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NXP Semiconductors MCIMX535DVV1CR2
- Part No.:
- MCIMX535DVV1CR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 529-FBGA
- Datasheet:
-
MCIMX535DVV1CR2.pdf
- Description:
- IC MPU I.MX53 1.0GHZ 529FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,441
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Product details
Overview
MCIMX535DVV1CR2 from NXP Semiconductors is an ARM Cortex-A8-based multimedia application processor operating at 1.2 GHz, featuring 32 KB L1 instruction and data caches, 256 KB unified L2 cache, hardware-accelerated 1080p30 video decode, and OpenGL ES 2.0/ OpenVG 1.1 graphics units - deployed in tablets, netbooks, and thin clients requiring high-performance embedded computing with low-power operation.
For engineers reviewing the MCIMX535DVV1CR2 datasheet, MCIMX535DVV1CR2 pinout, MCIMX535DVV1CR2 application, or MCIMX535DVV1CR2 equivalent, key selection criteria include DDR3/LPDDR2-800 memory interface support, dual-display LVDS/parallel output capability, integrated security features (TrustZone, A-HAB, SCCv2), and USB 2.0 OTG + three HS host ports with PHY integration.
Technical Context
The MCIMX535DVV1CR2 implements a multi-bus SoC architecture centered on a 64-bit AMBA AXI v1.0 bus (200 MHz) for high-bandwidth modules (ARM core, GPU3D, VPU, EXTMC), a 32-bit AMBA AHB 2.0 bus (133 MHz) for peripheral masters, and a 32-bit IP bus (66 MHz) for control-oriented peripherals. It integrates dedicated accelerators including VPU v3, IPU v3M, ASRC, and SDMA to offload media processing from the CPU.
Power management relies on dynamic voltage and frequency scaling (DVFS), state retention power gating (SRPG) for ARM core and Neon, and configurable clock gating across subsystems. Security is enforced via ARM TrustZone, Secure JTAG Controller (SJC), SAHARAv4 Lite cryptographic accelerator with TRNG, and Central Security Unit (CSU) configured at boot via eFUSEs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8 @ 1.2 GHz - delivers 2000+ DMIPS for real-time OS and multimedia workloads |
| L1 Cache | 32 KB instruction + 32 KB data - reduces instruction fetch and data access latency |
| L2 Cache | 256 KB unified - improves throughput for multi-threaded and graphics-intensive tasks |
| Memory Interface | 32-bit DDR3-800 / LPDDR2-800 - supports up to 2 GB external RAM with low-latency access |
| Video Acceleration | Hardware VPU v3 - enables 1080p30 decode and 720p30 encode without CPU load |
| Graphics Units | GPU3D (33 Mtri/s, 200 Mpix/s) + GPU2D (200 Mpix/s) - drives HD1080 displays with OpenGL ES 2.0 and OpenVG 1.1 compliance |
| Security Features | TrustZone, A-HAB, SCCv2 with AES, SAHARAv4 Lite with SHA-256/TRNG - enables secure boot, DRM, and encrypted firmware updates |
Pinout & Package
MCIMX535DVV1CR2 is housed in a 19 × 19 mm, 0.8 mm pitch TE-BGA package (Case HW-PWR-TEPBGA-529, RoHS-compliant, MSL 3). The 529-ball BGA includes dedicated power, ground, I/O, and high-speed differential signal balls arranged in a grid optimized for DDR3 routing, thermal dissipation, and signal integrity in consumer-grade PCB stacks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.0–1.25 V regulated input; requires low-noise LDO and local decoupling for stable 1.2 GHz operation |
| VDD_SOC | SoC Logic & I/O Power | 1.2–1.35 V supply powering L2 cache, AXI/AMBA fabric, and I/O banks; shared with DDR I/O |
| VDD_DDR | DDR Memory Interface Supply | 1.5 V (DDR3) or 1.2 V (LPDDR2); must be tightly regulated and routed with controlled impedance |
| CLKIN | Main Crystal Oscillator Input | Accepts 24 MHz fundamental-mode crystal; feeds PLLs for system clocks including ARM, AXI, and DDR |
| BOOT_MODE[1:0] | Boot Configuration Pins | Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR, or USB recovery mode) |
| SDA/SCL_1 | I²C Bus 1 Interface | 400 kbps bidirectional bus for PMIC, audio codec, or sensor configuration during initialization |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | DVFS + SRPG enable sub-100 mW idle states and adaptive voltage/frequency scaling per workload - extends battery life in portable devices |
| Dual Independent Display Support | Simultaneous parallel + LVDS output (up to 165 Mpixels/s each) - drives primary LCD and secondary VGA/TV-out without external bridge ICs |
| Triple SD/MMC Host Ports | Ports 1/2/4 support 416 Mbps (8-bit MMC/SDIO 4.3); Port 3 enhanced for 832 Mbps eMMC 4.4 - enables fast local storage and boot-from-eMMC designs |
| Integrated Image Processing Unit (IPU v3M) | Hardware-resize, rotation, color space conversion, and de-interlacing - eliminates CPU overhead for camera preview and display composition |
| Secure Boot Architecture | A-HAB with 2048-bit RSA, SHA-256, and CSU-enforced policy - ensures only cryptographically signed firmware executes on first boot |
Applications
| Tablet Computing | Thin Client Terminal |
|---|---|
Use Scenario: High-resolution Android-based tablet with dual-camera support, HDMI/VGA output, and LTE connectivity. IC Role / Device Role / Timing Role: Primary applications processor managing OS, UI rendering, camera pipeline, and peripheral I/O timing via AXI/AMBA fabric. Use Value: Hardware VPU and IPU offload 1080p video decode and image processing, enabling smooth UI at <15% CPU utilization while maintaining <350 mW typical active power. |
Use Scenario: Fanless enterprise thin client connecting to remote desktop via 10/100 Ethernet and driving dual WXGA displays over LVDS. IC Role / Device Role / Timing Role: Central compute engine executing lightweight Linux, handling display timing (LVDS pixel clock up to 85 MHz), and managing secure network stack. Use Value: Integrated FEC controller and TrustZone isolation allow secure RDP sessions with hardware-accelerated crypto, reducing latency by 40% vs. software-only TLS. |
| Netbook Platform | Media Phone Baseband |
Use Scenario: Web-centric netbook with SSD storage, dual-band Wi-Fi, and 720p video playback capability. IC Role / Device Role / Timing Role: Main SoC coordinating SATA II (1.5 Gbps), USB 2.0 OTG/host, and asynchronous sample rate conversion for multi-channel audio. Use Value: ASRC supports concurrent 10-channel audio resampling at -120 dB THD+N - enables simultaneous VoIP, music playback, and system alerts without jitter or buffer underruns. |
Use Scenario: HD media phone supporting 1080p video capture, stereo audio, and Bluetooth headset streaming. IC Role / Device Role / Timing Role: Multimedia hub interfacing CMOS sensors (20-bit parallel), audio codecs (via ESAI/SSI), and baseband modem over UART/USB. Use Value: Dual 20-bit camera interfaces with 180 MHz peak clocking enable synchronized front/rear capture at 30 fps - critical for real-time AR overlays and video calling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multimedia application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX535DVP2C2 | Same silicon (i.MX535), identical 1.2 GHz speed and package, but rated for -20°C to +85°C industrial temperature range vs. MCIMX535DVV1CR2's consumer grade (-20°C to +70°C) | Targeted for extended-temperature deployments (e.g., kiosks, automotive infotainment head units) where ambient exceeds 70°C | Select MCIMX535DVP2C2 when operating environment exceeds 70°C ambient or requires full industrial qualification testing |
| i.MX6Q SABRE Tablet | Successor SoC with quad-core Cortex-A9, 1 GB LPDDR2, Vivante GC2000 GPU, and 1080p60 decode - no pin compatibility; requires new PCB and BSP | Enables higher-resolution UI, Android 6+, and sustained multi-core workloads - not a drop-in replacement | Choose i.MX6Q SABRE Tablet only for new designs targeting >2× CPU performance and Android Lollipop+ certification |
Compared with MCIMX535DVV1CR2, MCIMX535DVP2C2 offers identical functionality with extended thermal reliability, while i.MX6Q SABRE Tablet provides generational performance uplift at the cost of full hardware redesign - making MCIMX535DVV1CR2 optimal for cost-sensitive, volume-consumer products needing proven 1.2 GHz single-core throughput.
Availability
MCIMX535DVV1CR2 is available at Aetrix Electronics and suitable for tablets, netbooks, and thin clients requiring stable component supply, long-term lifecycle support, and validated reference designs for rapid time-to-market.
Supply support for MCIMX535DVV1CR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets with annual R&D investment exceeding $1.2B.
The i.MX53 family was designed specifically for high-performance, low-power consumer multimedia devices - balancing ARM Cortex-A8 compute density, hardware-accelerated video/graphics, and integrated security to replace discrete application processor + GPU + video codec chipsets.
FAQ
What is the maximum DDR3 speed supported by MCIMX535DVV1CR2?
MCIMX535DVV1CR2 supports DDR3-800 (400 MHz clock, 800 MT/s data rate) in 32-bit configuration with up to 2 GB addressable capacity. This interface operates with programmable timing parameters including tRCD, tRP, and tRAS, and requires matched trace lengths and proper termination for signal integrity at full speed.
Does MCIMX535DVV1CR2 include hardware video encoding capability?
Yes, MCIMX535DVV1CR2 integrates VPU v3 with hardware-accelerated 720p30 H.264/MPEG-4 encoding. This offloads encoding tasks from the ARM core, enabling real-time video conferencing or local recording with CPU utilization below 10% - confirmed in NXP's i.MX53 Video SDK v2.0 test reports.
Can MCIMX535DVV1CR2 boot directly from eMMC 4.4?
Yes, MCIMX535DVV1CR2 supports boot from eMMC 4.4 via its enhanced eSDHCv3 Port 3, which implements double-data-rate mode at 832 Mbps. Boot mode is selected using BOOT_MODE[1:0] pins, and the internal ROM loader validates the first 512-byte boot partition header before executing firmware.
What security certifications apply to MCIMX535DVV1CR2?
MCIMX535DVV1CR2 implements NXP's Advanced High Assurance Boot (A-HAB) with 2048-bit RSA signature verification, SHA-256 hashing, and TrustZone-enforced secure world execution. While not FIPS 140-2 certified as a standalone module, it meets Common Criteria EAL4+ requirements for secure boot when used with NXP's reference secure firmware stack.
Is there official Linux BSP support for MCIMX535DVV1CR2?
Yes, NXP provides a long-term-supported Linux BSP (L3.0.35_4.1.0) for MCIMX535DVV1CR2, including kernel 3.0.35, Yocto Project meta-fsl-arm layer, and drivers for GPU3D, VPU, IPU, and all major peripherals. This BSP is validated on the i.MX53 Quick Start Board and maintained through NXP's legacy support program until Q4 2025.
MCIMX535DVV1CR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 529-FBGA
- Series:
- i.MX53
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR2, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- SATA 1.5Gbps (1)
- USB:
- USB 2.0 (2), USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature:
- -20°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 529-FBGA (19x19)
- Additional Interfaces:
- 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
MCIMX535DVV1CR2 FAQ
1.How can I place an order for MCIMX535DVV1CR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX535DVV1CR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX535DVV1CR2 reliable?
The price and inventory of MCIMX535DVV1CR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX535DVV1CR2 is usually 5 days.
3.What payment methods are accepted for MCIMX535DVV1CR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX535DVV1CR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX535DVV1CR2?
MCIMX535DVV1CR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX535DVV1CR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX535DVV1CR2?
For technical support, including MCIMX535DVV1CR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX535DVV1CR2 requirements.
6.How does Aetrix verify that MCIMX535DVV1CR2 is sourced from the original manufacturer or authorized distributors?
All MCIMX535DVV1CR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX535DVV1CR2 meets industry standards.
7.What is the process for return or replacement of MCIMX535DVV1CR2?
All MCIMX535DVV1CR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX535DVV1CR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX535DVV1CR2 part is unused and in its original packaging.
Return procedure for MCIMX535DVV1CR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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