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NXP Semiconductors MCIMX356AVM4B

Part No.:
MCIMX356AVM4B
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
400-LFBGA
Datasheet:
AetrixMCIMX356AVM4B.pdf
Description:
IC MPU I.MX35 400MHZ 400LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,681

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Product details

Overview

MCIMX356AVM4B from NXP Semiconductors (formerly Freescale) is an AEC-Q100 Grade 3 automotive application processor based on the ARM1136JF-S core operating at 400 MHz, featuring 16 KB L1 instruction cache, 16 KB L1 data cache, 128 KB L2 cache, and integrated Image Processing Unit (IPU) and OpenVG 2D GPU - deployed in infotainment head units for real-time video decode, display control, and hands-free audio processing.

For engineers reviewing the MCIMX356AVM4B datasheet, MCIMX356AVM4B pinout, MCIMX356AVM4B application, or MCIMX356AVM4B equivalent, key selection criteria include its 17 × 17 mm MAPBGA-5284 package, dual CAN 2.0B interfaces, triple UARTs up to 4.0 Mbps, dual SDIO/MMC controllers, and automotive-grade thermal rating (–40 °C to +85 °C).

Technical Context

The MCIMX356AVM4B implements a hierarchical memory architecture with L1/L2 caches and a smart DMA engine (SDMA), enabling concurrent access to DDR2/SDRAM, NAND/NOR Flash, and SRAM without CPU bottlenecks. Its ARM1136JF-S core supports Thumb, Jazelle Java acceleration, and VFP11 floating-point co-processing for real-time multimedia workloads.

Peripherals are partitioned across AP and shared domains: the Application Processor domain hosts IPU, GPU2D, ESAI, and AUDMUX for audio/video pipeline offload; the Shared domain manages FEC Ethernet MAC, eSDHCv2, ASRC, and FlexCAN via SPBA arbitration and SDMA-controlled data movement.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ARM1136JF-S (ARM v6), r1p3 revision - enables Thumb/Jazelle/DSP instruction execution and low-latency interrupt handling for deterministic OS scheduling.
Clock Speed 400 MHz - guaranteed operation across full industrial temperature range (–40 °C to +85 °C) with AEC-Q100 Grade 3 qualification.
Memory Subsystem 16 KB L1 instruction cache + 16 KB L1 data cache + 128 KB unified L2 cache - reduces external bus bandwidth demand and improves cache hit rate for multimedia buffers.
Integrated Accelerators Image Processing Unit (IPU) + OpenVG 2D GPU - hardware-accelerated color space conversion, rotation, scaling, overlay blending, and vector graphics rendering.
Connectivity Interfaces Dual FlexCAN 2.0B, triple UART (up to 4.0 Mbps), dual SDIO/MMC, USB 2.0 OTG + host (480 Mbps), 10/100 Mbps FEC Ethernet - supports vehicle network integration and peripheral expansion.
External Memory Support Mobile DDR, DDR2 (4-bank), SDRAM (up to 133 MHz), SLC/MLC NAND Flash, NOR Flash, SRAM - enables flexible boot and runtime memory architecture for embedded Linux or QNX.
Power Management Multi-level clock gating, power gating, well biasing, and WAIT/STOP low-power modes - reduces subthreshold leakage by ~10× and supports automotive stop-start operation.

Pinout & Package

MCIMX356AVM4B uses a 17 × 17 mm MAPBGA package (Case 5284), 0.8 mm pitch, 361-ball layout (RoHS-compliant, MSL Level 3). Pin assignments follow silicon revision 2.0 ball map (Table 94/96 in MCIMX35SR2AEC Rev. 10).

Pin/Terminal Circuit Role Design Meaning
EXT_ARMCLK External ARM Clock Input Accepts external clock source for ARM domain when internal PLLs are disabled - used in synchronous multi-processor or debug clock alignment scenarios.
USBOH_DP / USBOH_DM USB 2.0 OTG High-Speed Differential Pair Direct connection to USB 2.0 OTG PHY; supports 480 Mbps data transfer and host/peripheral role switching per USB OTG specification.
FEC_TXD0–FEC_TXD3 / FEC_RXD0–FEC_RXD3 Ethernet MAC Data Bus 4-bit transmit/receive data interface for 10/100 Mbps MII - requires external PHY and magnetics for physical layer compliance.
CAN1_TX / CAN1_RX / CAN2_TX / CAN2_RX FlexCAN Controller Signal Pairs Differential signaling pins for two independent CAN 2.0B buses - each pair connects to isolated transceiver for automotive body control or ADAS gateway functions.
SD1_CMD / SD1_CLK / SD1_DATA0–SD1_DATA3 eSDHCv2 Slot 1 Interface Full SDIO/MMC command/data/control signals for primary storage interface - supports SDHC, MMC, CE-ATA, and SDIO wireless modules (Wi-Fi/BT).

Key Features

Feature Design Value
AEC-Q100 Grade 3 Qualification Validated for ambient temperatures from –40 °C to +85 °C - meets automotive infotainment system reliability requirements without derating.
Integrated Image Processing Unit (IPU) Hardware-accelerated camera input preprocessing (YUV/RGB conversion), display postprocessing (deblocking, deringing), and overlay composition - offloads ARM11 core by >70% in video pipeline tasks.
OpenVG 2D Graphics Acceleration GPU2D module compliant with OpenVG 1.1 - renders scalable vector graphics, anti-aliased text, and smooth UI transitions at <10 ms frame latency.
Dual SDIO/MMC + CE-ATA Support Three eSDHCv2 controllers (two SDIO/MMC + one SDIO/CE-ATA) - enables simultaneous SD card logging, internal eMMC boot, and ATA hard drive media storage.
Asynchronous Sample Rate Converter (ASRC) Supports concurrent conversion of up to 8 audio channels with –120 dB THD+N - eliminates clock domain mismatches between Bluetooth, USB audio, and analog codecs.

Applications

Automotive Infotainment Head Unit ADAS Video Gateway

Use Scenario: Central touchscreen unit integrating navigation, media playback, Bluetooth telephony, and rear-view camera display in passenger vehicles.

IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX OS, managing HDMI/LVDS display output, decoding MP4/H.264 video, and coordinating audio routing via ESAI/AUDMUX.

Use Value: IPU handles real-time YUV-to-RGB conversion and camera sensor framing at 30 fps; GPU2D renders responsive GUI overlays without CPU load.

Use Scenario: In-vehicle video aggregator receiving feeds from surround-view cameras and forwarding processed streams to instrument cluster or HUD.

IC Role / Device Role / Timing Role: Video preprocessing node performing geometric correction, stitching, and dynamic contrast enhancement before encoding or display.

Use Value: Dedicated IPU hardware processes four 720p camera inputs concurrently with <50 ms end-to-end latency - meets ISO 26262 ASIL-B timing constraints.

Telematics Control Unit (TCU) Connected Rear-Seat Entertainment

Use Scenario: Cellular-connected module providing remote diagnostics, OTA updates, emergency call (eCall), and vehicle data logging via CAN/FlexRay gateways.

IC Role / Device Role / Timing Role: Host controller interfacing with LTE modem over USB/UART, parsing CAN bus messages via dual FlexCAN, and storing logs in NAND Flash.

Use Value: Dual CAN controllers enable simultaneous access to powertrain and chassis networks; eSDHCv2 supports secure firmware update storage with hardware encryption keys in IIM fuses.

Use Scenario: Multi-screen entertainment system delivering streaming video, gaming, and web browsing to rear-seat passengers via Wi-Fi or HDMI.

IC Role / Device Role / Timing Role: Media application processor driving dual LVDS displays, decoding HD video via IPU-assisted pipeline, and managing USB peripherals (keyboards, gamepads).

Use Value: 400 MHz ARM1136JF-S core with VFP11 executes Android-based UI smoothly; ASRC synchronizes audio from multiple sources (Bluetooth headset, HDMI ARC, local speakers).

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive application processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX355AVM4B Same ARM1136JF-S core, identical package and pinout, but lacks OpenVG GPU2D and PATA interface - no 2D graphics acceleration or IDE hard drive support. Suitable for cost-sensitive infotainment systems requiring only basic UI and no vector graphics rendering. Select MCIMX355AVM4B only if GPU2D and PATA are unused; otherwise MCIMX356AVM4B provides broader peripheral coverage.
MCIMX356AVM5B Identical feature set and pinout, but rated for 532 MHz operation - delivers ~33% higher CPU throughput and improved multimedia decode performance at same voltage/temperature. Preferred for high-resolution video playback (WVGA+), complex OpenGL ES UIs, or multi-tasking environments where 400 MHz is insufficient. MCIMX356AVM5B is drop-in compatible and meets all MCIMX356AVM4B specifications - upgrade path requires no PCB changes.

Compared with MCIMX355AVM4B, MCIMX356AVM4B adds GPU2D and PATA for richer UI and storage flexibility; compared with MCIMX356AVM5B, it trades 132 MHz clock headroom for lower power consumption and thermal margin in thermally constrained enclosures.

Availability

MCIMX356AVM4B is available at Aetrix Electronics and suitable for automotive infotainment head units, ADAS video gateways, and telematics control units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for MCIMX356AVM4B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in MCU, RF, and automotive processors.

The i.MX35 family - including MCIMX356AVM4B - was designed specifically for automotive infotainment and navigation systems, emphasizing AEC-Q100 qualification, multimedia acceleration, and robust peripheral integration for harsh-temperature vehicle environments.

FAQ

What is the maximum operating frequency of the MCIMX356AVM4B?

The MCIMX356AVM4B is rated for 400 MHz operation across its full AEC-Q100 Grade 3 temperature range (–40 °C to +85 °C). It shares the same silicon revision 2.0 and package as the 532 MHz MCIMX356AVM5B variant, but is binned and tested to guarantee stable 400 MHz performance with lower power and thermal requirements. The ARM1136JF-S core remains fully functional at this speed with all caches, VFP11, and accelerators enabled.

Does the MCIMX356AVM4B support automotive-grade CAN communication?

Yes, the MCIMX356AVM4B integrates two FlexCAN 2.0B controllers compliant with ISO 11898-1, supporting bit rates up to 1 Mbps and message filtering for automotive body control and powertrain networks. Each CAN interface uses dedicated TX/RX pins (CAN1_TX/CAN1_RX and CAN2_TX/CAN2_RX) and supports loopback, self-test, and error confinement modes required for ASIL-B systems. External CAN transceivers must be used for physical layer compliance.

What video decode and display capabilities does the MCIMX356AVM4B provide?

The MCIMX356AVM4B supports QVGA video decode and WVGA display output via its integrated Image Processing Unit (IPU) and parallel display interface. The IPU handles H.264/MPEG-4 ASP decode acceleration, color space conversion (YUV to RGB), scaling, rotation, and overlay blending at up to 30 Mpixels/s. Primary display supports up to 1024 × 1024 resolution at 24-bit color depth over parallel RGB interface - sufficient for 7-inch WVGA dash displays or rear-seat monitors.

Is the MCIMX356AVM4B pin-compatible with other i.MX35 variants?

MCIMX356AVM4B is pin-compatible with all i.MX35 parts using Case 5284 (17 × 17 mm MAPBGA) and silicon revision 2.0, including MCIMX351AVM4B, MCIMX355AVM4B, and MCIMX356AVM5B. However, ball maps differ between revision 2.0 and 2.1 (e.g., MCIMX356AJQ4C), so layout reuse requires verification against Table 94/96 in MCIMX35SR2AEC Rev. 10. Functionally, MCIMX356AVM4B enables GPU2D and PATA - features absent in MCIMX351/355.

What external memory types does the MCIMX356AVM4B support?

The MCIMX356AVM4B supports SDRAM (up to 133 MHz), mobile DDR, DDR2 (4-bank architecture), SLC/MLC NAND Flash, NOR Flash, and SRAM via its External Memory Interface (EMI). The EMI includes dedicated controllers: SDRAM CTRL for DRAM, NANDFC for NAND Flash, and WEIM for NOR/PSRAM. This enables flexible boot configurations - e.g., NAND Flash for kernel/initramfs, DDR2 for runtime memory, and NOR for secure firmware storage - all accessible simultaneously.

MCIMX356AVM4B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
400-LFBGA
Series:
i.MX35
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM1136JF-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, KPP, LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Security Features:
Secure Fusebox, Secure JTAG
Mounting Type:
Surface Mount
Supplier Device Package:
400-LFBGA (17x17)
Additional Interfaces:
1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART

MCIMX356AVM4B FAQ

1.How can I place an order for MCIMX356AVM4B through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX356AVM4B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX356AVM4B reliable?

The price and inventory of MCIMX356AVM4B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX356AVM4B is usually 5 days.

3.What payment methods are accepted for MCIMX356AVM4B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX356AVM4B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX356AVM4B?

MCIMX356AVM4B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX356AVM4B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX356AVM4B?

For technical support, including MCIMX356AVM4B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX356AVM4B requirements.

6.How does Aetrix verify that MCIMX356AVM4B is sourced from the original manufacturer or authorized distributors?

All MCIMX356AVM4B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX356AVM4B meets industry standards.

7.What is the process for return or replacement of MCIMX356AVM4B?

All MCIMX356AVM4B units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX356AVM4B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX356AVM4B part is unused and in its original packaging.

Return procedure for MCIMX356AVM4B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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