NXP Semiconductors MCIMX507CVM1BR2
- Part No.:
- MCIMX507CVM1BR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 400-LFBGA
- Datasheet:
-
MCIMX507CVM1BR2.pdf
- Description:
- IC MPU I.MX50 800MHZ 400LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX507CVM1BR2 from NXP Semiconductors (formerly Freescale) is a 1 GHz ARM Cortex-A8 applications processor optimized for portable multimedia systems with no integrated GPU. It features 256 KB L2 cache, dual eCSPI interfaces up to 66 Mbps, 10/100 Ethernet MAC, and support for DDR2/LPDDR2/LPDDR1 DRAM at 266 MHz. It targets cost-sensitive e-reader and industrial HMI designs requiring electrophoretic display control without graphics acceleration.
For engineers reviewing the MCIMX507CVM1BR2 datasheet, MCIMX507CVM1BR2 pinout, MCIMX507CVM1BR2 application, or MCIMX507CVM1BR2 equivalent, key selection criteria include its 17×17 mm 400-pin MAPBGA package, absence of GPU and EPDC blocks, 1 GHz core frequency, DVFS power management, and compatibility with LPDDR2-533 memory interfaces.
Technical Context
The MCIMX507CVM1BR2 implements an ARM Cortex-A8 core with NEON SIMD and VFPv3 coprocessors, unified 256 KB L2 cache, and a 64-bit AXI fabric operating at 266 MHz. Its memory subsystem supports up to 2 GB external DRAM via 16/32-bit DDR2-533 or LPDDR2-533 interfaces with hardware ECC for NAND.
It integrates dedicated accelerators including ePXP for pixel processing (color-space conversion, alpha blending), SDMA for smart DMA operations, and BCH32 for NAND flash error correction. Clocking uses four PLLs with eight independently controllable outputs, enabling precise timing for display and connectivity modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 with NEON and VFPv3 coprocessors, enabling SIMD media processing and single-precision floating-point math. |
| Max Core Frequency | 1 GHz - delivers high throughput for OS execution and application tasks in battery-constrained devices. |
| L2 Cache | 256 KB unified instruction/data cache - reduces memory bandwidth pressure and improves deterministic latency for real-time display pipelines. |
| DRAM Interface | 16/32-bit DDR2-533 / LPDDR2-533 - supports up to 2 GB memory with 266 MHz clock, enabling balanced performance and power in portable systems. |
| eCSPI Speed | Up to 66 Mbps per port - enables high-speed communication with sensors, audio codecs, or secure elements without CPU overhead. |
| Ethernet | IEEE 802.3 10/100 Mbps MAC - provides wired network connectivity with minimal external PHY components required. |
| Security | HAB4 boot authentication, AES encryption, and on-chip fuse storage - ensures firmware integrity and data confidentiality in field-deployed devices. |
Pinout & Package
MCIMX507CVM1BR2 is housed in a 17 × 17 mm, 0.8 mm pitch, 400-ball MAPBGA package (Case 400). This RoHS-compliant, lead-free package has Moisture Sensitivity Level 3 and supports standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.2 V nominal supply for Cortex-A8 core; requires tight regulation and low-noise filtering for stable 1 GHz operation. |
| VDD_SOC | System-on-Chip Power | 1.1 V nominal supply for logic, interconnect, and peripheral domains; shared across AXI fabric and most IP blocks. |
| DRAM_VDD | DRAM I/O Power | 1.8 V supply for DDR2/LPDDR2 interface; decoupling critical to meet AC timing and signal integrity requirements. |
| USB_OTG_VDDA25 | OTG PHY Analog Supply | 2.5 V analog supply for USB OTG transceiver; independent from USB_H1_VDDA25 in this 400-pin package. |
| SD3_CMD | eMMC Command Line | Bi-directional command line for eMMC 4.4 host controller (Port 3); supports 8-bit DDR mode up to 832 Mbps. |
| EPDC_CLK | Electrophoretic Display Clock | Not available - EPDC block is disabled in MCIMX507; this pin is reserved or repurposed per IOMUX configuration. |
Key Features
| Feature | Design Value |
|---|---|
| No GPU implementation | Reduces die area and dynamic power by eliminating 2D graphics accelerator; lowers BOM cost for non-graphic-intensive e-paper applications. |
| DVFS support | Enables dynamic voltage/frequency scaling down to audio decode workloads, cutting active power by >40% versus fixed-frequency operation. |
| ePXP pixel pipeline | Processes 1 pixel/clock for color-space conversion and gamma mapping - offloads grayscale rendering from CPU for e-ink panel updates. |
| Four PLLs with 8 outputs | Allows independent clock domain control for display, USB, Ethernet, and memory - eliminates external clock generators and simplifies layout. |
| BCH32 NAND ECC | Hardware-corrects up to 32 bits per 1 KB block - enables reliable use of low-cost MLC NAND flash without software ECC overhead. |
Applications
| E-Reader Platform | Industrial HMI Terminal |
|---|---|
Use Scenario: Battery-powered e-reader with 10.3" E Ink Carta display and Wi-Fi/BT connectivity. IC Role / Device Role / Timing Role: Main applications processor executing Linux, driving EPD via eLCDIF + ePXP, managing NAND storage and wireless peripherals. Use Value: Eliminates need for external EPD controller and GPU, reducing component count and PCB area while maintaining full grayscale update performance. | Use Scenario: Ruggedized factory-floor HMI with resistive touchscreen, Ethernet backhaul, and local data logging. IC Role / Device Role / Timing Role: Central controller running real-time OS, handling touch input, rendering UI via LCD, and communicating over 10/100 Ethernet and UARTs. Use Value: Leverages 1 GHz Cortex-A8 + L2 cache for responsive UI rendering and deterministic I/O handling without graphics acceleration overhead. |
| Medical Data Logger | Smart Energy Meter Display |
Use Scenario: Portable patient monitor logging vitals to encrypted NAND and transmitting via USB OTG to clinical PC. IC Role / Device Role / Timing Role: Secure system-on-chip managing sensor ADC interfaces, AES-encrypted storage, HAB4-verified boot, and USB device enumeration. Use Value: On-chip security accelerators (HAB4, AES) and tamper-resistant SRTC enable HIPAA-compliant data handling without external crypto ICs. | Use Scenario: DIN-rail mounted electricity meter with segmented LCD and optical pulse output. IC Role / Device Role / Timing Role: Low-power applications processor controlling LCD segments, reading metrology IC via SPI, and managing time-stamped energy counters. Use Value: Smart Speed™ power gating and SRPG reduce average current draw below 150 mA in active mode, extending battery backup life beyond 10 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX508CVM1B | Includes GPU2Dv1 (200 Mpix/s) and EPDC; same 1 GHz core, 400-pin MAPBGA package. | Supports simultaneous LCD + EPD displays and OpenVG-accelerated UIs; higher thermal envelope. | Select when graphics acceleration or dual-display capability is required; verify thermal design for GPU-enabled operation. |
| MCIMX503CVM8B | Removes EPDC but retains GPU; same 1 GHz core, 400-pin MAPBGA package. | Targets LCD-only applications needing 2D graphics but not e-paper; lacks electrophoretic display controller logic. | Choose for cost-sensitive LCD-based HMIs where GPU offload is beneficial but EPD support is unnecessary. |
Compared with MCIMX507CVM1BR2, MCIMX508CVM1B adds GPU and EPDC for richer display capabilities at higher power and cost, while MCIMX503CVM8B retains GPU but omits EPDC-making it suitable for LCD-centric designs where graphics acceleration justifies the added silicon area.
Availability
MCIMX507CVM1BR2 is available at Aetrix Electronics and suitable for e-reader platforms, industrial HMIs, medical data loggers, and smart energy meters requiring stable component supply and long-term lifecycle support.
Supply support for MCIMX507CVM1BR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX50 family was designed by NXP (as Freescale) to deliver energy-efficient multimedia processing for portable consumer electronics, with emphasis on electrophoretic display support, low-power operation, and flexible peripheral integration.
FAQ
What is the maximum operating frequency of the MCIMX507CVM1BR2 core?
The MCIMX507CVM1BR2 operates at a maximum ARM Cortex-A8 core frequency of 1 GHz. This speed is achievable under specified thermal and voltage conditions outlined in the IMX50CEC datasheet Rev. 7, with dynamic voltage and frequency scaling (DVFS) enabling lower frequencies for power-sensitive tasks like audio decode or idle states.
Does the MCIMX507CVM1BR2 include a GPU or electrophoretic display controller?
No, the MCIMX507CVM1BR2 explicitly excludes both the GPU2Dv1 graphics accelerator and the EPDC (electrophoretic display controller). These blocks are disabled per the part number feature comparison in Table 2 of the IMX50CEC datasheet, distinguishing it from the MCIMX508 series and aligning it with cost-optimized e-paper or LCD-only applications.
Which memory types does the MCIMX507CVM1BR2 support?
The MCIMX507CVM1BR2 supports DDR2-533, LPDDR2-533, and LPDDR1-400 DRAM up to 2 GB; NAND Flash (SLC/MLC) with hardware BCH32 ECC; NOR Flash; PSRAM; Cellular RAM; and managed NAND including eMMC 4.4. Memory interface widths and clock rates are defined in Section 4.8 of the IMX50CEC datasheet.
What package type is used for the MCIMX507CVM1BR2?
The MCIMX507CVM1BR2 uses a 17 × 17 mm, 0.8 mm pitch, 400-ball MAPBGA package (Case 400). This RoHS-compliant, lead-free package has Moisture Sensitivity Level 3 and differs from the 416-ball variants by removing DRAM_SDCLK_1, DRAM_A14, DRAM_SDODT1, and UART2_RTS/CTS pins.
How does the MCIMX507CVM1BR2 handle power management for battery-operated devices?
The MCIMX507CVM1BR2 implements Smart Speed™ technology with dynamic voltage and frequency scaling (DVFS), state-retention power gating (SRPG) for the ARM core and NEON, and multiple low-power modes. These features allow system-level power reduction during audio playback or standby, achieving sub-150 mA active current in optimized configurations per IMX50CEC Section 1.1.6.
MCIMX507CVM1BR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 400-LFBGA
- Series:
- i.MX50
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, LPDDR2, DDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.2V, 1.875V, 2.775V, 3.0V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Boot Security, Cryptography, Secure JTAG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-LFBGA (17x17)
- Additional Interfaces:
- 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
MCIMX507CVM1BR2 FAQ
1.How can I place an order for MCIMX507CVM1BR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX507CVM1BR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX507CVM1BR2 reliable?
The price and inventory of MCIMX507CVM1BR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX507CVM1BR2 is usually 5 days.
3.What payment methods are accepted for MCIMX507CVM1BR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX507CVM1BR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX507CVM1BR2?
MCIMX507CVM1BR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX507CVM1BR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX507CVM1BR2?
For technical support, including MCIMX507CVM1BR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX507CVM1BR2 requirements.
6.How does Aetrix verify that MCIMX507CVM1BR2 is sourced from the original manufacturer or authorized distributors?
All MCIMX507CVM1BR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX507CVM1BR2 meets industry standards.
7.What is the process for return or replacement of MCIMX507CVM1BR2?
All MCIMX507CVM1BR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX507CVM1BR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX507CVM1BR2 part is unused and in its original packaging.
Return procedure for MCIMX507CVM1BR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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