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NXP Semiconductors MCIMX6D4AVT08AC-NXP
- Part No.:
- MCIMX6D4AVT08AC-NXP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D4AVT08AC-NXP.pdf
- Description:
- I.MX 6 SERIES 32 BIT MPU, DUAL A
- Quantity:
- Payment:
- Shipping:
Inventory:3,086
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Product details
Overview
MCIMX6D4AVT08AC from NXP Semiconductors is an automotive-grade i.MX 6Dual application processor featuring dual Arm Cortex-A9 cores running at 852 MHz, integrated GPU (no VPU), 1 MB shared L2 cache, and FCPBGA-624 package (21 × 21 mm, 0.8 mm pitch). It delivers graphics-accelerated HMI for instrument clusters and supports dual-camera input, HDMI 1.4, and dual CAN interfaces in vehicle infotainment systems.
For engineers reviewing the MCIMX6D4AVT08AC datasheet, MCIMX6D4AVT08AC pinout, MCIMX6D4AVT08AC application, or MCIMX6D4AVT08AC equivalent, key selection considerations include its 852 MHz CPU frequency, GPU-only multimedia capability (no video encode/decode acceleration), automotive temperature range (−40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface, and qualification per AEC-Q100 Grade 2.
Technical Context
The MCIMX6D4AVT08AC implements a symmetric dual-core Arm Cortex-A9 MPCore platform with TrustZone security, each core including 32 KB L1 instruction and data caches, NEON MPE coprocessor, private timer, and watchdog. The SCU and 1 MB unified L2 cache coordinate coherency across both cores.
It integrates dedicated hardware accelerators: GPU3Dv4 (OpenGL ES 2.0, up to 200 MTri/s), GPU2Dv2 (BitBlt), GPUVG (OpenVG 1.1), ASRC (asynchronous sample rate conversion), and two IPUv3H image processing units - all operating without VPU support. Power management includes DVFS, software state retention, and on-chip LDOs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual Arm Cortex-A9 cores with TrustZone, r2p10 revision; enables secure OS partitioning and real-time HMI execution. |
| Max Core Frequency | 852 MHz at automotive grade (−40°C to +125°C); validated with 24 MHz crystal input per USB timing requirements. |
| L2 Cache | 1 MB unified, shared between both cores; reduces memory bandwidth pressure during concurrent graphics and audio processing. |
| Graphics Acceleration | GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2, GPUVG (OpenVG 1.1); supports smooth 2D/3D UI rendering but no hardware video encode/decode (VPU omitted). |
| Memory Interface | 64-bit DDR3/DDR3L-1066 or 32-bit LPDDR2-800; enables high-bandwidth access for multi-display and camera buffer handling. |
| Automotive Interfaces | Two FlexCAN 2.0B controllers (1 Mbps), MLB150 port, ESAI, ASRC, and AEC-Q100 Grade 2 qualification; meets functional safety–aligned signal routing needs. |
| Security Features | CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS (secure RTC), CSU, A-HAB v4 (SHA-256, 2048-bit RSA), TrustZone; enables secure boot and DRM-compliant content playback. |
Pinout & Package
MCIMX6D4AVT08AC is housed in a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package, 21 mm × 21 mm, 0.8 mm ball pitch, lidded construction. Pin assignments follow the standardized i.MX 6 series signal naming convention (per IMX6DQAEC Rev. 6, Section 6.2) and are defined in the Functional Contact Assignments table (pages 141–163).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply | 1.2 V ±3% supply for Arm Cortex-A9 cores; requires low-noise regulation and local decoupling for stable 852 MHz operation. |
| VDD_SOC | System-on-chip I/O and logic supply | 1.5 V ±3% supply powering L2 cache, MMDC, GPC, and interconnect fabric; critical for DDR timing integrity. |
| CLKIN_24M | Main oscillator input | 24 MHz crystal reference; mandatory for USB PHY operation and system clock derivation; constrains max SoC speed to 852 MHz. |
| CAN1_TX / CAN1_RX | FlexCAN 1 differential signal pair | Direct connection to external CAN transceiver; supports ISO 11898-2 compliant 1 Mbps bus communication. |
| ENET_MDIO / ENET_MDC | Ethernet management interface | Provides IEEE 802.3-compliant MDIO/MDC access to external Gigabit Ethernet PHY registers for link configuration. |
| SD1_CMD / SD1_CLK / SD1_DATA0–3 | eMMC/uSDHC interface signals | Supports UHS-I SDR104 (104 MB/s) on SD1 port; used for boot storage and firmware updates in automotive head units. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and clock gating across CPU, GPU, and peripherals reduce active-mode power by up to 40% versus fixed-frequency operation. |
| Dual Independent IPUv3H Units | Enable simultaneous processing of two camera feeds (e.g., rearview + surround-view) with hardware scaling, rotation, and color-space conversion. |
| ASRC with 10-channel concurrency | Converts audio sample rates across independent domains (e.g., Bluetooth A2DP at 44.1 kHz → HDMI audio at 48 kHz) with <−120 dB THD+N. |
| Four uSDHC ports supporting SDR104 | Enables boot from eMMC, OTA update partitioning, and high-speed logging storage-critical for ASIL-B-aligned diagnostics. |
| Secure Boot via A-HAB v4 | Verifies signed firmware images using SHA-256 hash and 2048-bit RSA signature before execution; prevents unauthorized code injection. |
Applications
| Instrument Cluster Display | Head Unit Infotainment |
|---|---|
|
Use Scenario: Real-time rendering of vehicle speed, RPM, navigation turn-by-turn, and ADAS warnings on TFT-LCD or digital cluster display. IC Role / Device Role / Timing Role: Application processor executing QNX or Android Automotive OS; manages display composition via parallel LCD + LVDS interfaces and drives GPU-accelerated UI layers. Use Value: Achieves sub-30 ms UI refresh latency using GPU2Dv2 and dual IPUv3H, meeting OEM cluster responsiveness requirements without VPU overhead. |
Use Scenario: Integrated audio/video playback, Bluetooth hands-free calling, and smartphone mirroring (CarPlay/Android Auto) in automotive head units. IC Role / Device Role / Timing Role: Central multimedia hub interfacing with HDMI 1.4 output, dual MIPI CSI-2 camera inputs, and four uSDHC ports for storage expansion. Use Value: GPU3Dv4 enables OpenGL ES 2.0–based 3D map rendering; ASRC handles multi-source audio resampling; dual CAN supports vehicle bus telemetry integration. |
| Rear Camera Processing Unit | Telematics Control Unit (TCU) |
|
Use Scenario: Low-latency processing and display of reverse camera feed with dynamic guidelines and object detection overlay. IC Role / Device Role / Timing Role: Dedicated vision subsystem using one IPUv3H for sensor correction and GPU2Dv2 for guideline rendering onto live video stream. Use Value: Hardware-accelerated pipeline achieves ≤100 ms end-to-end latency from camera capture to display, satisfying ISO 16505 rearview performance criteria. |
Use Scenario: Cellular-connected vehicle tracking, remote diagnostics, OTA firmware updates, and emergency call (eCall) functionality. IC Role / Device Role / Timing Role: Host processor managing LTE modem interface (via PCIe or USB), GNSS receiver (via UART/USB), and secure CAAM-encrypted data transmission. Use Value: CAAM's NIST-certified PRNG and AES-256 acceleration enable TLS 1.2 handshake completion in <150 ms; SNVS provides tamper-resistant time-stamping for log integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D6AVT08AC | Includes VPU (H.264 decode up to 1080p30); same CPU frequency (852 MHz), identical package and pinout. | Required where video playback (e.g., rear-seat entertainment) or camera-based ADAS preprocessing is needed. | Select when hardware video decode acceleration is mandatory; otherwise MCIMX6D4AVT08AC offers lower BOM cost and thermal footprint. |
| MCIMX6D4AVT10AC | Same GPU-only feature set but rated for 1 GHz operation at automotive temperature grade. | Suitable for compute-intensive UIs requiring higher deterministic throughput (e.g., multi-layer 3D dashboards). | Choose when sustained 1 GHz performance is required; verify thermal design margin exceeds 852 MHz variant's derating curve. |
Compared with MCIMX6D6AVT08AC, MCIMX6D4AVT08AC eliminates VPU silicon area and associated power, reducing TDP by ~180 mW at 852 MHz - advantageous for thermally constrained head unit designs. Against MCIMX6D4AVT10AC, it trades peak frequency for tighter thermal envelope and lower junction temperature under continuous load.
Availability
MCIMX6D4AVT08AC is available at Aetrix Electronics and suitable for automotive instrument clusters, head unit infotainment systems, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D4AVT08AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The i.MX 6Dual family, including MCIMX6D4AVT08AC, was designed specifically for automotive infotainment and digital cluster applications demanding AEC-Q100 qualification, functional safety alignment, and rich multimedia capability within strict thermal envelopes.
FAQ
What is the maximum operating frequency of the MCIMX6D4AVT08AC and under what conditions is it guaranteed?
The MCIMX6D4AVT08AC is rated for a maximum core frequency of 852 MHz under automotive temperature conditions (−40°C to +125°C junction). This frequency is guaranteed when using a 24 MHz crystal input (required for USB PHY operation); using other clock sources may allow higher frequencies but voids automotive qualification compliance per IMX6DQAEC Rev. 6, Section 1.1.
Does the MCIMX6D4AVT08AC include a Video Processing Unit (VPU)?
No, the MCIMX6D4AVT08AC does not include a Video Processing Unit. Its part number suffix "4A" explicitly denotes GPU-only configuration (no VPU), distinguishing it from "6A" variants like MCIMX6D6AVT08AC. Video decode/encode functions must be implemented externally or omitted entirely in designs using MCIMX6D4AVT08AC.
Which memory types are supported by the MCIMX6D4AVT08AC's MMDC interface?
The MCIMX6D4AVT08AC supports DDR3-1066, DDR3L-1066, and LPDDR2-800 via its 64-bit MMDC interface. It also supports NAND Flash (MLC/SLC, BCH ECC up to 40-bit), NOR Flash, PSRAM, and OneNAND™ - all documented in IMX6DQAEC Rev. 6, Section 4.10 and Table 2.
Is the MCIMX6D4AVT08AC pin-compatible with other i.MX 6Dual variants in the same package?
Yes, all i.MX 6Dual automotive-grade parts in the 21 × 21 mm FCPBGA-624 package - including MCIMX6D4AVT08AC, MCIMX6D6AVT08AC, and MCIMX6D4AVT10AC - share identical pinout and ball mapping per IMX6DQAEC Rev. 6, Section 6.2. This allows PCB reuse across frequency and feature variants.
What security features are implemented in hardware on the MCIMX6D4AVT08AC?
The MCIMX6D4AVT08AC integrates CAAM (Cryptographic Acceleration and Assurance Module) with 16 KB secure RAM and NIST-certified PRNG, SNVS (Secure Non-Volatile Storage) with tamper-resistant RTC, CSU (Central Security Unit), and A-HAB v4 (Advanced High Assurance Boot) supporting SHA-256 and 2048-bit RSA verification - all confirmed in IMX6DQAEC Rev. 6, Sections 1.2 and 3.2.
MCIMX6D4AVT08AC-NXP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3, DDR3L, LPDDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D4AVT08AC-NXP FAQ
1.How can I place an order for MCIMX6D4AVT08AC-NXP through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D4AVT08AC-NXP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D4AVT08AC-NXP reliable?
The price and inventory of MCIMX6D4AVT08AC-NXP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D4AVT08AC-NXP is usually 5 days.
3.What payment methods are accepted for MCIMX6D4AVT08AC-NXP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D4AVT08AC-NXP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D4AVT08AC-NXP?
MCIMX6D4AVT08AC-NXP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D4AVT08AC-NXP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D4AVT08AC-NXP?
For technical support, including MCIMX6D4AVT08AC-NXP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D4AVT08AC-NXP requirements.
6.How does Aetrix verify that MCIMX6D4AVT08AC-NXP is sourced from the original manufacturer or authorized distributors?
All MCIMX6D4AVT08AC-NXP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D4AVT08AC-NXP meets industry standards.
7.What is the process for return or replacement of MCIMX6D4AVT08AC-NXP?
All MCIMX6D4AVT08AC-NXP units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D4AVT08AC-NXP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D4AVT08AC-NXP part is unused and in its original packaging.
Return procedure for MCIMX6D4AVT08AC-NXP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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