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NXP Semiconductors MCIMX6D5EYM10AC
- Part No.:
- MCIMX6D5EYM10AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6D5EYM10AC.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:250
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Product details
Overview
MCIMX6D5EYM10AC from NXP Semiconductors is an industrial-grade i.MX 6Dual applications processor featuring dual Arm Cortex-A9 cores operating at 1.0 GHz, integrated VPU and GPU, 1 MB L2 cache, and FCPBGA-624 (21 × 21 mm, 0.8 mm pitch) packaging. It supports DDR3/DDR3L/LPDDR2-800 memory, HDMI 1.4, MIPI CSI-2/DSI, Gigabit Ethernet, and dual FlexCAN - deployed in rugged HMI, industrial gateways, and edge vision systems.
For engineers reviewing the MCIMX6D5EYM10AC datasheet, MCIMX6D5EYM10AC pinout, MCIMX6D5EYM10AC application, or MCIMX6D5EYM10AC equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), dual-core 1.0 GHz performance with hardware video acceleration, DDR3L/LPDDR2 interface timing compliance, and FCPBGA-624 mechanical compatibility for thermal and signal integrity validation.
Technical Context
The MCIMX6D5EYM10AC implements a symmetric dual-core Arm Cortex-A9 MPCore platform with TrustZone security, each core including 32 KB L1 instruction and data caches, NEON MPE coprocessor, private timer, and watchdog. The SoC integrates a shared 1 MB unified L2 cache, SCU, GIC supporting 128 interrupts, and dual 64-bit AXI master interfaces.
It embeds dedicated multimedia accelerators: VPU for 1080p encode/decode, dual IPUv3H for image processing, GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2 (BitBLT), GPUVGv2 (OpenVG 1.1), and ASRC for multi-channel audio sample rate conversion - all coordinated via Smart DMA (SDMA) and AXI/AHB fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual Arm Cortex-A9 r2p10 cores with TrustZone, 1.0 GHz max frequency (industrial grade, 24 MHz reference clock) |
| L2 Cache | 1 MB unified instruction/data cache, shared across both cores, critical for inter-core coherency and real-time deterministic latency |
| Memory Interface | 64-bit DDR3/DDR3L-1066 or dual x32 LPDDR2-800 with interleaving support; enables ≥5.3 GB/s theoretical bandwidth for video frame buffering |
| Video Acceleration | VPU supporting H.264/H.263/MPEG-4 decode up to 1080p30 and encode up to 720p30; eliminates CPU load for streaming analytics preprocessing |
| Graphics Units | GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2 (hardware BitBLT), GPUVGv2 (OpenVG 1.1); enables concurrent UI rendering and vector graphics overlay |
| Industrial Temp Range | −40°C to +105°C junction temperature; validated for continuous operation in uncooled enclosures and extended thermal cycling environments |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded; supports standard reflow profiles and provides mechanical stability for high-vibration industrial mounting |
Pinout & Package
MCIMX6D5EYM10AC is housed in a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and integrated heat spreader lid. Pin assignments follow NXP's standardized signal naming convention per IMX6DQIEC Rev. 6, with functional contact mapping defined in Section 6.2 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply for Arm Cortex-A9 cluster | Must be regulated to 1.2–1.3 V with ≤20 mV ripple; supplies both CPU cores and L1/L2 cache logic |
| VDD_SOC | System-on-chip domain power | Supplies MMDC, GPC, CCM, and peripheral logic; requires tight regulation (0.95–1.05 V) for DDR timing stability |
| DDR_DQ[0:63] | Double-data-rate data bus | 64-bit bidirectional DQ lines with on-die termination; routed as length-matched differential pairs for 1066 MT/s operation |
| BOOT_MODE[0:1] | Boot configuration strapping inputs | Pulled high/low at power-up to select boot source (eMMC, NAND, SPI NOR, SD card); no internal pull-ups/pull-downs |
| ENET_RXD[0:3]/TXD[0:3] | Gigabit Ethernet PHY interface | RMII/RGMII-capable pins; require external 50 Ω series termination and 100 Ω differential pair routing for IEEE 802.3 compliance |
| CSI_DATA[0:7]/CLK | Parallel camera sensor interface | Supports 20-bit YUV/RGB capture up to 240 MHz pixel clock; requires controlled-impedance routing and matched trace lengths |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage and frequency scaling (DVFS) across CPU, GPU, VPU, and memory domains reduces active power by up to 40% vs. fixed-frequency operation |
| Hardware Security Subsystem | CAAM with NIST-certified PRNG, 16 KB secure RAM, and A-HAB v4 boot authentication enable secure firmware updates and DRM-compliant content pipelines |
| Multi-Display Support | Simultaneous parallel RGB + LVDS + HDMI 1.4 + MIPI DSI outputs (up to 4 active); enables quad-display HMIs without external TCON or bridge ICs |
| Real-Time Camera Processing | Dual MIPI CSI-2 receivers (4-lane @ 800 Mbps/lane) + dual IPUv3H units allow concurrent 1080p@30fps input and hardware-accelerated de-warping/compositing |
| Industrial Connectivity | Two FlexCAN 2.0B controllers (1 Mbps), five UARTs (one with RS485 multidrop), and PCIe v2.0 x1 support deterministic fieldbus integration and legacy device bridging |
Applications
| Industrial HMI | Edge Vision Gateway |
|---|---|
|
Use Scenario: Rugged touchscreen panel in factory automation with real-time alarm visualization and recipe management. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based Qt UI, driving parallel RGB + HDMI displays, and managing CANopen fieldbus I/O via FlexCAN. Use Value: Dual Cortex-A9 cores handle UI rendering and PLC communication concurrently; GPU2Dv2 accelerates widget compositing while VPU pre-processes diagnostic camera feeds. |
Use Scenario: IP-rated gateway aggregating video streams from four IP cameras and performing AI inference at network edge. IC Role / Device Role / Timing Role: Central media processor running Yocto Linux, ingesting MIPI CSI-2 video, offloading H.264 encoding to VPU, and forwarding metadata over Gigabit Ethernet. Use Value: Hardware VPU reduces CPU utilization from >90% to <15% during 1080p encode; SDMA channels enable zero-copy frame transfers between CSI, VPU, and DDR. |
| Railway Onboard Controller | Medical Imaging Terminal |
|
Use Scenario: EN 50121-compliant onboard computer for train diagnostics, displaying live sensor telemetry and video surveillance. IC Role / Device Role / Timing Role: Safety-aware applications processor with SNVS RTC, temperature monitoring, and dual Watchdog timers (WDOG1/WDOG2) for fail-safe reset supervision. Use Value: Industrial temp grade (−40°C to +105°C) ensures reliability in unheated underfloor compartments; CAAM enables encrypted log storage compliant with rail cybersecurity standards. |
Use Scenario: DICOM viewer terminal in radiology suite requiring high-fidelity grayscale rendering and DICOM file handling. IC Role / Device Role / Timing Role: High-integrity display controller driving dual LVDS panels (2048×1536) with gamma-corrected grayscale LUTs and SPDIF audio output for voice annotation. Use Value: GPU3Dv4 renders 16-bit medical images with OpenGL ES 2.0 fragment shaders; ASRC synchronizes audio playback to DICOM study timestamps with <1 ms jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AC | 800 MHz max CPU frequency, same FCPBGA-624 package, identical peripheral set but lower clock binning | Suitable for cost-sensitive industrial HMIs where 1.0 GHz burst performance is not required | Select when thermal budget limits sustained 1.0 GHz operation or when legacy software stack is validated only at 800 MHz |
| i.MX 8M Mini (NXP MIMX8MM6CVTKZAA) | Quad Cortex-A53 + Cortex-M4, 1.8 GHz A53, 2 GB LPDDR4, integrated MIPI DSI/LVDS, but different pinout and power architecture | Targeted at next-gen edge AI with neural network acceleration (NPU), higher memory bandwidth, and enhanced security (TEE) | Choose for new designs requiring AI inference, longer product lifecycle, or migration path beyond Cortex-A9; not drop-in compatible |
Compared with MCIMX6D5EYM10AC, MCIMX6D7CVT08AC offers identical feature set at reduced frequency and cost, while i.MX 8M Mini delivers architectural advancement with A53 cores and NPU but requires PCB redesign and software re-architecture.
Availability
MCIMX6D5EYM10AC is available at Aetrix Electronics and suitable for industrial HMIs, edge vision gateways, railway onboard controllers, and medical imaging terminals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6D5EYM10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and edge AI platforms.
The i.MX 6Dual family, including MCIMX6D5EYM10AC, was designed specifically for industrial and embedded applications demanding high multimedia throughput, real-time responsiveness, and extended temperature reliability - not consumer or automotive infotainment.
FAQ
What is the maximum operating frequency of the MCIMX6D5EYM10AC under industrial temperature conditions?
The MCIMX6D5EYM10AC is rated for 1.0 GHz operation across its full industrial junction temperature range of −40°C to +105°C when using a 24 MHz crystal reference clock. This frequency is validated per IMX6DQIEC Rev. 6 electrical specifications, with DVFS enabling dynamic down-clocking to 800 MHz or lower for thermal management without system reset. The MCIMX6D5EYM10AC maintains timing closure and functional correctness at 1.0 GHz even at maximum ambient temperature with appropriate PCB thermal design.
Does the MCIMX6D5EYM10AC support LPDDR2 memory, and what are the supported configurations?
Yes, the MCIMX6D5EYM10AC supports LPDDR2-800 in dual x32 channel configuration with interleaving enabled, delivering up to 6.4 GB/s peak bandwidth. It supports 16-bit and 32-bit LPDDR2 devices with 400 MHz clock (800 MT/s), including JEDEC-compliant low-power self-refresh and partial-array self-refresh modes. The MCIMX6D5EYM10AC MMDC controller validates LPDDR2 timing parameters per JESD209-2 specification, with on-die termination and programmable drive strength calibrated per board layout.
How many independent display interfaces does the MCIMX6D5EYM10AC support simultaneously?
The MCIMX6D5EYM10AC supports up to four independent display interfaces concurrently: one parallel RGB (24-bit, up to WUXGA), one LVDS (dual-channel, up to WUXGA), one HDMI 1.4 (1080p60), and one MIPI DSI (2-lane, up to 1 Gbps). These interfaces share bandwidth via the AXI fabric but operate with independent timing controllers and pixel clocks. The MCIMX6D5EYM10AC LDB and IPU subsystems manage synchronization and blending without CPU intervention.
What security features are implemented in hardware on the MCIMX6D5EYM10AC?
The MCIMX6D5EYM10AC integrates CAAM (Cryptographic Acceleration and Assurance Module) with NIST-certified PRNG, 16 KB secure RAM, AES-128/256, SHA-256, and RSA-2048 acceleration; SNVS (Secure Non-Volatile Storage) with tamper-resistant SRTC; CSU (Central Security Unit) enforcing fuse-based security policies; and A-HAB v4 for signed boot image verification. These features are active by default in the MCIMX6D5EYM10AC and require no external security ICs for secure boot or encrypted storage.
Is the MCIMX6D5EYM10AC pin-compatible with other i.MX 6Dual variants such as MCIMX6D7CVT08AC?
Yes, the MCIMX6D5EYM10AC is pin-compatible with MCIMX6D7CVT08AC and all other i.MX 6Dual FCPBGA-624 variants (e.g., MCIMX6D5EYM10AD), sharing identical ball map, power sequencing, and signal definitions per IMX6DQIEC Rev. 6. Mechanical and electrical compatibility allows direct substitution on existing PCBs, though software must be validated for 1.0 GHz timing margins and updated thermal management policies specific to the MCIMX6D5EYM10AC.
MCIMX6D5EYM10AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D5EYM10AC FAQ
1.How can I place an order for MCIMX6D5EYM10AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D5EYM10AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D5EYM10AC reliable?
The price and inventory of MCIMX6D5EYM10AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D5EYM10AC is usually 5 days.
3.What payment methods are accepted for MCIMX6D5EYM10AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D5EYM10AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D5EYM10AC?
MCIMX6D5EYM10AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D5EYM10AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D5EYM10AC?
For technical support, including MCIMX6D5EYM10AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D5EYM10AC requirements.
6.How does Aetrix verify that MCIMX6D5EYM10AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6D5EYM10AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D5EYM10AC meets industry standards.
7.What is the process for return or replacement of MCIMX6D5EYM10AC?
All MCIMX6D5EYM10AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D5EYM10AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D5EYM10AC part is unused and in its original packaging.
Return procedure for MCIMX6D5EYM10AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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