NXP Semiconductors MCIMX535DVV1C

Overview

MCIMX535DVV1C from NXP Semiconductors is a consumer-grade ARM Cortex-A8 applications processor operating at 1.2 GHz, integrating 256 KB L2 cache, OpenGL ES 2.0 3D GPU (33 Mtri/s), OpenVG 1.1 2D GPU (200 Mpix/s), and hardware video codec supporting 1080p30 decode and 720p30 encode. It targets high-end portable media players, tablets, and thin clients requiring rich multimedia, dual-display support, and secure boot.

For engineers reviewing the MCIMX535DVV1C datasheet, MCIMX535DVV1C pinout, MCIMX535DVV1C application, or MCIMX535DVV1C equivalent, key selection criteria include DDR3/LPDDR2-800 memory interface compatibility, 19×19 mm TE-BGA-529 package constraints, TrustZone-enabled security architecture, and USB 2.0 OTG + three HS host controller integration.

Technical Context

The MCIMX535DVV1C implements a multi-bus SoC architecture with a 64-bit AMBA AXI bus (200 MHz) for CPU, GPU, VPU, and EXTMC; a 32-bit AHB bus (133 MHz) for peripherals; and a 32-bit IP bus (66 MHz) for low-speed control. It integrates dedicated accelerators including VPUv3, IPUv3M, ASRC, and SAHARAv4 Lite for cryptographic operations.

Power management relies on DVFS, SRPG for ARM core/Neon, and configurable clock gating across subsystems. Boot flow is governed by HABv4 with eFUSE-programmed CSU policy, supporting secure boot, AES-256 encryption, and tamper-resistant SRTC.

Key Specifications

Pinout & Package

MCIMX535DVV1C uses a 19×19 mm, 0.8 mm pitch TE-BGA-529 (Case HW-PWR-TEPBGA-529) RoHS-compliant package with MSL 3 moisture sensitivity rating. Pin assignments follow the i.MX53xD BGA layout defined in Section 6.1 of IMX53CEC Rev. 8.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX535DVV1C, MCIMX535DVP2C2 offers identical functionality in a lower-cost commercial temperature grade, while i.MX6DL provides architectural advancement at the expense of legacy driver compatibility and higher power consumption in burst workloads.

Availability

MCIMX535DVV1C is available at Aetrix Electronics and suitable for tablet computing, thin client terminals, and portable navigation devices requiring stable component supply and long-term lifecycle support.

Supply support for MCIMX535DVV1C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The i.MX53 family was designed as a multimedia-optimized applications processor line targeting cost-sensitive, power-constrained consumer devices such as tablets, netbooks, and smart displays - emphasizing graphics, video, and security integration within a single die.

FAQ

What is the maximum supported DDR3 speed for MCIMX535DVV1C?

The MCIMX535DVV1C supports DDR3-800 (400 MHz clock, 800 MT/s data rate) in 32-bit configuration with up to 2 GB addressable capacity. This is confirmed in Section 4.2 of IMX53CEC Rev. 8, which specifies VDD_SOC supply requirements and timing parameters aligned with JEDEC DDR3-800 standards. The EXTMC controller implements bank interleaving and watermark-based arbitration to sustain peak bandwidth under mixed read/write loads.

Does MCIMX535DVV1C include an integrated USB PHY?

Yes, MCIMX535DVV1C integrates a high-speed USB 2.0 PHY for the OTG port, as documented in Section 6.1 and Figure 1 of IMX53CEC Rev. 8. It also supports two additional HS USB hosts via ULPI/IC-USB interfaces, enabling connection to external transceivers. The integrated PHY eliminates need for discrete PHY components in basic OTG configurations, reducing BOM count and PCB area.

What security features are implemented in MCIMX535DVV1C?

MCIMX535DVV1C implements a layered security architecture including ARM TrustZone, Advanced High Assurance Boot (A-HAB) with SHA-256 and 2048-bit RSA, Central Security Unit (CSU) configured via eFUSE, SAHARAv4 Lite cryptographic accelerator, and tamper-resistant Secure RTC. These features collectively enable secure boot, encrypted firmware updates, DRM enforcement, and runtime isolation of trusted applications - all verified in Sections 1.2 and 7 of IMX53CEC Rev. 8.

Can MCIMX535DVV1C support dual independent displays simultaneously?

Yes, MCIMX535DVV1C supports two active displays concurrently using its dual parallel LCD interfaces and LVDS bridge (LDB). As specified in Table 1 and Section 5.1 of IMX53CEC Rev. 8, it can drive one display at UXGA (1600×1200@60 Hz) and another at WXGA (1280×800@60 Hz) with hardware-accelerated blending and overlay via the IPUv3M. Total pixel throughput is capped at 180 Mpixels/s across all interfaces.

What is the package type and pin count of MCIMX535DVV1C?

MCIMX535DVV1C uses a 19×19 mm, 0.8 mm pitch TE-BGA-529 package (Case HW-PWR-TEPBGA-529), as explicitly stated in Section 6.1 of IMX53CEC Rev. 8. It contains 529 solder balls arranged in a grid pattern with defined power, ground, I/O, and thermal pad assignments. This package is RoHS-compliant and rated MSL 3 per J-STD-020.