NXP Semiconductors MCIMX355AVM4B

Overview

MCIMX355AVM4B from NXP Semiconductors (formerly Freescale) is an AEC-Q100 Grade 3 automotive application processor based on the ARM1136JF-S core running at 400 MHz, featuring 16-KB L1 instruction and data caches, 128-KB L2 cache, integrated Image Processing Unit (IPU), and dual CAN interfaces. It targets infotainment head units requiring QVGA video decode, WVGA display output, and hands-free telephony support in ambient temperatures from –40 °C to +85 °C.

For engineers reviewing the MCIMX355AVM4B datasheet, MCIMX355AVM4B pinout, MCIMX355AVM4B application, or MCIMX355AVM4B equivalent, key selection criteria include its AEC-Q100 qualification, 17 × 17 mm MAPBGA-5284 package with 0.8 mm pitch, 400 MHz operation, automotive thermal rating, and IPU-accelerated camera/display pipeline for real-time image rotation, scaling, and color space conversion.

Technical Context

The MCIMX355AVM4B implements a hierarchical memory architecture with L1 and unified L2 caches to reduce external bus bandwidth demand, supporting mobile DDR, DDR2, and SDRAM up to 133 MHz alongside NAND/NOR Flash controllers. Its AP domain integrates an ARM1136JF-S core with VFP11 co-processor and ETM debug support, while the shared domain includes Smart DMA (SDMA) for offloading peripheral transfers.

Power management employs clock gating, power gating, and well biasing to suppress subthreshold leakage-enabling operation at 1.22 V internal logic voltage-and supports WAIT/STOP low-power modes managed by the Clock Control Module (CCM). The device uses silicon revision 2.0 and requires ball map Table 94/Table 96 for layout implementation.

Key Specifications

Pinout & Package

MCIMX355AVM4B is housed in a plastic MAPBGA package (Case 5284), 17 mm × 17 mm, 0.8 mm ball pitch, RoHS-compliant and moisture-sensitive level 3 (MSL 3). Ball map corresponds to silicon revision 2.0 per Table 94 (signal assignments) and Table 96 (ball locations).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive application processor applications.

Compared with MCIMX355AVM4B, the MCIMX355AVM5B provides higher clock headroom without layout changes, while MCIMX356AVM4B adds storage interface capability at the cost of slightly higher power and BOM complexity-making MCIMX355AVM4B optimal for cost-sensitive, video-centric automotive UIs without ATA requirements.

Availability

MCIMX355AVM4B is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics gateways requiring stable component supply across extended product lifecycles.

Supply support for MCIMX355AVM4B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in AEC-Q100-qualified processors and edge AI acceleration.

The i.MX35 family was designed specifically for automotive infotainment and navigation systems, emphasizing real-time multimedia processing, functional safety readiness, and integration of camera, display, audio, and vehicle network interfaces in a single SoC.

FAQ

What is the maximum operating frequency of the MCIMX355AVM4B?

The MCIMX355AVM4B is rated for 400 MHz operation across its full industrial temperature range (–40 °C to +85 °C). This speed grade is validated per AEC-Q100 Grade 3 requirements and guarantees compliance with all electrical specifications including cache timing, memory interface setup/hold, and peripheral clock domain synchronization. The MCIMX355AVM4B uses silicon revision 2.0 and must be implemented with ball map Table 94/Table 96.

Does the MCIMX355AVM4B include an integrated graphics accelerator?

Yes, the MCIMX355AVM4B integrates an OpenVG 1.1-compliant 2D graphics processing unit (GPU2D) that accelerates vector-based UI rendering, scalable fonts, and anti-aliased shapes. Unlike the MCIMX351, the MCIMX355AVM4B includes this GPU as part of its multimedia subsystem, enabling smooth animation and responsive touch interfaces without burdening the ARM11 core.

What camera interfaces does the MCIMX355AVM4B support?

The MCIMX355AVM4B supports a parallel camera sensor interface (CSI) with 4/8/10/16-bit data width, capable of 30 Mpixels/s throughput and compatible with YUV, YCC, and RGB color models. It connects directly to automotive CMOS image sensors and feeds video data to the integrated Image Processing Unit (IPU) for hardware-accelerated de-interlacing, color space conversion, and scaling before display or encoding.

Is the MCIMX355AVM4B pin-compatible with other i.MX35 variants?

MCIMX355AVM4B shares the same MAPBGA-5284 package and pinout with MCIMX351AVM4B, MCIMX356AVM4B, and other silicon revision 2.0 parts in the i.MX35 family. However, functional differences exist: MCIMX355AVM4B includes IPU and GPU2D but excludes PATA/CE-ATA interfaces present in MCIMX356AVM4B. Layout reuse is possible only within revision 2.0 devices using Table 94/Table 96 ball maps.

What power management features are implemented in the MCIMX355AVM4B?

The MCIMX355AVM4B implements clock gating, power gating, and well biasing to minimize dynamic and leakage power. It supports WAIT and STOP low-power modes managed by the Clock Control Module (CCM), reduces internal logic voltage to 1.22 V, and achieves >10× subthreshold leakage reduction versus nominal conditions. These features enable compliance with automotive idle-current budgets while maintaining rapid wake-up response for event-driven UI updates.