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NXP Semiconductors MCIMX6D5EYM10ADR
- Part No.:
- MCIMX6D5EYM10ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6D5EYM10ADR.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,933
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Product details
Overview
MCIMX6D5EYM10ADR from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 1.0 GHz, featuring integrated VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode, 2D/3D graphics acceleration, and real-time image processing. It implements TrustZone security, supports DDR3L-1066/DDR3-1066/LPDDR2-800 memory, and targets embedded industrial HMI, machine vision, and edge gateway systems.
For engineers reviewing the MCIMX6D5EYM10ADR datasheet, MCIMX6D5EYM10ADR pinout, MCIMX6D5EYM10ADR application, or MCIMX6D5EYM10ADR equivalent, key selection criteria include confirmed 1.0 GHz CPU frequency under industrial temperature (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, verified HDMI 1.4 + MIPI DSI/CSI-2 support, and documented CAAM cryptographic acceleration with 16 KB secure RAM.
Technical Context
The MCIMX6D5EYM10ADR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE coprocessor. It integrates dedicated hardware accelerators including VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP decode), dual IPUv3H for parallel image pipeline processing, and ASRC for multi-channel audio sample rate conversion.
Its system architecture includes MMDC supporting 64-bit DDR3/DDR3L/LPDDR2 interfaces, four uSDHC controllers (UHS-I SDR104), dual FlexCAN 2.0B, Gigabit Ethernet with IEEE 1588 support, PCIe v2.0 x1 root/endpoint, and five UARTs (one with 8-wire RS485). Power management leverages DVFS, software state retention, and integrated PMU with on-die temperature sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 r2p10, 1.0 GHz max - enables concurrent real-time control and rich UI execution without performance throttling in industrial ambient conditions. |
| Memory Interface | 64-bit DDR3/DDR3L-1066, LPDDR2-800 - supports high-bandwidth frame buffering for dual-display or multi-camera applications with interleaved access. |
| Graphics Acceleration | GPU3Dv4 (200 MTri/s, OpenGL ES 2.0), GPU2Dv2, GPUVGv2 - delivers smooth HD1080 UI rendering and vector-based HMI with <5 ms frame latency. |
| Video Processing | VPU + dual IPUv3H - enables simultaneous 1080p30 decode (H.264) and encode (H.264 BP/MP) plus real-time deinterlacing, color space conversion, and scaling. |
| Security | CAAM (16 KB secure RAM), TrustZone, A-HABv4 (SHA-256, 2048-bit RSA), SNVS - provides hardware-rooted secure boot, encrypted firmware update, and runtime key protection for industrial IoT deployments. |
| Industrial Temp Range | −40°C to +105°C junction - validated for continuous operation in uncooled factory automation enclosures and outdoor edge gateways. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - ensures mechanical robustness and thermal dissipation in high-vibration industrial environments. |
Pinout & Package
MCIMX6D5EYM10ADR is housed in a 21 mm × 21 mm FCPBGA package with 624 solder balls and 0.8 mm pitch. The package is lidded for enhanced thermal performance and mechanical protection in industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M | Primary Oscillator Input | Mandatory 24 MHz crystal reference for USB PHY clock generation and system timing synchronization. |
| VDD_ARM | Core Voltage Supply | 1.1–1.3 V regulated supply for Arm Cortex-A9 cores and L1/L2 caches; requires low-noise regulation for stable 1.0 GHz operation. |
| VDD_SOC | SoC Logic Voltage | 1.2–1.3 V supply powering MMDC, GPU, VPU, and interconnect fabric; critical for DDR3L interface signal integrity. |
| BOOT_MODE[1:0] | Boot Configuration | Two-pin strap determining boot source (eMMC, NAND, SPI NOR, SD card); must be pulled high/low during reset for deterministic startup. |
| ENET_RXD[3:0] | Gigabit Ethernet Receive | Four differential pairs for 1000BASE-T receive path; routed with controlled impedance (100 Ω diff) and matched length for <10 ps skew. |
| HDMI_TX_D[2:0] | HDMI Data Lane Output | Three TMDS data channels supporting HDMI 1.4 up to 1080p60; requires AC-coupling and 100 Ω termination at sink. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across CPU, GPU, VPU, and memory domains reduces active power by up to 40% versus fixed-frequency operation while maintaining real-time responsiveness. |
| Multi-Standard Video Codec (VPU) | Hardware-accelerated decode of H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP, and VP8 up to 1080p30 - offloads >95% of video processing from CPU, freeing cores for application logic. |
| Dual IPUv3H Image Pipeline | Two independent image processing units enabling simultaneous camera input preprocessing (demosaic, noise reduction) and display output post-processing (scaling, blending, alpha compositing). |
| CAAM Cryptographic Engine | Hardware-accelerated AES-128/256, SHA-1/256, RSA-2048, and TRNG with NIST-certified PRNG - achieves 200+ Mbps bulk encryption without CPU overhead. |
| Flexible Display Interface | Support for parallel RGB (24-bit, WUXGA), LVDS (dual-port), HDMI 1.4, and MIPI DSI (2-lane, 1 Gbps/lane) - allows single SoC to drive multiple display types in HMI or digital signage. |
Applications
| Industrial HMI Terminal | Machine Vision Edge Node |
|---|---|
Use Scenario: Touch-enabled operator interface in PLC-controlled packaging line with ambient temperature up to 70°C and EMI exposure. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based Qt UI, real-time motion control loop via GPIO/PWM, and secure OTA updates. Use Value: Dual Cortex-A9 cores isolate UI rendering (GPU3Dv4) from deterministic control tasks; industrial temp rating eliminates need for forced cooling; CAAM secures firmware signing keys. |
Use Scenario: Embedded vision system inspecting PCB solder joints using two synchronized CMOS sensors and local defect classification. IC Role / Device Role / Timing Role: Central vision processor running OpenCV on Arm cores while offloading image capture (MIPI CSI-2), preprocessing (IPUv3H), and inference (VPU-assisted tensor ops) to hardware accelerators. Use Value: Simultaneous 1080p30 capture from dual cameras + real-time deinterlacing/scaling enables sub-50 ms end-to-end latency; DDR3L bandwidth supports multi-frame buffer storage. |
| Secure Industrial Gateway | Ruggedized Digital Signage |
Use Scenario: Field-deployed gateway aggregating Modbus RTU, CAN bus, and Ethernet data for cloud upload with TLS 1.2 and signed firmware validation. IC Role / Device Role / Timing Role: Secure network hub implementing firewall, protocol translation, and encrypted tunneling using CAAM-accelerated crypto and dual FlexCAN for legacy fieldbus bridging. Use Value: Hardware-enforced TrustZone isolates secure boot and crypto operations from Linux OS; SNVS RTC maintains time sync during brownouts; eMMC boot ensures tamper-resistant firmware storage. |
Use Scenario: Outdoor kiosk displaying dynamic content across dual 1080p displays in varying ambient light, requiring brightness adaptation and anti-glare rendering. IC Role / Device Role / Timing Role: Multimedia engine driving HDMI and LVDS outputs concurrently while performing real-time gamma correction, color space conversion, and overlay composition via GPU2Dv2 and IPUv3H. Use Value: Independent display controllers enable asynchronous refresh rates; GPUVGv2 renders vector-based logos without pixelation; industrial temp range prevents thermal shutdown in direct sunlight. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Arm applications processors.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D6AVT10AD | Same dual-core Cortex-A9, 1.0 GHz, but automotive-grade (−40°C to +125°C) and includes MLB (Media Link Bus) support not present in MCIMX6D5EYM10ADR. | Targeted for automotive infotainment head units requiring AEC-Q100 qualification and high-temp reliability beyond industrial specs. | Select when AEC-Q100 compliance and MLB interface for audio/video bridging are required; otherwise, MCIMX6D5EYM10ADR offers lower cost and identical industrial feature set. |
| i.MX 8M Mini (NXP, MIMX8MM6CVTIZAB) | Quad-core Cortex-A53 + Cortex-M4, 1.8 GHz A53, integrated MIPI DSI/CSI, but lacks VPU and IPU; uses 14 nm process vs. 40 nm for MCIMX6D5EYM10ADR. | Better suited for AI inference at edge with NPU option, but requires software migration from i.MX 6 SDK and lacks hardware video encode capability. | Choose for new designs needing higher CPU throughput and future-proofing; retain MCIMX6D5EYM10ADR for legacy code reuse, proven VPU/ISP pipelines, and cost-sensitive industrial volume. |
Compared with MCIMX6D5EYM10ADR, MCIMX6D6AVT10AD adds automotive qualification and MLB but increases BOM cost and thermal design complexity, while i.MX 8M Mini trades mature video acceleration for newer CPU architecture and no hardware VPU-making MCIMX6D5EYM10ADR optimal for cost-constrained, video-centric industrial applications requiring long-term supply stability.
Availability
MCIMX6D5EYM10ADR is available at Aetrix Electronics and suitable for industrial HMI terminals, machine vision edge nodes, secure industrial gateways, and ruggedized digital signage requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D5EYM10ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of analog and embedded expertise.
The i.MX 6 series was designed specifically for high-reliability industrial and embedded applications demanding multimedia performance, real-time responsiveness, and long-term availability-MCIMX6D5EYM10ADR exemplifies this with its industrial temperature grade, hardware security, and comprehensive peripheral integration.
FAQ
What is the maximum operating frequency of the MCIMX6D5EYM10ADR under industrial temperature conditions?
The MCIMX6D5EYM10ADR is rated for 1.0 GHz operation across its full industrial junction temperature range of −40°C to +105°C when supplied with VDD_ARM = 1.25 V and VDD_SOC = 1.25 V. This frequency is validated with a 24 MHz input clock and meets all timing margins per IMX6DQIEC Rev. 6 electrical specifications. Performance remains stable without thermal throttling in convection-cooled enclosures.
Does the MCIMX6D5EYM10ADR support HDMI 2.0 or only HDMI 1.4?
The MCIMX6D5EYM10ADR supports HDMI 1.4 only, as confirmed in the i.MX 6Dual/6Quad Applications Processors for Industrial Products datasheet (IMX6DQIEC Rev. 6). Its HDMI TX module delivers up to 1080p60 resolution with deep color and 3D frame packing, but does not implement HDMI 2.0 features such as 4K@60Hz, HDR, or increased bandwidth. For 4K support, NXP's i.MX 8 series is required.
Can the MCIMX6D5EYM10ADR boot directly from eMMC, and what fuse settings are required?
Yes, the MCIMX6D5EYM10ADR supports eMMC boot via its uSDHC4 controller in HS200 mode. Boot mode is configured using BOOT_MODE[1:0] pins strapped to 0b10 (binary), and the eMMC boot partition must contain a valid HAB-signed boot image. No eFUSE programming is required for basic eMMC boot; however, CAAM key fuses should remain unblown until secure deployment to preserve debug access during development.
What is the role of the CAAM module in the MCIMX6D5EYM10ADR, and how much secure RAM does it provide?
The CAAM (Cryptographic Acceleration and Assurance Module) in the MCIMX6D5EYM10ADR provides hardware-accelerated AES, SHA, RSA, and RNG functions with NIST-certified PRNG. It includes 16 KB of dedicated secure RAM accessible only by CAAM and TrustZone-protected software, used for key storage, cryptographic context, and secure boot verification-enabling fast, tamper-resistant encryption without CPU intervention.
Is the MCIMX6D5EYM10ADR pin-compatible with other i.MX 6Dual variants like MCIMX6D6AVT10AD?
No, the MCIMX6D5EYM10ADR is not pin-compatible with MCIMX6D6AVT10AD. Although both use FCPBGA-624 packages, their ball maps differ significantly due to MLB interface inclusion in the automotive variant and distinct power domain routing. Pin assignments for VDD_ARM, VDD_SOC, and peripheral signals (e.g., MLB_CLK, MLB_DATA) are incompatible; PCB redesign is required for substitution.
MCIMX6D5EYM10ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D5EYM10ADR FAQ
1.How can I place an order for MCIMX6D5EYM10ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D5EYM10ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D5EYM10ADR reliable?
The price and inventory of MCIMX6D5EYM10ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D5EYM10ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6D5EYM10ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D5EYM10ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D5EYM10ADR?
MCIMX6D5EYM10ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D5EYM10ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D5EYM10ADR?
For technical support, including MCIMX6D5EYM10ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D5EYM10ADR requirements.
6.How does Aetrix verify that MCIMX6D5EYM10ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6D5EYM10ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D5EYM10ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6D5EYM10ADR?
All MCIMX6D5EYM10ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D5EYM10ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D5EYM10ADR part is unused and in its original packaging.
Return procedure for MCIMX6D5EYM10ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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