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NXP Semiconductors MCIMX503CVM8BR2
- Part No.:
- MCIMX503CVM8BR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX503CVM8BR2.pdf
- Description:
- IC MPU I.MX50 800MHZ 400LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,765
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Product details
Overview
MCIMX503CVM8BR2 from NXP Semiconductors (formerly Freescale) is an ARM Cortex-A8-based applications processor operating at 800 MHz, designed for portable multimedia systems with integrated 2D graphics acceleration (200 Mpix/s), ePXP pixel processing pipeline, and DDR2/LPDDR2/LPDDR1 memory support up to 266 MHz. It omits the electrophoretic display controller (EPDC) but retains full eLCDIF, USB OTG/host, FEC Ethernet, and SD/MMC interfaces - deployed in industrial HMI and ruggedized media terminals.
For engineers reviewing the MCIMX503CVM8BR2 datasheet, MCIMX503CVM8BR2 pinout, MCIMX503CVM8BR2 application, or MCIMX503CVM8BR2 equivalent, key selection criteria include its 400-pin MAPBGA package (17 × 17 mm, 0.8 mm pitch), absence of EPDC hardware, dual USB PHY integration, 256 KB L2 cache, and temperature range (–20°C to +70°C ambient).
Technical Context
The MCIMX503CVM8BR2 implements a 64-bit AXI fabric (266 MHz) as its central interconnect, arbitrating between ARM CPU, ePXP, eLCDIF, GPU2D, SDMA, FEC, and DCP crypto engine. Its memory subsystem includes 32 KB L1 instruction and data caches, unified 256 KB L2 cache, 128 KB on-chip RAM, and boot ROM with High-Assurance Boot 4 (HAB4) support.
Power management relies on Smart Speed™ technology with dynamic voltage and frequency scaling (DVFS), state-retention power gating (SRPG) for ARM/NEON, and four independent PLLs - one dedicated to display clocking with eight controllable outputs. Security features include Secure JTAG Controller (SJC), tamper-resistant SRTC, and AES encryption/decryption acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 with NEON SIMD and VFPv3 coprocessors - enables real-time audio/video decode and floating-point intensive UI rendering. |
| Max Core Frequency | 800 MHz - fixed operational ceiling; no 1 GHz capability unlike MCIMX508 variants. |
| L2 Cache | 256 KB unified - reduces external memory bandwidth demand and improves deterministic latency for multimedia pipelines. |
| Graphics Acceleration | GPU2Dv1 @ 200 Mpix/s, OpenVG 1.1 compliant - offloads 2D compositing, scaling, and alpha blending from CPU. |
| Display Interfaces | eLCDIF supporting SXGA+ (1400 × 1050 @ 60 Hz) with up to 32-bit interface - enables high-resolution color LCDs without external TCON. |
| Memory Support | 16/32-bit DDR2-533, LPDDR2-533, LPDDR1-400 (up to 2 GB total) - allows flexible trade-offs between bandwidth, power, and cost in battery-powered designs. |
| Security Features | HAB4 with SHA-256, 2048-bit RSA, version control, and secure boot enforcement - ensures firmware authenticity and prevents unauthorized code execution. |
Pinout & Package
MCIMX503CVM8BR2 uses the 400-pin MAPBGA package (Case 400), 17 × 17 mm body size, 0.8 mm ball pitch, RoHS-compliant and lead-free, MSL3. This package removes DRAM_SDCLK_1, DRAM_SDCLK_1_B, DRAM_A14, DRAM_SDODT1, UART2_CTS, and UART2_RTS versus the 416-pin variant - enabling simplified routing for non-DRAM-intensive applications while isolating USB VDDA25/VDDA33 supplies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.0–1.3 V supply rail; requires tight regulation and low-noise filtering for stable 800 MHz operation. |
| VDD_SOC | SoC Logic Power Supply | 1.0–1.3 V domain powering L2 cache, AXI fabric, and peripheral logic - shared with GPU2D and ePXP. |
| VDD_DRAM | DRAM I/O Power | 1.2 V supply for DDR2/LPDDR2 interface - decoupled from core rails to minimize noise coupling into memory subsystem. |
| USB_OTG_VDDA25 | USB OTG Analog 2.5 V | Dedicated 2.5 V analog supply for USB OTG PHY - independent from USB_H1_VDDA25 in this 400-pin package. |
| USB_H1_VDDA33 | USB Host Analog 3.3 V | Dedicated 3.3 V analog supply for USB host PHY - not shorted to OTG supply, enabling independent power sequencing. |
| BOOT_MODE[1:0] | Boot Configuration Pins | Strapped at power-up to select boot source (eMMC, NAND, NOR, or SPI); determines initial vector fetch location and HAB4 enforcement behavior. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage/Frequency Scaling (DVFS) | Reduces core voltage and clock during audio playback or idle states - cuts active power by up to 40% versus fixed-frequency operation. |
| ePXP Pixel Processing Pipeline | Performs real-time color-space conversion, gamma correction, and rotation at 1 pixel/clock - eliminates CPU overhead for display preprocessing in e-paper and LCD systems. |
| Smart DMA (SDMA) Controller | Programmable microcoded DMA engine handling memory-to-peripheral transfers - relieves ARM core from high-bandwidth data movement (e.g., camera sensor → frame buffer). |
| Quality of Service Controller (QoSC) | Hardware-dynamic priority arbitration for eLCDIF and EPDC - guarantees display refresh deadlines even under heavy system load (not applicable to MCIMX503 due to EPDC removal, but QoSC remains active for eLCDIF). |
| Secure Real-Time Clock (SRTC) | Tamper-resistant RTC with dedicated power domain and glitch detection - maintains time integrity across power cycles and physical attacks in industrial logging devices. |
Applications
| Industrial HMI Terminal | Rugged Media Player |
|---|---|
Use Scenario: Touch-enabled panel PC in factory automation, operating continuously in –20°C to +70°C environments with vibration and EMI exposure. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI stack, driving 1024×768 LCD via eLCDIF, managing CAN/Ethernet fieldbus communication, and handling encrypted firmware updates. Use Value: 256 KB L2 cache and DVFS enable responsive GUI with <50 ms touch-to-display latency; HAB4 ensures only signed firmware executes after cold boot. | Use Scenario: Portable digital signage unit powered by Li-ion battery, displaying video ads and static content on 1280×800 TFT-LCD with auto-brightness control. IC Role / Device Role / Timing Role: Multimedia SoC running Android or Yocto, decoding H.264 video via NEON-accelerated codecs, buffering frames in LPDDR2, and synchronizing display output using ePXP + eLCDIF pipeline. Use Value: GPU2Dv1 renders layered UI elements at 200 Mpix/s while NEON handles 1080p decode at <300 mW - extending battery life beyond 6 hours. |
| Secure Field Gateway | Medical Data Logger |
Use Scenario: Edge gateway aggregating BLE/Wi-Fi sensor data, performing local analytics, and forwarding to cloud via TLS-secured Ethernet. IC Role / Device Role / Timing Role: Trusted execution environment host with SRTC timestamping, AES-256 encryption of sensor payloads, and FEC Ethernet MAC with IEEE 1588 timestamping support. Use Value: On-chip crypto accelerators reduce encryption latency by 8× vs software-only; HAB4 prevents malicious firmware injection during remote OTA updates. | Use Scenario: Battery-powered patient monitor recording ECG waveforms, storing annotated data on eMMC, and displaying real-time traces on monochrome LCD. IC Role / Device Role / Timing Role: Low-power applications processor managing ADC sampling via SDMA, compressing waveform data with NEON, and updating grayscale display using ePXP-enhanced dithering. Use Value: Smart Speed™ and SRPG cut standby current to <15 µA; ePXP's grayscale optimization enables sharp 16-level contrast on passive matrix LCD without external frame buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX503CVK8B | Same 800 MHz ARM Cortex-A8 core, identical feature set (no EPDC), but in 416-pin MAPBGA (13 × 13 mm, 0.5 mm pitch). | Higher pin density, shorter trace lengths, tighter layout - suited for space-constrained portable designs; lacks UART2_CTS/RTS and DRAM_A14 pins present in 400-pin variant. | Select MCIMX503CVK8B when PCB area is critical and USB supply isolation is not required; verify DRAM interface compatibility with reduced pin count. |
| MCIMX502CVM8B | Removes both GPU2D and EPDC blocks; otherwise identical package, clock, memory, and peripheral support. | Targeted at ultra-low-cost UI-less embedded controllers where graphics acceleration is unnecessary - e.g., headless gateways or sensor concentrators. | Choose MCIMX502CVM8B only if 2D graphics rendering is omitted from software stack; note loss of OpenVG 1.1 compliance and 200 Mpix/s throughput. |
Compared with MCIMX503CVM8BR2, MCIMX503CVK8B offers identical functionality in a smaller footprint but sacrifices USB supply independence and two UART handshaking signals; MCIMX502CVM8B further reduces BOM cost by eliminating GPU2D, making it suitable only for non-graphical applications where display rendering is handled externally or omitted entirely.
Availability
MCIMX503CVM8BR2 is available at Aetrix Electronics and suitable for industrial HMI terminals, rugged media players, secure field gateways, and medical data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX503CVM8BR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and edge AI acceleration.
The i.MX50 family - including MCIMX503CVM8BR2 - was engineered for high-performance, low-power portable multimedia systems, emphasizing energy efficiency, rich display capabilities, and hardware-enforced security for consumer and industrial edge devices.
FAQ
What is the maximum operating frequency of the MCIMX503CVM8BR2?
The MCIMX503CVM8BR2 operates at a fixed maximum core frequency of 800 MHz. Unlike the MCIMX508 series, it does not support 1 GHz operation. This frequency is guaranteed across its specified ambient temperature range of –20°C to +70°C and junction temperature range of –20°C to +90°C, with appropriate thermal design and power supply regulation.
Does the MCIMX503CVM8BR2 include an electrophoretic display controller (EPDC)?
No, the MCIMX503CVM8BR2 explicitly excludes the EPDC hardware block. Per the i.MX50 Part Number Feature Comparison table, MCIMX503 variants disable EPDC while retaining full eLCDIF, ePXP, and GPU2D functionality. The EPDC-related pins remain physically present on the 400-pin MAPBGA package but are disabled and must be configured to alternate IOMUX modes.
Which memory types does the MCIMX503CVM8BR2 support?
The MCIMX503CVM8BR2 supports DDR2-533, LPDDR2-533, and LPDDR1-400 DRAM (up to 2 GB total), plus NAND Flash (SLC/MLC with 32-bit ECC), NOR Flash, PSRAM, Cellular RAM, and managed NAND including eMMC up to revision 4.4. Its DRAM controller operates at up to 266 MHz with a 32-bit interface, and memory timing parameters are fully specified in Section 4.8 of the IMX50CEC datasheet.
What security features are implemented in the MCIMX503CVM8BR2?
The MCIMX503CVM8BR2 integrates High-Assurance Boot 4 (HAB4) with SHA-256 hashing and 2048-bit RSA signature verification, Secure JTAG Controller (SJC) to prevent debug port abuse, tamper-resistant Secure RTC (SRTC), and hardware AES encryption/decryption acceleration. These features are active and functional regardless of EPDC or GPU2D presence, and are documented in Sections 1.1.8 and 4.2 of the IMX50CEC datasheet.
Is the MCIMX503CVM8BR2 pin-compatible with other i.MX50 packages?
The MCIMX503CVM8BR2 uses the 400-pin MAPBGA package (17 × 17 mm, 0.8 mm pitch), which shares the same ball map and IOMUX configuration as the MCIMX508 series but differs electrically from the 416-pin variants: USB_OTG_VDDA25 and USB_H1_VDDA25 are independent (not shorted), and pins DRAM_SDCLK_1, DRAM_A14, UART2_CTS, and UART2_RTS are removed. It is not pin-compatible with 416-pin MAPBGA or PoPBGA packages.
MCIMX503CVM8BR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX50
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, LPDDR2, DDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.2V, 1.875V, 2.775V, 3.0V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, Secure JTAG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-LFBGA (17x17)
- Additional Interfaces:
- 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
MCIMX503CVM8BR2 FAQ
1.How can I place an order for MCIMX503CVM8BR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX503CVM8BR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX503CVM8BR2 reliable?
The price and inventory of MCIMX503CVM8BR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX503CVM8BR2 is usually 5 days.
3.What payment methods are accepted for MCIMX503CVM8BR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX503CVM8BR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX503CVM8BR2?
MCIMX503CVM8BR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX503CVM8BR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX503CVM8BR2?
For technical support, including MCIMX503CVM8BR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX503CVM8BR2 requirements.
6.How does Aetrix verify that MCIMX503CVM8BR2 is sourced from the original manufacturer or authorized distributors?
All MCIMX503CVM8BR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX503CVM8BR2 meets industry standards.
7.What is the process for return or replacement of MCIMX503CVM8BR2?
All MCIMX503CVM8BR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX503CVM8BR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX503CVM8BR2 part is unused and in its original packaging.
Return procedure for MCIMX503CVM8BR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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