in sealed enclosures.

Does the MCIMX355AJQ5C support booting from NAND Flash memory?

Yes, the MCIMX355AJQ5C supports booting directly from SLC/MLC NAND Flash via its integrated NAND Flash Controller (NANDFC) submodule within the External Memory Interface (EMI). The device implements hardware ECC (up to 4-bit correction) and supports common NAND geometries including 2K/4K page sizes and 64/128 MB densities - verified in Section 2.5 and Table 4 of the MCIMX35SR2AEC datasheet.

Is the OpenVG 1.1 GPU available on the MCIMX355AJQ5C?

Yes, the MCIMX355AJQ5C includes the GPU2D module supporting OpenVG 1.1 graphics acceleration, as confirmed in Table 2 (Functional Differences) and Section 1.1 of the MCIMX35SR2AEC datasheet. This capability is present in all i.MX355 and i.MX356 variants but excluded from i.MX351 - making MCIMX355AJQ5C suitable for vector-based UI rendering in navigation and infotainment applications.

What are the key differences between MCIMX355AJQ5C and MCIMX351AJQ5C?

The MCIMX355AJQ5C includes the Image Processing Unit (IPU) and OpenVG 1.1 GPU, which are absent in MCIMX351AJQ5C. Additionally, MCIMX355AJQ5C supports CE-ATA and PATA interfaces, whereas MCIMX351AJQ5C omits both. All other peripherals - dual CAN, USB OTG/host, Ethernet, SDIO, and I2C - are functionally identical between the two parts per Table 2 of the MCIMX35SR2AEC datasheet.

Does the MCIMX355AJQ5C require external DDR2 memory to operate?

No, the MCIMX355AJQ5C can execute code from internal 128 KB SRAM or boot from NAND/SD/eMMC without external DDR2, but full-featured operation - including Linux OS execution, video decode, and GUI rendering - requires external DDR2 or mobile DDR memory connected via its 32-bit EMI interface. Section 2.2 and Table 4 confirm EMI support for DDR2 (4-bank architecture) up to 133 MHz, with timing constraints detailed in Section 4.9.