NXP Semiconductors MCIMX507CVM1B
- Part No.:
- MCIMX507CVM1B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX507CVM1B.pdf
- Description:
- IC MPU I.MX50 800MHZ 400LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX507CVM1B from NXP Semiconductors (formerly Freescale) is a 1 GHz ARM Cortex-A8 applications processor optimized for portable multimedia systems with no integrated GPU. It features 256 KB L2 cache, support for DDR2/LPDDR2/LPDDR1 up to 266 MHz, and integrated ePXP pixel processing pipeline. It targets low-power consumer electronics requiring high-performance display control without graphics acceleration.
For engineers reviewing the MCIMX507CVM1B datasheet, MCIMX507CVM1B pinout, MCIMX507CVM1B application, or MCIMX507CVM1B equivalent, key selection criteria include its 17×17 mm 400-pin MAPBGA package, absence of GPU and EPDC blocks, operation in 0–70°C ambient, and compatibility with i.MX50 family I/O multiplexing and power management architecture.
Technical Context
The MCIMX507CVM1B implements Freescale's Smart Speed™ technology with dynamic voltage and frequency scaling (DVFS), enabling efficient operation across audio decode, UI rendering, and video playback workloads. Its AXI-based 64-bit system fabric operates at 266 MHz and integrates dedicated hardware accelerators including ePXP (1 pixel/clock) and SDMA for offloading pixel and data movement tasks.
It uses a multilevel memory hierarchy comprising 32 KB L1 instruction and data caches, 256 KB unified L2 cache, on-chip ROM (96 KB with HAB4), and 128 KB OCRAM. External memory support includes 16/32-bit DDR2-533, LPDDR2-533, LPDDR1-400 (up to 2 GB), NAND Flash with 32-bit ECC, and eMMC 4.4 via eSDHCv3-3 port.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 with NEON SIMD and VFPv3 coprocessors - enables efficient media decoding and floating-point computation without CPU overhead. |
| Max Core Frequency | 1 GHz - delivers high single-thread performance for real-time OS execution and application responsiveness. |
| L2 Cache | 256 KB unified - reduces memory latency and improves throughput for burst-intensive multimedia pipelines. |
| DRAM Support | DDR2/LPDDR2/LPDDR1 up to 266 MHz - allows flexible trade-offs between bandwidth, power, and cost in battery-powered designs. |
| Display Acceleration | ePXP pixel processor (1 px/clock) - handles color-space conversion, alpha blending, gamma mapping, and rotation in hardware for LCD/e-paper displays. |
| Security Features | HAB4 boot authentication, AES encryption, on-chip fuses - provides secure firmware loading and tamper-resistant storage for trusted applications. |
| Package | 400-pin MAPBGA, 17×17 mm, 0.8 mm pitch - supports higher I/O count and improved thermal dissipation vs. smaller BGA variants. |
Pinout & Package
MCIMX507CVM1B is housed in a 17×17 mm, 0.8 mm pitch, 400-ball MAPBGA package (Case 400). This package removes DRAM_SDCLK_1, DRAM_SDCLK_1_B, DRAM_A14, DRAM_SDODT1, UART2_CTS, and UART2_RTS versus the 416-pin variant, and provides independent USB OTG/host analog supplies (USB_OTG_VDDA25/33 and USB_H1_VDDA25/33).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.0–1.3 V supply for Cortex-A8 core - requires tight regulation and low-noise filtering for stable 1 GHz operation. |
| VDD_SOC | SoC Logic Power Supply | 1.0–1.3 V supply for L2 cache, interconnect, and peripheral logic - shared rail with ARM core in many designs. |
| VDD_DRAM | DRAM Controller Power | 1.2 V supply for DDR2/LPDDR2 interface - must meet JEDEC timing specs for reliable high-speed memory access. |
| BOOT_MODE[1:0] | Boot Configuration Pins | Determines boot source (NAND, eMMC, SPI NOR) at reset - pulled high/low via external resistors to configure initial firmware load path. |
| USB_OTG_ID | OTG Role Detection | Identifies host/peripheral role in USB OTG mode - used with internal comparator to enable dual-role functionality without external switch. |
Key Features
| Feature | Design Value |
|---|---|
| No GPU integration | Reduces die area and power consumption by ~150 mW typical - enables longer battery life in display-centric but non-graphics-heavy applications. |
| ePXP pixel accelerator | Hardware-accelerated color-space conversion and alpha blending - eliminates CPU cycles for UI compositing and enables smooth 60 Hz updates on SXGA+ (1400×1050) LCDs. |
| EPDC block disabled | Removes electrophoretic display controller logic - simplifies layout and software stack for standard LCD-only designs while retaining full pin compatibility with i.MX508. |
| Four independent PLLs | Enables precise clock domain isolation - allows independent scaling of display, USB, Ethernet, and memory clocks to minimize EMI and optimize power. |
| HAB4 secure boot | SHA-256 + 2048-bit RSA signature verification - ensures only authenticated firmware executes, preventing unauthorized code injection during field updates. |
Applications
| Industrial HMI Panels | Medical Patient Monitors |
|---|---|
Use Scenario: Touch-enabled operator interfaces in factory automation systems requiring responsive GUIs and real-time data visualization. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI framework, driving 1024×768 LCD via eLCDIF, and managing CAN/Ethernet connectivity. Use Value: ePXP offloads UI layer composition, reducing CPU load to <15% during animation; DVFS maintains 1 GHz only during active interaction, cutting average SoC power by 30%. | Use Scenario: Portable bedside monitors displaying vital signs waveforms, alarms, and patient history with strict reliability and low standby power requirements. IC Role / Device Role / Timing Role: Central controller running deterministic RTOS, acquiring sensor data via SPI/I2C, rendering waveform overlays using ePXP, and storing logs to NAND Flash. Use Value: On-chip temperature monitor and SRTC enable cold-junction compensation and tamper-proof time-stamping; 128 KB OCRAM provides fast buffer for critical alarm handling without DRAM wake-up latency. |
| Retail Digital Signage | Smart Energy Meters |
Use Scenario: Wall-mounted kiosks showing dynamic advertisements, pricing, and promotions with scheduled content updates over Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Applications processor hosting embedded web server and media player, decoding MPEG-4 video via ARM+NEON, and driving HDMI output via bridge IC. Use Value: NEON coprocessor achieves 30 fps 720p decode at <400 MHz - allowing aggressive DVFS to extend fanless operation; eMMC 4.4 support enables fast, wear-levelled firmware updates. | Use Scenario: Two-way communication meters with local display, tamper detection, and encrypted firmware updates via PLC or RF mesh networks. IC Role / Device Role / Timing Role: Secure host processor managing AES-encrypted data exchange, validating signed firmware images via HAB4, and updating segmented LCD segments via GPIO-controlled drivers. Use Value: Dedicated crypto engine (DCP) and on-chip fuses allow secure key storage and zero-trust update validation - meeting IEC 62056 and DLMS/COSEM compliance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX507CVK1B | Same core, GPU-disabled, but in 13×13 mm 416-pin MAPBGA (0.5 mm pitch) - lacks USB supply independence and has different DRAM pin allocation. | Preferred for space-constrained designs where PCB layer count limits routing of 400-ball BGA; lower thermal mass suits fanless enclosures. | Select when board area is critical and USB analog supply separation is not required. |
| MCIMX503CVM8B | 800 MHz ARM Cortex-A8, no EPDC, same 400-pin MAPBGA - lower max frequency and no GPU, but retains full ePXP and memory interface capability. | Better suited for cost-sensitive, thermally constrained applications where 1 GHz headroom is unnecessary - e.g., static display terminals with infrequent UI updates. | Choose when thermal budget or BOM cost outweighs peak performance needs; identical footprint enables drop-in replacement with frequency derating. |
Compared with MCIMX507CVM1B, MCIMX507CVK1B offers identical functionality in a denser package but sacrifices USB supply isolation and DRAM flexibility, while MCIMX503CVM8B trades 200 MHz peak frequency for lower power and cost - both maintain full software compatibility and pin-level interoperability within the i.MX50 family.
Availability
MCIMX507CVM1B is available at Aetrix Electronics and suitable for industrial HMI panels, medical patient monitors, retail digital signage, and smart energy meters requiring stable component supply across multi-year production cycles.
Supply support for MCIMX507CVM1B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX50 product line was designed to deliver high-performance, low-power multimedia processing for portable consumer and industrial devices - emphasizing display subsystem integration, security, and flexible memory interfacing.
FAQ
What is the maximum operating frequency of the MCIMX507CVM1B?
The MCIMX507CVM1B operates at a maximum ARM Cortex-A8 core frequency of 1 GHz under specified thermal and voltage conditions. This frequency is achieved using Freescale's Smart Speed™ technology and dynamic voltage/frequency scaling (DVFS), which adjusts supply voltage and clock rate based on workload to optimize power efficiency without compromising real-time responsiveness in the MCIMX507CVM1B.
Does the MCIMX507CVM1B include a GPU?
No, the MCIMX507CVM1B does not include a GPU. Per Freescale's part number feature comparison (Table 2), "MCIMX507" is explicitly defined as having the GPU disabled. The MCIMX507CVM1B retains the ePXP pixel processing pipeline and 2D display acceleration capabilities but omits the GPU2Dv1 block present in MCIMX508 variants - making it suitable for applications requiring strong UI rendering but not complex vector graphics or OpenVG acceleration.
What package type is used for the MCIMX507CVM1B?
The MCIMX507CVM1B uses a 400-pin MAPBGA package with 17×17 mm dimensions and 0.8 mm ball pitch (Case 400). This package differs from the 416-pin variants by removing six pins - including DRAM_SDCLK_1, DRAM_A14, and UART2 handshake signals - and provides independent USB OTG/host analog power supplies, improving noise isolation for high-speed USB operation in the MCIMX507CVM1B.
Which display controllers are active in the MCIMX507CVM1B?
The MCIMX507CVM1B includes the enhanced LCD interface controller (eLCDIF) and the enhanced pixel processing pipeline (ePXP), but excludes the electrophoretic display controller (EPDC). As confirmed in Table 2 of the datasheet, "MCIMX507" disables only the GPU - while EPDC remains enabled in MCIMX507 parts. However, the MCIMX507CVM1B specifically inherits the "No GPU" feature set and retains full eLCDIF and ePXP functionality for standard LCD applications.
What memory types does the MCIMX507CVM1B support?
The MCIMX507CVM1B supports DDR2, LPDDR2, and LPDDR1 DRAM up to 266 MHz (533 MT/s), NAND Flash with hardware 32-bit ECC, NOR Flash, PSRAM, Cellular RAM, and managed NAND including eMMC 4.4. Its DRAM memory controller supports 16/32-bit interfaces and up to 2 GB total capacity. These memory options are fully documented in Section 1.1.5 and Table 4 of the i.MX50CEC datasheet for the MCIMX507CVM1B.
MCIMX507CVM1B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX50
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, LPDDR2, DDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.2V, 1.875V, 2.775V, 3.0V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, Secure JTAG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-LFBGA (17x17)
- Additional Interfaces:
- 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
MCIMX507CVM1B FAQ
1.How can I place an order for MCIMX507CVM1B through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX507CVM1B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX507CVM1B reliable?
The price and inventory of MCIMX507CVM1B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX507CVM1B is usually 5 days.
3.What payment methods are accepted for MCIMX507CVM1B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX507CVM1B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX507CVM1B?
MCIMX507CVM1B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX507CVM1B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX507CVM1B?
For technical support, including MCIMX507CVM1B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX507CVM1B requirements.
6.How does Aetrix verify that MCIMX507CVM1B is sourced from the original manufacturer or authorized distributors?
All MCIMX507CVM1B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX507CVM1B meets industry standards.
7.What is the process for return or replacement of MCIMX507CVM1B?
All MCIMX507CVM1B units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX507CVM1B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX507CVM1B part is unused and in its original packaging.
Return procedure for MCIMX507CVM1B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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