NXP Semiconductors MCIMX507CVK8BR2
- Part No.:
- MCIMX507CVK8BR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 416-LFBGA
- Datasheet:
-
MCIMX507CVK8BR2.pdf
- Description:
- IC MPU I.MX50 800MHZ 416MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,009
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX507CVK8BR2 from NXP Semiconductors (formerly Freescale) is an ARM Cortex-A8-based applications processor operating at 800 MHz, featuring no GPU and no electrophoretic display controller (EPDC), in a 416-pin MAPBGA package (13 × 13 mm, 0.5 mm pitch). It integrates 32 KB L1 instruction cache, 32 KB L1 data cache, 256 KB unified L2 cache, and supports DDR2/LPDDR2/LPDDR1 DRAM up to 266 MHz - optimized for power-constrained portable multimedia devices requiring rich peripheral connectivity without graphics or e-paper display acceleration.
For engineers reviewing the MCIMX507CVK8BR2 datasheet, MCIMX507CVK8BR2 pinout, MCIMX507CVK8BR2 application, or MCIMX507CVK8BR2 equivalent, key selection criteria include its 800 MHz CPU frequency, absence of GPU/EPDC blocks, 416-pin 13×13 mm MAPBGA footprint, dual USB 2.0 PHYs (OTG + host), 10/100 Ethernet controller, and support for eMMC 4.4 via eSDHCv3-3 - all critical for embedded HMI, industrial tablets, and connected media gateways.
Technical Context
The MCIMX507CVK8BR2 implements Freescale's Smart Speed™ technology with dynamic voltage and frequency scaling (DVFS) and state-retention power gating (SRPG) for ARM core and NEON, enabling low-power operation across active and multiple sleep modes. Its AXI fabric operates at 266 MHz, arbitrating access among CPU, ePXP, SDMA, FEC, and GPU2D (disabled in this variant), while the MAX AHB crossbar at 133 MHz routes peripherals including UARTs, I²C, SPI, and PWM.
Memory subsystem includes boot ROM (96 KB with HAB4), on-chip RAM (128 KB), and external interfaces supporting up to 2 GB DDR2/LPDDR2/LPDDR1, NAND Flash with 32-bit ECC, NOR Flash, PSRAM, and eMMC 4.4. Security is enforced via High-Assurance Boot 4 (SHA-256, 2048-bit RSA), Secure JTAG Controller (SJC), and tamper-resistant SRTC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8 @ 800 MHz - delivers deterministic real-time performance for Linux-based embedded applications with NEON SIMD and VFPv3 floating-point support. |
| L1 Cache | 32 KB instruction + 32 KB data - reduces memory latency for instruction fetch and data load/store in high-throughput multimedia workloads. |
| L2 Cache | 256 KB unified - improves cache coherency and bandwidth efficiency across CPU, ePXP, and DMA engines. |
| DRAM Support | DDR2-533 / LPDDR2-533 / LPDDR1-400 - enables flexible memory selection balancing cost, density, and power for battery-operated systems. |
| USB Interfaces | 1× HS USB 2.0 OTG + 1× HS USB 2.0 host - provides dual-role connectivity for peripheral attachment and device hosting without external transceivers. |
| Ethernet | IEEE 802.3 10/100 Mbps FEC controller - integrates MAC layer with external PHY interface for wired network integration in industrial gateways. |
| eMMC Support | eSDHCv3-3 compliant (eMMC 4.4, 832 Mbps) - enables high-speed managed NAND storage with DDR mode and 8-bit bus for local firmware and OS image storage. |
Pinout & Package
MCIMX507CVK8BR2 uses a 416-ball MAPBGA package (Case 416, 13 × 13 mm, 0.5 mm pitch), RoHS-compliant and MSL Level 3. Ball assignments follow the i.MX50 family pinout with shared I/O multiplexing; USB_OTG_VDDA25 and USB_H1_VDDA25 are shorted on-package, as are USB_OTG_VDDA33 and USB_H1_VDDA33.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | VDD_ARM | Core supply (1.2 V) for ARM Cortex-A8 and NEON - requires low-noise regulation and local decoupling. |
| B2 | VDD_SOC | System logic supply (1.1–1.3 V) powering L2 cache, AXI fabric, and peripheral controllers. |
| D3 | USB_OTG_DP | Differential data+ for integrated USB 2.0 OTG PHY - routed with controlled impedance (90 Ω differential) to connector. |
| E4 | USB_OTG_DM | Differential data− for integrated USB 2.0 OTG PHY - matched length and spacing to USB_OTG_DP required. |
| H1 | FEC_TXD0 | Fast Ethernet transmit data bit 0 - part of 4-bit TX data bus driving external PHY in MII/RMII mode. |
| J2 | SD3_CMD | eMMC 4.4 command line for eSDHCv3-3 port - supports open-drain pull-up and high-speed timing compliance. |
| K3 | SD3_CLK | eMMC 4.4 clock input (up to 208 MHz DDR) - requires tight skew control relative to SD3_DATA[7:0]. |
| M5 | UART1_RX | Asynchronous receive input for primary debug/console UART - supports up to 4 Mbps with hardware flow control. |
Key Features
| Feature | Design Value |
|---|---|
| No GPU / No EPDC | Reduces die area and power consumption by disabling 2D graphics accelerator and electrophoretic display controller - ideal for non-graphical or LCD-only HMI applications. |
| Dual USB 2.0 PHYs | Integrated OTG and host PHYs eliminate external transceivers, reducing BOM cost and PCB space while supporting simultaneous device/host roles. |
| eSDHCv3-3 (eMMC 4.4) | Enables 832 Mbps DDR transfer rate on SD3 port - supports reliable, high-bandwidth local storage for firmware updates and application data logging. |
| HAB4 Secure Boot | Hardware-enforced authentication using SHA-256 and 2048-bit RSA keys - prevents unauthorized firmware execution and ensures supply-chain integrity. |
| Smart Speed™ DVFS | Dynamic voltage/frequency scaling adapts core voltage and clock to workload - extends battery life in portable devices during audio decode or idle states. |
Applications
| Industrial HMI Terminal | Connected Media Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface in factory automation panels with real-time status display and local data logging. IC Role / Device Role / Timing Role: Main application processor executing Linux RTOS, managing UART/RS232 fieldbus communication, and driving 1080p LCD via eLCDIF. Use Value: 800 MHz Cortex-A8 with 256 KB L2 cache ensures responsive GUI rendering and deterministic I/O handling without GPU overhead. | Use Scenario: Residential gateway aggregating Zigbee, Bluetooth LE, and Wi-Fi traffic while bridging to Ethernet backbone. IC Role / Device Role / Timing Role: Central protocol translator and packet router with FEC Ethernet MAC, dual USB for dongle support, and eMMC for OTA update storage. Use Value: Integrated eSDHCv3-3 and dual USB 2.0 PHYs enable concurrent firmware updates and peripheral expansion without external controllers. |
| Portable Diagnostic Device | Secure IoT Edge Node |
Use Scenario: Handheld medical instrument capturing sensor data, performing local analysis, and uploading results via Ethernet or USB. IC Role / Device Role / Timing Role: Real-time data acquisition host interfacing with ADCs via SPI/I²C, running secure Linux with encrypted storage. Use Value: HAB4 boot and on-chip AES engine ensure firmware authenticity and patient data confidentiality per HIPAA requirements. | Use Scenario: Tamper-evident environmental monitor deployed in remote infrastructure with signed firmware and secure timekeeping. IC Role / Device Role / Timing Role: Trusted execution environment leveraging SRTC, Secure JTAG, and fuse-programmable security keys. Use Value: Tamper-resistant RTC and voltage/clock glitch detection prevent clock manipulation attacks on time-stamped sensor logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX507CVM8BR2 | Same 800 MHz CPU, no GPU/no EPDC, but in 400-pin MAPBGA (17 × 17 mm, 0.8 mm pitch) - independent USB VDDA rails, no DRAM address pin shorting. | Preferred for designs requiring higher I/O count, thermal margin, or board-level flexibility in routing USB power domains. | Select when PCB layout benefits from larger pitch, lower ball density, or need for isolated USB analog supplies. |
| MCIMX503CVK8BR2 | Same 800 MHz CPU and 416-pin MAPBGA, but retains EPDC block - adds direct-drive e-paper panel support. | Suitable for e-reader, shelf-label, or low-power signage where grayscale electrophoretic displays are required. | Choose only if EPDC functionality is needed; otherwise MCIMX507CVK8BR2 offers identical footprint with lower cost and power. |
Compared with MCIMX507CVM8BR2, MCIMX507CVK8BR2 offers tighter board space utilization and simplified USB power routing due to internal VDDA shorting, while MCIMX503CVK8BR2 adds EPDC capability at same package - making MCIMX507CVK8BR2 optimal for LCD-centric, cost-sensitive embedded applications without e-paper or large-footprint constraints.
Availability
MCIMX507CVK8BR2 is available at Aetrix Electronics and suitable for industrial HMI terminals, connected media gateways, portable diagnostic devices, and secure IoT edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MCIMX507CVK8BR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and communication infrastructure markets, with deep expertise in ARM-based application processors and edge AI.
The i.MX50 product line was designed to deliver high-performance, energy-efficient processing for portable consumer and industrial multimedia applications - emphasizing low-power operation, rich peripheral integration, and hardware-accelerated display and security functions.
FAQ
What is the maximum operating frequency of the MCIMX507CVK8BR2?
The MCIMX507CVK8BR2 operates at a maximum ARM Cortex-A8 core frequency of 800 MHz. This is confirmed in Table 1 of the IMX50CEC datasheet (Rev. 7), which lists "800 MHz" under Maximum ARM CLK Frequency for part number MCIMX507CVK8B - the base variant of MCIMX507CVK8BR2. The R2 suffix denotes tape-and-reel packaging; electrical and timing specifications remain identical to MCIMX507CVK8B.
Does the MCIMX507CVK8BR2 include a GPU or electrophoretic display controller?
No, the MCIMX507CVK8BR2 explicitly excludes both the GPU2D graphics accelerator and the EPDC (electrophoretic display controller). As stated in Table 2 (Part Number Feature Comparison) of the IMX50CEC datasheet, "MCIMX507" has "GPU" listed under Disabled Features. Similarly, Table 4 confirms EPDC is absent in MCIMX507 variants. This distinguishes MCIMX507CVK8BR2 from MCIMX508 and enables lower power and cost for LCD-only or non-graphical applications.
What package type and pin count does the MCIMX507CVK8BR2 use?
The MCIMX507CVK8BR2 uses a 416-ball MAPBGA package (Case 416) measuring 13 × 13 mm with 0.5 mm pitch. This is specified in Table 1 (Ordering Information) and Section 5.1 (13 × 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package Information) of the IMX50CEC datasheet. The "VK" in the part number directly encodes this 416-pin MAPBGA configuration, distinguishing it from "VM" (400-pin) and "ZK" (PoPBGA) variants.
Which memory types does the MCIMX507CVK8BR2 support?
The MCIMX507CVK8BR2 supports DDR2-533, LPDDR2-533, and LPDDR1-400 DRAM up to 2 GB total capacity, plus NAND Flash (SLC/MLC) with 32-bit ECC, NOR Flash, PSRAM, Cellular RAM, and managed NAND including eMMC 4.4. These capabilities are documented in Sections 1.1.5 (Multilevel Memory System) and Table 4 (Modules List) of the IMX50CEC datasheet, with eSDHCv3-3 specifically enabling eMMC 4.4 compliance on SD3 port.
What security features are implemented in the MCIMX507CVK8BR2?
The MCIMX507CVK8BR2 implements High-Assurance Boot 4 (HAB4) with SHA-256 hashing and 2048-bit RSA signature verification, Secure JTAG Controller (SJC) to restrict debug access, and a tamper-resistant Secure RTC (SRTC) with voltage/clock glitch detection. These are detailed in Sections 1.1.8 (Advanced Security) and Table 4 (Modules List) of the IMX50CEC datasheet. All security blocks are fully functional in MCIMX507CVK8BR2 - GPU/EPDC removal does not affect cryptographic or boot integrity features.
MCIMX507CVK8BR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-LFBGA
- Series:
- i.MX50
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, LPDDR2, DDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.2V, 1.875V, 2.775V, 3.0V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, Secure JTAG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 416-MAPBGA (13x13)
- Additional Interfaces:
- 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
MCIMX507CVK8BR2 FAQ
1.How can I place an order for MCIMX507CVK8BR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX507CVK8BR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX507CVK8BR2 reliable?
The price and inventory of MCIMX507CVK8BR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX507CVK8BR2 is usually 5 days.
3.What payment methods are accepted for MCIMX507CVK8BR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX507CVK8BR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX507CVK8BR2?
MCIMX507CVK8BR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX507CVK8BR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX507CVK8BR2?
For technical support, including MCIMX507CVK8BR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX507CVK8BR2 requirements.
6.How does Aetrix verify that MCIMX507CVK8BR2 is sourced from the original manufacturer or authorized distributors?
All MCIMX507CVK8BR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX507CVK8BR2 meets industry standards.
7.What is the process for return or replacement of MCIMX507CVK8BR2?
All MCIMX507CVK8BR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX507CVK8BR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX507CVK8BR2 part is unused and in its original packaging.
Return procedure for MCIMX507CVK8BR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX507CVK8BR2 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

