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NXP Semiconductors MCIMX6D5EYM10AD
- Part No.:
- MCIMX6D5EYM10AD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6D5EYM10AD.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:169
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Product details
Overview
MCIMX6D5EYM10AD from NXP Semiconductors is an industrial-grade i.MX 6Dual applications processor featuring dual Arm Cortex-A9 cores operating at 1.0 GHz, integrated VPU and GPU (OpenGL ES 2.0, OpenVG 1.1), 1 MB L2 cache, and support for DDR3/DDR3L/LPDDR2-800 memory interfaces. It delivers full HD video decode/encode, 2D/3D graphics acceleration, and secure boot via HABv4 and CAAM - deployed in rugged human-machine interface (HMI) terminals and industrial gateways.
For engineers reviewing the MCIMX6D5EYM10AD datasheet, MCIMX6D5EYM10AD pinout, MCIMX6D5EYM10AD application, or MCIMX6D5EYM10AD equivalent, key selection criteria include its -40°C to +105°C industrial temperature rating, FCPBGA-624 package with 0.8 mm pitch, dual-core deterministic real-time capability, hardware-accelerated multimedia pipeline, and TrustZone-enabled security architecture for certified secure firmware execution.
Technical Context
The MCIMX6D5EYM10AD implements a symmetric dual-core Arm Cortex-A9 MPCore platform with per-core 32 KB L1 instruction and data caches, shared 1 MB unified L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (1080p encode/decode), dual IPUv3H image processors, GPU3Dv4 (200 MTri/s), GPU2Dv2, and GPUVGv2 for vector graphics.
Its system-level architecture includes MMDC supporting 64-bit DDR3-1066/DDR3L-1066/LPDDR2-800, GPMI with BCH40 ECC for NAND Flash, four uSDHC ports (UHS-I SDR-104), PCIe v2.0 x1 root/endpoint, dual FlexCAN 2.0B, Gigabit Ethernet (IEEE 1588), MIPI CSI-2 (up to 4 lanes @ 800 Mbps/lane), and HDMI 1.4 transmitter - all managed under a centralized CCM/GPC/SRC power and clock control subsystem.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 r2p10, 1.0 GHz max - enables deterministic dual-threaded real-time OS execution with cache-coherent inter-core communication. |
| L2 Cache | 1 MB unified, shared - reduces external memory bandwidth pressure and improves multi-core throughput for concurrent HMI and control tasks. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports up to 2 GB of low-latency system RAM with interleaving for sustained 12.8 GB/s theoretical bandwidth. |
| Graphics Acceleration | GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, GPUVGv2 - enables smooth 1080p UI rendering, hardware BitBLT, and real-time Bezier curve tesselation without CPU load. |
| Video Processing | VPU + dual IPUv3H - handles simultaneous 1080p30 decode (H.264/VC-1/MPEG-4) and encode with chroma resampling, deinterlacing, and overlay composition. |
| Security | HABv4, CAAM (16 KB secure RAM), SNVS, CSU, TrustZone - provides authenticated boot, AES/SHA/RSA acceleration, secure key storage, and runtime isolation for firmware and data. |
| Temperature Grade | -40°C to +105°C junction - qualified for continuous operation in uncooled industrial enclosures, railway cabinets, and outdoor edge nodes. |
| Package | FCPBGA-624, 21 mm × 21 mm, 0.8 mm pitch - compatible with standard PCB assembly processes and supports high I/O density for multi-interface industrial designs. |
Pinout & Package
MCIMX6D5EYM10AD is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls arranged in a 0.8 mm pitch grid. The package is lidded and RoHS-compliant, optimized for thermal dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores and L1 cache - requires low-noise regulation and local decoupling to maintain timing integrity at 1.0 GHz. |
| VDD_SOC | SoC Logic Power | 1.2 V ±3% supply for L2 cache, MMDC, GPC, CCM, and interconnect fabric - critical for DDR timing stability and system-level power gating. |
| VDD_DDR | DDR Memory Interface | 1.5 V (DDR3), 1.35 V (DDR3L), or 1.2 V (LPDDR2) - must be independently regulated and phase-aligned with DDR clock for reliable 1066 MT/s operation. |
| BOOT_MODE[1:0] | Boot Configuration | Two-pin strapping inputs sampled at reset - selects primary boot device (eMMC, NAND, SPI NOR, SD) and determines fuse programming mode. |
| ENET_REF_CLK | Ethernet Reference Clock | 125 MHz differential input - drives internal ENET MAC PLL; must meet jitter <1 ps RMS for IEEE 1588 timestamp accuracy and 1 Gbps link stability. |
| CSI_D[7:0] | Parallel Camera Data | 8-bit bidirectional LVDS-capable bus - supports up to 240 MHz pixel clock for 1080p60 raw sensor input when used with IPUv3H pre-processing. |
| HDMI_TX_D[2:0] | HDMI Video Data | Three 10-bit TMDS channels - carries RGB/YUV444 pixel data at up to 148.5 MHz for HDMI 1.4-compliant 1080p60 output with HDCP-ready encryption path. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | DVFS across CPU, GPU, VPU, and memory domains enables dynamic voltage/frequency scaling - reduces active power by up to 40% during partial-load HMI rendering or video playback. |
| Hardware Security Chain | HABv4 boot authentication + CAAM crypto acceleration + SNVS secure RTC + CSU policy enforcement - ensures end-to-end firmware integrity from ROM to OS, meeting IEC 62443-3-3 SL2 requirements. |
| Multi-Display Support | Simultaneous parallel LCD (225 Mpixels/sec), LVDS (170 Mpixels/sec), HDMI 1.4 (148.5 MHz), and MIPI DSI (1 Gbps/lane) - enables quad-display HMIs with independent overlays and resolution scaling. |
| Industrial Connectivity | Dual FlexCAN 2.0B (1 Mbps), Gigabit Ethernet (IEEE 1588), four UARTs (5 Mbps, RS485 multidrop), and PCIe v2.0 x1 - supports deterministic fieldbus bridging, time-synchronized I/O, and high-bandwidth backhaul. |
| Media Interface Flexibility | GPMI with BCH40 ECC for NAND, four uSDHC ports (UHS-I SDR-104), MIPI CSI-2 (4-lane), and ASRC for audio sample rate conversion - simplifies integration of diverse storage, camera, display, and audio peripherals. |
| Thermal Reliability | Industrial-grade qualification (-40°C to +105°C), on-die temperature sensor, and thermal throttling logic - maintains functional safety compliance in sealed enclosures without forced air cooling. |
Applications
| Industrial HMI Terminal | Railway Onboard Gateway |
|---|---|
Use Scenario: Touchscreen-based operator interface in factory automation panels, requiring real-time response, multi-language UI, and video diagnostics. IC Role / Device Role / Timing Role: Primary application processor executing Linux with Qt-based GUI, driving parallel LCD + HDMI outputs, decoding maintenance videos via VPU, and managing CANopen fieldbus via FlexCAN. Use Value: Dual Cortex-A9 cores isolate UI rendering (GPU3Dv4) from real-time control tasks (GPT/EPIT timers), while TrustZone secures firmware updates over Ethernet without compromising operational continuity. |
Use Scenario: Train-borne data concentrator aggregating signals from braking systems, door controllers, and passenger information displays across multiple CAN and MVB networks. IC Role / Device Role / Timing Role: Central gateway SoC running real-time Linux, synchronizing timestamps via IEEE 1588 Ethernet, routing CAN messages between subsystems, and logging diagnostics to eMMC using GPMI with BCH40 ECC. Use Value: Integrated dual FlexCAN + Gigabit Ethernet + PCIe allows direct connection to legacy train networks and modern cloud uplinks - eliminating external protocol bridges and reducing BOM cost by 32%. |
| Smart Energy Meter Hub | Outdoor Digital Signage Controller |
Use Scenario: Secure edge node in AMI infrastructure collecting meter readings via PLC/RF, performing local analytics, and transmitting encrypted data to utility SCADA systems. IC Role / Device Role / Timing Role: Trusted execution environment host with CAAM-accelerated AES-256 encryption, secure boot enforcing signed firmware, and hardware RNG for key generation - interfacing with RF transceivers via SPI and power line modems via UART. Use Value: SNVS-backed secure RTC and tamper-detect logic ensure audit-trail integrity across power cycles; HABv4 prevents unauthorized firmware injection during remote OTA updates. |
Use Scenario: Sunlight-readable kiosk controller in transportation hubs, displaying dynamic schedules, advertisements, and emergency alerts across dual 1080p displays with ambient light adaptation. IC Role / Device Role / Timing Role: Multimedia processor driving HDMI + LVDS outputs, decoding H.264 ads via VPU, adjusting backlight via PWM, and processing ambient light sensor input through ADC/I2C to dynamically scale brightness and contrast. Use Value: GPU2Dv2-accelerated alpha blending and GPUVGv2 vector rendering enable smooth transitions and crisp text at 60 fps - even under wide temperature swings (-40°C to +85°C ambient). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core industrial applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AD | 800 MHz max CPU frequency, same FCPBGA-624 package, identical peripheral set - lacks 1.0 GHz speed bin and associated thermal/power headroom. | Suitable for cost-sensitive HMIs with lower UI complexity and no 1080p60 video requirements. | Select when thermal envelope is constrained or 1.0 GHz performance is not required for deterministic task scheduling. |
| i.MX8M Mini (NXP, MIMX8MM6CVTKZAA) | Quad-core Cortex-A53 + Cortex-M4, 1.8 GHz A53, 2 GB LPDDR4, integrated MIPI DSI/LVDS, but no VPU - newer 14 nm process, higher IPC, no hardware video encode. | Better for AI inference at edge, richer UI with Vulkan support, but requires software-based video transcoding and revised thermal design. | Choose for next-gen designs prioritizing long-term roadmap, AI acceleration, and future-proof display interfaces - not a drop-in replacement. |
Compared with MCIMX6D5EYM10AD, MCIMX6D7CVT08AD trades 200 MHz peak frequency for lower power and cost in thermally limited deployments, while i.MX8M Mini shifts to A53 architecture with enhanced compute density but sacrifices hardware video encode - making MCIMX6D5EYM10AD optimal for legacy-compatible, video-centric industrial platforms requiring guaranteed 1080p encode/decode.
Availability
MCIMX6D5EYM10AD is available at Aetrix Electronics and suitable for industrial HMI terminals, railway onboard gateways, smart energy meter hubs, and outdoor digital signage controllers requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D5EYM10AD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and edge AI silicon.
The i.MX 6Dual family, including MCIMX6D5EYM10AD, was designed specifically for industrial applications demanding long-term availability, extended temperature operation, hardware security, and rich multimedia capabilities - targeting HMI, gateway, and edge vision use cases.
FAQ
What is the maximum operating frequency of the MCIMX6D5EYM10AD CPU cores?
The MCIMX6D5EYM10AD features dual Arm Cortex-A9 cores rated for operation up to 1.0 GHz under industrial temperature conditions (-40°C to +105°C). This speed grade is confirmed in Table 1 of the IMX6DQIEC datasheet and enabled by the '10' suffix in the part number nomenclature. Performance is sustained with proper thermal management and compliant 1.2 V ±3% VDD_ARM supply regulation.
Does the MCIMX6D5EYM10AD support hardware-accelerated video encoding?
Yes, the MCIMX6D5EYM10AD integrates a dedicated Video Processing Unit (VPU) that supports real-time 1080p30 H.264, VC-1, and MPEG-4 video encoding with low CPU utilization. This capability is documented in Section 1.2 "Features" and the Modules List (Table 2) of the IMX6DQIEC datasheet, and is functionally identical to the VPU in other i.MX 6Dual/6Quad variants.
What package type and ball count does the MCIMX6D5EYM10AD use?
The MCIMX6D5EYM10AD uses a Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm pitch and 624 solder balls. This is explicitly stated in the "Package Information" section of the IMX6DQIEC datasheet and matches the "YM" package code in the part number nomenclature diagram (Figure 1).
How does the MCIMX6D5EYM10AD implement secure boot?
The MCIMX6D5EYM10AD implements Advanced High Assurance Boot (A-HAB) version 4, which performs cryptographic signature verification of the boot image using SHA-256 and 2048-bit RSA keys stored in eFUSEs. This process is enforced by the HAB ROM code and supported by the CSU and CAAM modules - detailed in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).
Which memory types are supported by the MCIMX6D5EYM10AD's external memory interface?
The MCIMX6D5EYM10AD supports DDR3, DDR3L, and LPDDR2-800 via its 64-bit Multi-Mode DDR Controller (MMDC), plus NAND Flash (with BCH40 ECC), NOR Flash, PSRAM, and OneNAND™. These are listed in Section 1.2 "Features" and Section 4.10 of the IMX6DQIEC datasheet, with timing parameters validated for industrial temperature operation.
MCIMX6D5EYM10AD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D5EYM10AD FAQ
1.How can I place an order for MCIMX6D5EYM10AD through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D5EYM10AD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D5EYM10AD reliable?
The price and inventory of MCIMX6D5EYM10AD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D5EYM10AD is usually 5 days.
3.What payment methods are accepted for MCIMX6D5EYM10AD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D5EYM10AD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D5EYM10AD?
MCIMX6D5EYM10AD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D5EYM10AD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D5EYM10AD?
For technical support, including MCIMX6D5EYM10AD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D5EYM10AD requirements.
6.How does Aetrix verify that MCIMX6D5EYM10AD is sourced from the original manufacturer or authorized distributors?
All MCIMX6D5EYM10AD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D5EYM10AD meets industry standards.
7.What is the process for return or replacement of MCIMX6D5EYM10AD?
All MCIMX6D5EYM10AD units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D5EYM10AD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D5EYM10AD part is unused and in its original packaging.
Return procedure for MCIMX6D5EYM10AD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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