NXP Semiconductors MCIMX508CZK8B

Overview

MCIMX508CZK8B from NXP Semiconductors (formerly Freescale) is an ARM Cortex-A8-based multimedia applications processor with 800 MHz maximum core frequency, integrated EPDC for electrophoretic displays, 2D GPU (200 Mpix/s), and ePXP pixel processing pipeline. It supports LPDDR2 DRAM only via PoPBGA package and targets low-power portable e-reader and industrial HMI systems.

For engineers reviewing the MCIMX508CZK8B datasheet, MCIMX508CZK8B pinout, MCIMX508CZK8B application, or MCIMX508CZK8B equivalent, key selection criteria include PoP-optimized LPDDR2/eMMC integration, electrophoretic display controller (EPDC) support, dual-display capability (eLCDIF + EPDC), and 13×13 mm 416-ball PoPBGA mechanical compatibility.

Technical Context

The MCIMX508CZK8B implements a 64-bit AXI fabric (266 MHz) as its central interconnect, with dedicated AHB crossbar (133 MHz) and IP-bus segments enabling concurrent access to display subsystems (EPDC, eLCDIF), memory controllers (DRAM MC, EIM), and accelerators (ePXP, GPU2Dv1). Its QoSC dynamically prioritizes display traffic to maintain real-time frame delivery.

It integrates four PLLs - including one with eight independently controllable outputs - to provide precise clocking for display timing (e.g., EPDC refresh up to 106 Hz at 2048×1536), USB 2.0 OTG/host PHYs, and DDR interface logic. Power management includes DVFS, SRPG for ARM/NEON, and on-chip 32 kHz/24 MHz oscillators.

Key Specifications

Pinout & Package

MCIMX508CZK8B uses the 13 × 13 mm, 0.5 mm pitch, 416-ball PoPBGA package (Case 416 PoPBGA). This package deletes 15 DRAM-related balls (e.g., DRAM_A10–A14, DRAM_CAS, DRAM_RAS) and adds 5 PoP-specific terminals: POP_EMMC_RST, POP_LPDDR2_ZQ0/ZQ1, POP_LPDDR2_1.8V, and POP_NAND_VCC. DRAM address/data/clock balls are routed to bottom layer for factory test only and must remain unconnected on PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multimedia processor applications.

Compared with MCIMX508CZK8B, MCIMX508CVK8B offers broader memory compatibility at the cost of PoP integration, while MCIMX507CVK8B removes GPU overhead for simpler, lower-power text-based interfaces - both require revalidation of display timing and power delivery due to differing package-level supply routing.

Availability

MCIMX508CZK8B is available at Aetrix Electronics and suitable for e-reader systems, industrial HMI panels, medical patient monitors, and retail digital shelf labels requiring stable component supply and long-term lifecycle support.

Supply support for MCIMX508CZK8B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's embedded processor leadership.

The i.MX50 family was designed to deliver high-performance, energy-efficient multimedia processing for portable consumer electronics - particularly targeting electrophoretic display applications where low power, rich graphics, and secure boot are critical.

FAQ

What display technologies does the MCIMX508CZK8B support?

The MCIMX508CZK8B supports electrophoretic displays (E Ink) via its integrated EPDC - capable of driving panels up to 4096×4096 at 20 Hz - and standard LCDs via the eLCDIF interface supporting resolutions beyond SXGA+ (1400×1050) at 60 Hz. Both can operate simultaneously, though eLCDIF is limited to 16-bit interface when EPDC is active due to pin muxing constraints inherent to the MCIMX508CZK8B PoPBGA package.

Does the MCIMX508CZK8B support DDR2 or LPDDR1 memory?

No, the MCIMX508CZK8B does not support DDR2 or LPDDR1 memory. Its PoPBGA package is specifically optimized for LPDDR2-only operation, as confirmed in Table 3 of the IMX50CEC datasheet. The DRAM address, data, and clock pins required for DDR2/LPDDR1 are deleted from the 416-ball PoPBGA footprint, and the memory controller is configured exclusively for LPDDR2 timing parameters.

What is the function of the POP_EMMC_RST pin on the MCIMX508CZK8B?

The POP_EMMC_RST pin on the MCIMX508CZK8B is an active-low reset signal dedicated to the PoP eMMC device stacked beneath the processor. It is driven by the i.MX508's internal reset controller and must be pulled up externally with a 10 kΩ resistor. This pin ensures synchronized reset behavior between the SoC and its integrated eMMC, critical for reliable boot and firmware update sequences in MCIMX508CZK8B-based designs.

How does the MCIMX508CZK8B handle power management for battery-operated devices?

The MCIMX508CZK8B implements multiple hardware-assisted power-saving techniques: dynamic voltage and frequency scaling (DVFS) adjusts core voltage/frequency per workload; state retention power gating (SRPG) shuts down ARM/NEON logic while preserving register state; and deep-sleep modes leverage on-chip 32 kHz oscillator for wake-up timing. These features enable sub-10 µA standby current in e-reader applications - directly enabled by MCIMX508CZK8B's Smart Speed architecture and EPDC-specific low-power waveform engine.

Can the MCIMX508CZK8B be used as a drop-in replacement for MCIMX508CVK8B?

No, the MCIMX508CZK8B is not a drop-in replacement for MCIMX508CVK8B. While both share the same 800 MHz speed grade and feature set, they use different packages: MCIMX508CZK8B is 416-ball PoPBGA (LPDDR2/eMMC optimized), whereas MCIMX508CVK8B is 416-ball MAPBGA (supports DDR2/LPDDR1/LPDDR2). Their ball maps differ significantly - especially in DRAM and power supply pin assignments - requiring PCB redesign and power delivery revalidation for any migration.