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NXP Semiconductors MCIMX6D5EYM10ACR
- Part No.:
- MCIMX6D5EYM10ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6D5EYM10ACR.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,820
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Product details
Overview
MCIMX6D5EYM10ACR from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 1.0 GHz, featuring integrated VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode and parallel image processing. It supports DDR3/DDR3L/LPDDR2-800 memory, Gigabit Ethernet, dual CAN, MIPI CSI-2/DSI, HDMI 1.4, and SATA II - deployed in rugged HMI, industrial gateways, and medical imaging systems.
For engineers reviewing the MCIMX6D5EYM10ACR datasheet, MCIMX6D5EYM10ACR pinout, MCIMX6D5EYM10ACR application, or MCIMX6D5EYM10ACR equivalent, key selection criteria include verified industrial temperature range (−40°C to +105°C), FCPBGA-624 package compatibility, dual-core DVFS support, hardware-accelerated multimedia subsystems, and secure boot via CAAM + A-HAB v4 with SHA-256 and 2048-bit RSA.
Technical Context
The MCIMX6D5EYM10ACR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and SCU coherency management. It integrates eight PLLs, on-chip oscillators (24 MHz crystal input required for USB), and a multi-domain power management unit supporting dynamic voltage and frequency scaling (DVFS) across CPU, GPU, and media subsystems.
Its system architecture includes four independent AXI masters, SPBA interconnect for peripheral arbitration, and dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode, dual IPUv3H for real-time image scaling/compositing, ASRC for asynchronous audio sample rate conversion (up to 10 channels), and CAAM with 16 KB secure RAM and NIST-certified PRNG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 1.0 GHz - enables concurrent real-time control and rich UI execution without OS scheduling bottlenecks. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports up to 4 GB external RAM with interleaving for sustained 12.8 GB/s bandwidth in dual-channel mode. |
| Graphics Acceleration | GPU3Dv4 (200 MTri/s), GPU2Dv2, GPUVGv2 - delivers OpenGL ES 2.0 rendering, BitBLT operations, and OpenVG 1.1 vector graphics for responsive touch HMIs. |
| Video Processing | VPU + dual IPUv3H - enables simultaneous 1080p60 decode + 1080p30 encode + real-time deinterlacing/scaling, reducing CPU load by >70% vs software-only pipelines. |
| Security | CAAM (16 KB secure RAM), A-HAB v4, TrustZone, SNVS - provides hardware-enforced secure boot, encrypted key storage, and runtime integrity checking compliant with IEC 62443 Level 3. |
| Industrial Temp Range | −40°C to +105°C junction - qualified for continuous operation in uncooled enclosures, railway onboard units, and factory-floor edge controllers. |
| I/O Interfaces | 4x uSDHC, 2x FlexCAN (1 Mbps), 1x PCIe v2.0 x1, 1x SATA II, 5x UART (5 Mbps), 3x I²C (400 kHz), HDMI 1.4, MIPI CSI-2/DSI - enables full-stack connectivity without external bridge ICs. |
Pinout & Package
MCIMX6D5EYM10ACR is housed in a 21 mm × 21 mm FCPBGA package with 624 solder balls and 0.8 mm pitch. The package is lidded and RoHS-compliant, designed for reflow assembly and thermal dissipation in industrial PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M_IN | Primary Oscillator Input | Mandatory 24 MHz crystal reference for USB PHY clock generation and system timing synchronization. |
| VDD_ARM | CPU Core Power Supply | 1.1–1.3 V regulated supply; voltage must be dynamically scaled with CPU frequency per DVFS profile. |
| VDD_SOC | SoC Logic Domain Supply | 1.2–1.3 V supply powering L2 cache, interconnect, and peripheral logic; requires low-noise regulation. |
| DDR_VREF | DDR Reference Voltage | 0.5 × VDD_DDR; critical for signal integrity on 64-bit DDR interface - must be sourced from dedicated VREF generator. |
| BOOT_MODE[1:0] | Boot Configuration Pins | Pulled high/low at reset to select boot device (eMMC, NAND, SPI NOR, or SD card); determines initial firmware load path. |
| ENET_MDIO / ENET_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for configuring external PHY registers; supports IEEE 1588 timestamping. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Hardware-managed power gating across CPU clusters, GPU, and media engines reduces idle power to <350 mW while preserving context. |
| Multi-Mode DDR Controller (MMDC) | Supports DDR3-1066, DDR3L-1066, LPDDR2-800 with on-die termination calibration and write-leveling - eliminates manual board tuning. |
| Secure Non-Volatile Storage (SNVS) | Includes tamper-resistant SRTC and eFUSE-based key storage; survives full power cycles and enables secure time-stamped logging. |
| Asynchronous Sample Rate Converter (ASRC) | Converts up to 10 independent audio streams between mismatched clocks (e.g., 44.1 kHz ↔ 48 kHz) with <−120 dB THD+N - eliminates software resampling latency. |
| Enhanced Serial Audio Interface (ESAI) | Full-duplex TDM-capable interface with 12-pin routing; supports 7.1-channel audio at 260 kHz sample rate - ideal for industrial voice I/O and diagnostics. |
Applications
| Industrial HMI | Rugged Edge Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface in chemical plant control cabinets exposed to vibration, dust, and wide ambient temperature swings. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based Qt UI, real-time EtherCAT master stack, and local video analytics. Use Value: Dual Cortex-A9 cores isolate UI rendering from deterministic control tasks; GPU2Dv2 accelerates anti-aliased vector graphics; −40°C to +105°C rating ensures reliability without forced air cooling. |
Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, CANopen, and PROFIBUS data for cloud upload via LTE/Wi-Fi. IC Role / Device Role / Timing Role: Central protocol translation engine with hardware-accelerated crypto (CAAM) for TLS 1.2 and secure OTA updates. Use Value: Integrated FlexCAN + UART + eCSPI interfaces eliminate protocol bridge ICs; A-HAB v4 enforces signed firmware validation before boot; 16 KB CAAM RAM stores session keys offline. |
| Medical Imaging Terminal | Intelligent Transportation System (ITS) |
Use Scenario: Portable ultrasound display unit requiring real-time beamforming visualization and DICOM export over Gigabit Ethernet. IC Role / Device Role / Timing Role: Media processing hub handling raw sensor data ingestion, GPU-accelerated image enhancement, and HDMI 1.4 output timing. Use Value: VPU decodes compressed DICOM streams at 1080p60; IPUv3H performs real-time gamma correction and noise reduction; HDMI Tx meets clinical display timing jitter specs (<1 ns). |
Use Scenario: In-vehicle traffic camera node capturing license plates under variable lighting, performing ANPR preprocessing before sending metadata to central server. IC Role / Device Role / Timing Role: Vision coprocessor running YOLOv3-tiny inference on MIPI CSI-2 input while managing GPS timestamp sync and LTE modem handshaking. Use Value: Dual MIPI CSI-2 lanes ingest 1000 Mbps/lane video; ASRC aligns audio triggers with frame capture; −40°C to +105°C rating supports under-hood mounting near engine bay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Arm applications processors.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D6AVT10AC | Same dual-core Cortex-A9, but rated for automotive grade (−40°C to +125°C) and includes MLB (Media Link Bus) interface; lacks industrial temp certification. | Targeted at automotive infotainment head units requiring AEC-Q100 qualification and CAN FD support - not validated for industrial thermal cycling. | Select when AEC-Q100 compliance and extended junction temperature margin are mandatory; verify MLB interface utilization matches design needs. |
| i.MX 8M Mini (NXP MMIMX8MQ5CZND8AB) | Quad-core Cortex-A53 + Cortex-M4, 1.8 GHz A53, integrated LPDDR4 support, and newer GC7000UL GPU - no VPU or IPUv3H; uses different security model (SECO). | Suitable for next-gen IoT gateways needing AI inference (via M4) and higher throughput, but requires redesign of video pipeline and boot firmware. | Choose for future-proofing with AI acceleration and LPDDR4; avoid if legacy 1080p video decode or IPU-based image compositing is required. |
Compared with MCIMX6D5EYM10ACR, MCIMX6D6AVT10AC offers higher thermal margin but lacks industrial qualification documentation and MLB is unused in most non-automotive designs; i.MX 8M Mini delivers greater CPU performance and AI capability but removes hardware video acceleration blocks critical for real-time imaging - making MCIMX6D5EYM10ACR optimal for cost-sensitive, video-centric industrial deployments.
Availability
MCIMX6D5EYM10ACR is available at Aetrix Electronics and suitable for industrial HMIs, rugged edge gateways, and medical imaging terminals requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D5EYM10ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with R&D centers in Eindhoven, Austin, and Singapore.
The i.MX 6Dual family, including MCIMX6D5EYM10ACR, was engineered specifically for industrial applications demanding long-term availability, extended temperature operation, and hardware-accelerated multimedia - targeting markets where reliability trumps raw compute density.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6D5EYM10ACR?
MCIMX6D5EYM10ACR supports DDR3-1066 (533 MHz) and DDR3L-1066 with 64-bit bus width. Its Multi-Mode DDR Controller (MMDC) enables interleaved access across two 32-bit channels, delivering up to 12.8 GB/s theoretical bandwidth. This speed is validated under industrial temperature conditions (−40°C to +105°C) and requires proper PCB layout with matched trace lengths and on-die termination calibration.
Does MCIMX6D5EYM10ACR include hardware cryptographic acceleration?
Yes, MCIMX6D5EYM10ACR integrates the Cryptographic Acceleration and Assurance Module (CAAM) with 16 KB of dedicated secure RAM, NIST-certified PRNG, and hardware engines for AES-128/256, SHA-1/256, RSA-2048, and HMAC. These features enable TLS 1.2 handshake acceleration, secure boot verification (A-HAB v4), and runtime key management - all without consuming CPU cycles.
Can MCIMX6D5EYM10ACR boot directly from eMMC?
Yes, MCIMX6D5EYM10ACR supports eMMC boot via its uSDHC3 controller in HS200 mode. Boot configuration is set using BOOT_MODE[1:0] pins, and the internal Boot ROM loads the SPL (Secondary Program Loader) from eMMC's boot partition. This configuration is validated for eMMC rev 4.41 and requires proper eMMC initialization timing per JEDEC JESD84-B51 spec.
What video codecs are hardware-accelerated by the VPU in MCIMX6D5EYM10ACR?
The VPU in MCIMX6D5EYM10ACR provides full hardware acceleration for H.264 High Profile (BP/MP/HP), VC-1 Advanced Profile, MPEG-2, MPEG-4 Part 2, and DivX/Xvid decoding up to 1080p60. Encoding is supported for H.264 BP/MP and MPEG-4 Part 2 up to 1080p30. No hardware JPEG encode/decode is included - that function relies on the IPUv3H or software libraries.
Is MCIMX6D5EYM10ACR pin-compatible with other i.MX 6Dual variants like MCIMX6D7CVT08AC?
No, MCIMX6D5EYM10ACR is not pin-compatible with MCIMX6D7CVT08AC. While both use the same 624-ball FCPBGA-21x21 package, the ball mapping differs due to distinct silicon revisions (E vs D), frequency binning (1.0 GHz vs 800 MHz), and fuse options. Signal assignments for power domains, DDR interface, and peripheral muxing vary - requiring separate PCB layout and schematic validation.
MCIMX6D5EYM10ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D5EYM10ACR FAQ
1.How can I place an order for MCIMX6D5EYM10ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D5EYM10ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D5EYM10ACR reliable?
The price and inventory of MCIMX6D5EYM10ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D5EYM10ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6D5EYM10ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D5EYM10ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D5EYM10ACR?
MCIMX6D5EYM10ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D5EYM10ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D5EYM10ACR?
For technical support, including MCIMX6D5EYM10ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D5EYM10ACR requirements.
6.How does Aetrix verify that MCIMX6D5EYM10ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6D5EYM10ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D5EYM10ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6D5EYM10ACR?
All MCIMX6D5EYM10ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D5EYM10ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D5EYM10ACR part is unused and in its original packaging.
Return procedure for MCIMX6D5EYM10ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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