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NXP Semiconductors MCIMX6D4AVT10AER

Part No.:
MCIMX6D4AVT10AER
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
624-FBGA, FCBGA
Datasheet:
AetrixMCIMX6D4AVT10AER.pdf
Description:
IC MPU I.MX6D 1.0GHZ 624FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,524

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Product details

Overview

MCIMX6D4AVT10AER from NXP Semiconductors is an automotive-grade i.MX 6Dual application processor featuring dual Arm Cortex-A9 cores at 1 GHz, integrated GPU (OpenGL ES 2.0, OpenVG 1.1, 2D BitBlt), no VPU, 1 MB shared L2 cache, and FCPBGA-624 package (21 × 21 mm, 0.8 mm pitch). It targets infotainment head units requiring concurrent display rendering, audio processing, and CAN-based vehicle network integration.

For engineers reviewing the MCIMX6D4AVT10AER datasheet, MCIMX6D4AVT10AER pinout, MCIMX6D4AVT10AER application, or MCIMX6D4AVT10AER equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface support, dual FlexCAN 1 Mbps controllers, HDMI 1.4 and MIPI DSI display outputs, and hardware-accelerated security via CAAM and TrustZone.

Technical Context

The MCIMX6D4AVT10AER implements a symmetric dual-core Arm Cortex-A9 MPCore platform with private L1 caches (32 KB I/D per core), unified 1 MB L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. Its memory subsystem includes boot ROM (96 KB), OCRAM (256 KB), secure RAM (16 KB), and a 64-bit MMDC supporting DDR3-1066, DDR3L-1066, and LPDDR2-800.

Peripherals are routed through AXI/AHB fabric with dedicated accelerators: GPU3Dv4 (200 MTri/s), GPU2Dv2, GPUVG, ASRC (10-channel sample rate conversion), dual IPUv3H for image processing, and CAAM with 16 KB secure RAM. Power management integrates DVFS, software state retention, and hardware power gating across CPU, MPE, and domain clocks.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm Cortex-A9 @ 1 GHz - delivers deterministic real-time response for HMI and telematics tasks
L2 Cache1 MB unified - reduces external memory bandwidth pressure during concurrent multimedia workloads
GraphicsGPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, GPUVG - enables smooth 2D/3D UI rendering and vector graphics without CPU load
Memory Interface64-bit DDR3/DDR3L/LPDDR2 up to 1066 MHz - supports high-bandwidth display frame buffers and OS operation
Automotive Interfaces2× FlexCAN 1 Mbps, MLB150, ESAI, ASRC - meets ISO 11898-2 and automotive audio synchronization requirements
Display OutputsHDMI 1.4, MIPI DSI (1 Gbps/lane), LVDS, parallel RGB - drives up to four displays simultaneously (e.g., cluster + center stack + rear seat)
SecurityCAAM (16 KB secure RAM), TrustZone, A-HAB v4 (SHA-256, 2048-bit RSA) - enables secure boot, DRM, and encrypted firmware updates

Pinout & Package

MCIMX6D4AVT10AER is housed in a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and lidded construction. Pin assignments follow the standardized i.MX 6 signal naming convention defined in IMX 6 Series Standardized Signal Name Map (EB792).

Pin/TerminalCircuit RoleDesign Meaning
VDD_ARMCore voltage supply1.2–1.3 V input for dual Cortex-A9 cores; requires low-noise regulation and tight transient response
VDD_SOCSystem-on-chip voltage1.2–1.3 V supply for L2 cache, MMDC, and interconnect fabric; shares regulator with VDD_ARM in many designs
DDR_DQ[0:63]DDR data bus64-bit bidirectional data lines for DDR3/DDR3L/LPDDR2; require matched-length routing and on-die termination control
CAN1_TX / CAN1_RXFlexCAN 1 differential pairISO 11898-2 compliant CAN bus interface; supports 1 Mbps bit rate and fault-tolerant signaling
HDMI_TX_CLK / HDMI_TX_DATA[0:2]HDMI 1.4 TMDS outputHigh-speed differential clock and data lanes; require controlled impedance (100 Ω differential) and ESD protection
CSI_MCLK / CSI_DATA[0:19]Parallel camera interface20-bit pixel bus with programmable clock up to 240 MHz; supports raw sensor output for ADAS front camera preprocessing

Key Features

FeatureDesign Value
Dual Cortex-A9 + NEON MPEEnables concurrent Linux RTOS execution and SIMD-accelerated audio/video preprocessing without offloading to DSP
Hardware ASRC (10 channels)Eliminates software resampling latency between asynchronous audio sources (e.g., Bluetooth A2DP + CAN gateway audio)
CAAM with 16 KB secure RAMProvides tamper-resistant key storage and cryptographic acceleration for TLS 1.2, AES-256-GCM, and SHA-256
Smart DMA (SDMA) controllerOffloads peripheral-to-memory transfers (e.g., camera → IPU → DDR) without CPU intervention, reducing active power by ~18%
Dynamic Voltage/Frequency ScalingAdjusts core voltage and frequency in real time based on thermal headroom and workload, extending junction life in automotive under-hood environments

Applications

Infotainment Head UnitDigital Instrument Cluster

Use Scenario: Central touchscreen unit integrating navigation, media playback, voice assistant, and vehicle settings.

IC Role / Device Role / Timing Role: Primary application processor executing Android Automotive OS, driving HDMI/LVDS displays, managing USB/Wi-Fi/BT connectivity, and handling CAN message routing.

Use Value: Dual-core 1 GHz performance ensures responsive UI with concurrent 1080p video decode (via GPU), audio mixing, and real-time CAN diagnostics-all within automotive thermal envelope.

Use Scenario: Driver-facing digital gauge cluster displaying speed, warnings, ADAS status, and navigation turn-by-turn.

IC Role / Device Role / Timing Role: Real-time graphics processor rendering safety-critical gauges using OpenGL ES 2.0, synchronized to vehicle CAN bus timing and engine RPM signals.

Use Value: Hardware-accelerated 2D/3D rendering and ASRC enable jitter-free analog needle animation and multi-source audio alerts without CPU scheduling delays.

Rear-Seat Entertainment SystemTelematics Control Unit (TCU)

Use Scenario: Dual-display system for passengers with independent video playback, wireless headphones, and HDMI mirroring.

IC Role / Device Role / Timing Role: Media processor managing dual MIPI DSI outputs, SPDIF audio, and eMMC storage while isolating passenger content from critical vehicle networks.

Use Value: Dedicated GPUVG and GPU2D handle vector-based UI scaling and video overlays across two displays with zero frame tearing.

Use Scenario: Cellular-connected module aggregating CAN, LIN, and sensor data for remote diagnostics, OTA updates, and emergency call (eCall) services.

IC Role / Device Role / Timing Role: Secure gateway processor performing protocol translation (CAN ↔ LTE), encrypted data packaging, and A-HAB-verified firmware validation before update execution.

Use Value: CAAM and TrustZone enforce hardware-rooted chain of trust, preventing unauthorized firmware injection during cellular OTA delivery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive application processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCIMX6D6AVT10ACIncludes VPU for 1080p video decode; same CPU, GPU, package, and temperature gradeRequired when full hardware video decode (H.264/VC-1) is needed alongside graphics renderingSelect MCIMX6D6AVT10AC if video playback capability is mandatory; otherwise MCIMX6D4AVT10AER reduces BOM cost and thermal load
MCIMX6Y2DVM08ACSingle-core Cortex-A7 @ 800 MHz, smaller 14 × 14 mm FCBGA-361 package, no GPU3D or HDMITargeted at cost-sensitive instrument clusters or body control modules with basic GUI needsChoose MCIMX6Y2DVM08AC only for non-multimedia roles where 1 GHz dual-core performance and display interfaces are unnecessary

Compared with MCIMX6D6AVT10AC, MCIMX6D4AVT10AER trades video decode capability for lower power and cost-ideal for graphics-centric but decode-light applications. Against MCIMX6Y2DVM08AC, it delivers 2.5× CPU throughput and full automotive display/audio subsystems, justifying its use in premium head units.

Availability

MCIMX6D4AVT10AER is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, rear-seat entertainment systems, and telematics control units requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6D4AVT10AER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive functional safety.

The i.MX 6Dual series-including MCIMX6D4AVT10AER-is designed specifically for automotive infotainment and HMI applications requiring ASIL-B capable processing, hardware security, and rich multimedia acceleration under extended temperature operation.

FAQ

What is the maximum operating temperature range for MCIMX6D4AVT10AER?

The MCIMX6D4AVT10AER is rated for automotive temperature grade (−40°C to +125°C junction), validated per AEC-Q100 Grade 2 requirements. This range supports under-hood and dashboard-mounted deployments where ambient temperatures exceed 85°C and thermal cycling is severe. The device integrates on-die temperature sensors and dynamic thermal management logic to throttle frequency or trigger safe shutdown if junction exceeds 125°C.

Does MCIMX6D4AVT10AER support HDMI 2.0 or only HDMI 1.4?

MCIMX6D4AVT10AER supports HDMI 1.4 only, with a maximum TMDS clock of 165 MHz (1080p60). It does not implement HDMI 2.0 features such as 4K resolution, HDR metadata transport, or HDCP 2.2. The HDMI transmitter complies with HDMI 1.4a specification and supports HDCP 1.4 encryption. For 4K-capable designs, NXP's i.MX 8M series or i.MX 6QuadPlus variants would be required.

Can MCIMX6D4AVT10AER boot directly from eMMC 4.5 without external SPI NOR flash?

Yes, MCIMX6D4AVT10AER supports booting directly from eMMC 4.5 (or eMMC 4.41) using the uSDHC controller in boot mode, eliminating the need for external SPI NOR flash. Boot configuration is set via BOOT_MODE pins (e.g., BOOT_MODE[1:0] = 10), and the internal boot ROM loads the SPL (Secondary Program Loader) from eMMC boot partitions. This reduces BOM count and improves boot reliability in space-constrained automotive modules.

What security certifications apply to MCIMX6D4AVT10AER's CAAM module?

The CAAM module in MCIMX6D4AVT10AER includes NIST-certified cryptographic primitives: DRBG (validation #94) and SHS (validation #1455) under the Cryptographic Algorithm Validation Program (CAVP). It supports FIPS 140-2 Level 1 compliance when configured per NXP's Security Reference Manual (IMX6DQ6SDLSRM). CAAM provides hardware-accelerated AES-128/256, SHA-1/256, RSA-2048, and True/Pseudo RNG functions used by MCIMX6D4AVT10AER's A-HAB v4 secure boot flow.

Is MCIMX6D4AVT10AER pin-compatible with MCIMX6D6AVT10AC?

Yes, MCIMX6D4AVT10AER is pin-compatible with MCIMX6D6AVT10AC: both use identical 624-ball FCPBGA-21×21mm packages with identical ball map, power sequencing, and signal definitions per the i.MX 6Dual Automotive datasheet (IMX6DQAEC Rev. 6). The only functional difference is the absence of VPU hardware in MCIMX6D4AVT10AER; all other peripherals, memory interfaces, and security blocks share identical pin assignments and electrical characteristics.

MCIMX6D4AVT10AER Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
624-FBGA, FCBGA
Series:
i.MX6D
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
624-FCBGA (21x21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

MCIMX6D4AVT10AER FAQ

1.How can I place an order for MCIMX6D4AVT10AER through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6D4AVT10AER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6D4AVT10AER reliable?

The price and inventory of MCIMX6D4AVT10AER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D4AVT10AER is usually 5 days.

3.What payment methods are accepted for MCIMX6D4AVT10AER?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D4AVT10AER transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6D4AVT10AER?

MCIMX6D4AVT10AER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6D4AVT10AER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6D4AVT10AER?

For technical support, including MCIMX6D4AVT10AER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D4AVT10AER requirements.

6.How does Aetrix verify that MCIMX6D4AVT10AER is sourced from the original manufacturer or authorized distributors?

All MCIMX6D4AVT10AER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D4AVT10AER meets industry standards.

7.What is the process for return or replacement of MCIMX6D4AVT10AER?

All MCIMX6D4AVT10AER units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D4AVT10AER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6D4AVT10AER part is unused and in its original packaging.

Return procedure for MCIMX6D4AVT10AER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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