NXP Semiconductors MCIMX6D4AVT08ACR

Overview

MCIMX6D4AVT08ACR from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 800 MHz, integrating VPU, GPU2D/GPU3D, IPUv3H, and CAAM security module. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface, HDMI 1.4, MIPI CSI-2/DSI, dual FlexCAN, Gigabit Ethernet (IEEE 1588), and supports -40°C to +105°C operation in FCPBGA 21×21 mm package. It is deployed in rugged HMI, industrial gateways, and edge vision systems.

For engineers reviewing the MCIMX6D4AVT08ACR datasheet, MCIMX6D4AVT08ACR pinout, MCIMX6D4AVT08ACR application, or MCIMX6D4AVT08ACR equivalent, key selection considerations include dual-core A9 performance with hardware-accelerated video (1080p decode/encode), industrial temperature qualification, integrated cryptographic acceleration (CAAM), and compatibility with i.MX 6Dual software ecosystem and BSPs.

Technical Context

The MCIMX6D4AVT08ACR implements two symmetric Arm Cortex-A9 MPCore CPUs (r2p10), each with 32 KB L1 instruction and data caches, backed by a shared 1 MB L2 cache. It integrates dedicated hardware accelerators including VPU for H.264/VC-1/MPEG-4 1080p decode and encode, GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), and GPU2Dv2 for BitBLT operations.

Its system architecture includes MMDC supporting DDR3-1066/DDR3L-1066/LPDDR2-800, GPMI with BCH40 ECC for NAND flash, and a modular interconnect fabric (AXI/AHB) linking peripherals such as four uSDHC ports, three eCSPI, five UARTs, and dual I2C interfaces-all operating under industrial-grade thermal and voltage specifications.

Key Specifications

Pinout & Package

MCIMX6D4AVT08ACR uses a 521-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and lidded construction for mechanical robustness and thermal management in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core applications processor applications.

Compared with MCIMX6D6AVT08AC, MCIMX6D4AVT08AC omits MLB but retains full VPU/GPU/IPU functionality and industrial temp rating-making it optimal for cost-sensitive, non-automotive industrial applications. Versus i.MX 8M Mini, it offers proven maturity, broad BSP support, and lower power at 800 MHz, though without modern AI or DDR4 capabilities.

Availability

MCIMX6D4AVT08ACR is available at Aetrix Electronics and suitable for industrial HMIs, edge gateways, machine vision terminals, and secure digital signage requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6D4AVT08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6Dual family-including MCIMX6D4AVT08ACR-is designed for high-reliability industrial applications demanding long-term availability, extended temperature operation, and hardware-enforced security in resource-constrained edge systems.

FAQ

What is the maximum supported DDR memory speed and width for MCIMX6D4AVT08ACR?

The MCIMX6D4AVT08ACR supports a 64-bit wide DDR3/DDR3L/LPDDR2 interface with speeds up to DDR3-1066 (533 MHz), DDR3L-1066, or LPDDR2-800 (400 MHz). Its Multi-Mode DDR Controller (MMDC) enables interleaved access across dual 32-bit channels, delivering peak theoretical bandwidth of 8.5 GB/s for DDR3-1066 configurations. Real-world sustained bandwidth depends on PCB layout, termination, and memory IC selection.

Does MCIMX6D4AVT08ACR support secure boot, and what hardware blocks enable it?

Yes, MCIMX6D4AVT08ACR supports Advanced High Assurance Boot (A-HABv4) with hardware enforcement via multiple dedicated blocks: the Central Security Unit (CSU) locks security policy at boot; Cryptographic Acceleration and Assurance Module (CAAM) performs RSA-2048 signature verification and SHA-256 hashing; Secure Non-Volatile Storage (SNVS) stores root keys; and the Boot ROM (96 KB) executes immutable first-stage boot code. These elements collectively ensure authenticated, encrypted, and tamper-resistant firmware loading.

Can MCIMX6D4AVT08ACR drive multiple displays simultaneously, and which interfaces are available?

Yes, MCIMX6D4AVT08ACR supports up to four concurrent display interfaces: one 24-bit parallel RGB/LVDS port (225 Mpixels/sec), one HDMI 1.4 transmitter (1080p60), one dual-channel LVDS port (170 Mpixels/sec), and one MIPI DSI interface (up to 1 Gbps per lane). Total raw pixel throughput reaches 450 Mpixels/sec at 24 bpp, enabling dual HD or quad-WXGA output configurations in industrial HMIs without external display controllers.

What camera interfaces does MCIMX6D4AVT08ACR provide, and what are their maximum data rates?

MCIMX6D4AVT08ACR provides two independent camera interfaces: a parallel 20-bit interface supporting up to 240 MHz pixel clock (4.8 Gbps raw throughput), and a MIPI CSI-2 receiver supporting 1–4 data lanes at up to 1 Gbps per lane (3-lane mode = 3 Gbps, 4-lane mode = 3.2 Gbps). Both interfaces feed into the dual IPUv3H units for hardware-accelerated image processing, enabling real-time de-bayering, scaling, and format conversion for industrial vision applications.

Is MCIMX6D4AVT08ACR pin-compatible with other i.MX 6Dual variants like MCIMX6D7CVT08AC?

Yes, MCIMX6D4AVT08ACR is fully pin-compatible with all i.MX 6Dual variants in the same FCPBGA 21×21 mm package (e.g., MCIMX6D7CVT08AC, MCIMX6D6AVT08AC), sharing identical ball map, power sequencing, and signal definitions. Differences lie in silicon revision (D4 vs D6/D7), fuse settings (e.g., MLB enable), and minor electrical specs-not physical layout. This enables drop-in replacement and shared PCB design across industrial-grade i.MX 6Dual SKUs.