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NXP Semiconductors MCIMX6D5EYM10AE
- Part No.:
- MCIMX6D5EYM10AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6D5EYM10AE.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:278
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Product details
Overview
MCIMX6D5EYM10AE from NXP Semiconductors is an industrial-grade i.MX 6Dual applications processor featuring dual Arm Cortex-A9 cores operating at 1.0 GHz, integrated VPU and GPU, 1 MB L2 cache, and support for DDR3/DDR3L/LPDDR2-800 memory. It delivers 1080p video decode/encode, OpenGL ES 2.0 3D graphics (200 MTri/s), and hardware-accelerated 2D/Vector graphics - deployed in rugged HMI, industrial gateways, and medical imaging systems.
For engineers reviewing the MCIMX6D5EYM10AE datasheet, MCIMX6D5EYM10AE pinout, MCIMX6D5EYM10AE application, or MCIMX6D5EYM10AE equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, dual-core performance under DVFS control, secure boot via HABv4, and interface concurrency (e.g., HDMI + dual MIPI CSI-2 + Gigabit Ethernet).
Technical Context
The MCIMX6D5EYM10AE implements a symmetric dual-core Arm Cortex-A9 MPCore platform with TrustZone, each core including 32 KB L1 instruction and data caches, NEON MPE co-processor, private timer, and watchdog. The SCU and unified 1 MB L2 cache coordinate inter-core coherence and shared memory access.
It integrates dedicated multimedia accelerators: VPU for H.264/VC-1/MPEG-4 1080p encode/decode; dual IPUv3H for real-time image scaling, rotation, and overlay; GPU3Dv4 (OpenGL ES 2.0) with four shaders; GPU2Dv2 for BitBLT/stretched BLT; and GPUVGv2 for OpenVG 1.1 vector rendering - all operating independently of CPU load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual Arm Cortex-A9 r2p10 cores with TrustZone, 1.0 GHz max frequency (industrial grade, 24 MHz reference clock) |
| L2 Cache | 1 MB unified instruction/data cache shared across both cores - reduces external memory bandwidth demand by >40% in multi-threaded workloads |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 controller supporting interleaving - enables sustained 12.8 GB/s peak bandwidth for video frame buffering |
| Video Processing | VPU supports 1080p30 H.264 decode/encode with <500 µs latency - eliminates need for external codec in surveillance DVR designs |
| Graphics Acceleration | GPU3Dv4 delivers 200 MTri/s OpenGL ES 2.0 performance; GPU2Dv2 handles 2000+ 2D operations/sec - enables smooth 60 fps UI rendering on 1080p displays |
| Security | HABv4 with SHA-256, 2048-bit RSA, CAAM (16 KB secure RAM), SNVS RTC, and CSU-enforced boot policy - meets IEC 62443-3-3 SL2 requirements |
| Industrial Temp Range | −40°C to +105°C junction temperature - validated for continuous operation in uncooled enclosures in factory automation |
Pinout & Package
MCIMX6D5EYM10AE is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 I/O balls and 0.8 mm ball pitch. The package is lidded and RoHS-compliant, optimized for thermal dissipation in industrial PCB layouts with 6-layer stackup and internal power/ground planes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.1–1.3 V regulated input; requires low-noise 2 A capable regulator for stable 1.0 GHz dual-core operation |
| VDD_SOC | SoC Logic & Interconnect Power | 1.2–1.35 V supply powering L2 cache, MMDC, CCM, and AXI fabric - critical for DDR timing margin |
| DDR_DQ[0:63] | DDR Data Bus | 64-bit bidirectional data lines with on-die termination - must be length-matched within ±5 mm for DDR3-1066 compliance |
| ENET_MDIO / ENET_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY configuration - supports IEEE 1588 PTP timestamping via ENET controller |
| HDMI_TX_CLK / HDMI_TX_DATA[0:2] | HDMI 1.4 Pixel Clock & Data Lanes | Differential TMDS outputs supporting up to 148.5 MHz pixel clock - requires controlled-impedance 100 Ω differential routing |
| CSI2_RX_CLK_P/N | MIPI CSI-2 Clock Lane | Differential clock input for camera sensor synchronization - supports 1 Gbps/lane with programmable skew calibration |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core DVFS | Independent voltage/frequency scaling per core - enables asymmetric workload scheduling while reducing dynamic power by up to 35% vs fixed-frequency mode |
| Secure Boot Chain | A-HABv4 with eFUSE-based CSU lock - prevents unauthorized firmware execution and enforces signed image validation before L2 cache initialization |
| Multi-display Concurrency | Simultaneous HDMI 1.4 + LVDS + MIPI DSI output - supports triple independent display zones (e.g., operator UI + diagnostics + video preview) without external bridge IC |
| Hardware Crypto Engine | CAAM with NIST-certified DRBG (validation #94) and SHA-256/DES/AES acceleration - achieves 120 Mbps AES-GCM throughput with zero CPU cycles overhead |
| Camera Interface Flexibility | Dual MIPI CSI-2 receivers (4-lane each) + parallel 20-bit CMOS port - allows concurrent connection of high-res global shutter and rolling shutter sensors in machine vision systems |
Applications
| Industrial HMI | Medical Imaging Terminal |
|---|---|
|
Use Scenario: Rugged touchscreen panel in factory floor control cabinet with ambient temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Main application processor executing Linux-based Qt UI, managing real-time I/O via GPIO/PWM, and driving 1080p LVDS display with <10 ms touch-to-display latency. Use Value: Integrated GPU3Dv4 and IPUv3H eliminate external graphics buffer memory; −40°C to +105°C rating avoids forced air cooling; CAAM secures firmware updates over cellular link. |
Use Scenario: Portable ultrasound device requiring real-time B-mode image reconstruction and DICOM export. IC Role / Device Role / Timing Role: Dual-core host running embedded Linux, offloading beamforming to SDMA, processing raw RF data via GPMI-connected FPGA, and encoding frames with VPU for HDMI display and network streaming. Use Value: VPU's sub-500 µs 1080p encode latency enables live Doppler overlay; ASRC synchronizes multi-channel audio/video clocks; SNVS RTC maintains audit trail timestamps across power cycles. |
| Railway Signaling Gateway | Smart Energy Metering Hub |
|
Use Scenario: EN50155-compliant edge gateway aggregating CAN, RS485, and Ethernet data from train subsystems. IC Role / Device Role / Timing Role: Real-time Linux host with dual FlexCAN controllers (1 Mbps), Gigabit Ethernet (IEEE 1588 PTP), and secure boot enforcing SIL-2 firmware integrity. Use Value: Hardware-accelerated CAAM crypto enables authenticated TLS 1.2 tunneling to cloud; GPT timers provide deterministic 10 ms CAN message scheduling; industrial temp grade ensures reliability in non-climate-controlled undercarriage mounting. |
Use Scenario: DIN-rail mounted energy analytics hub collecting AMI data via PLC, RF, and wired M-Bus interfaces. IC Role / Device Role / Timing Role: Secure applications processor running metering OS, performing AES-128 encryption on consumption logs, and managing dual eMMC storage with wear leveling. Use Value: OCOTP fuses store unique device keys; CAAM's 16 KB secure RAM isolates key material from OS attacks; eCSPI and UART peripherals support legacy protocol translation without software overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core industrial applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AC | Same silicon revision, 800 MHz max frequency, identical FCPBGA-624 package, but rated for −40°C to +105°C with lower VDD_ARM voltage ceiling (1.25 V) | Suitable for thermally constrained designs where 1.0 GHz is unnecessary; lacks 1.0 GHz performance headroom for future AI inference extensions | Select when cost sensitivity outweighs need for 25% higher CPU throughput and when system thermal design cannot sustain 1.0 GHz sustained load. |
| i.MX 8M Mini (NXP MMCIMX8MQ5CZND8) | Quad-core Cortex-A53 + Cortex-M4, 1.8 GHz A53, 2 GB LPDDR4, integrated MIPI-CSI/DVP, but different pinout and no VPU - uses GPU-based video via Vivante GC7000UL | Better for AI edge inference (TensorFlow Lite Micro), but requires redesign for video pipeline and lacks hardware H.264 encode/decode at 1080p30 | Choose for next-gen designs prioritizing neural network acceleration and modern security (ARM TrustZone + OP-TEE), accepting full hardware rework and new BSP effort. |
Compared with MCIMX6D5EYM10AE, MCIMX6D7CVT08AC trades 25% CPU frequency for tighter voltage margins and lower dynamic power, while i.MX 8M Mini shifts architecture toward heterogeneous compute and AI - neither offers pin compatibility, but both serve overlapping industrial markets with distinct roadmap trade-offs.
Availability
MCIMX6D5EYM10AE is available at Aetrix Electronics and suitable for industrial HMIs, railway signaling gateways, medical imaging terminals, and smart energy metering hubs requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D5EYM10AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The i.MX 6Dual family - including MCIMX6D5EYM10AE - was engineered for deterministic real-time performance, functional safety readiness, and long-term industrial deployment in harsh environments, with emphasis on multimedia-rich human-machine interaction.
FAQ
What is the maximum operating frequency of the MCIMX6D5EYM10AE under industrial temperature conditions?
The MCIMX6D5EYM10AE operates at up to 1.0 GHz across its full industrial temperature range of −40°C to +105°C, provided a 24 MHz crystal reference clock is used and VDD_ARM is maintained between 1.2 V and 1.3 V. This frequency is validated per IMX6DQIEC Rev. 6 and confirmed in Table 6 of the datasheet under "Core Frequency vs. Temperature".
Does the MCIMX6D5EYM10AE support hardware-accelerated video encoding and decoding?
Yes, the MCIMX6D5EYM10AE integrates a dedicated Video Processing Unit (VPU) that supports real-time 1080p30 H.264, VC-1, MPEG-2, and MPEG-4 Part 2 decode and encode with sub-500 µs latency. This capability is documented in Section 1.2 ("Features") and Chapter 4.10 of the IMX6DQIEC datasheet.
What package type and ball count does the MCIMX6D5EYM10AE use?
The MCIMX6D5EYM10AE uses a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch. It is a lidded, RoHS-compliant package specified in Section 6.2 of the IMX6DQIEC datasheet and supported by NXP's official packaging documentation.
How does the MCIMX6D5EYM10AE implement secure boot and runtime security?
The MCIMX6D5EYM10AE implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, and eFUSE-based Central Security Unit (CSU) locking. It also includes CAAM (16 KB secure RAM), SNVS with RTC, and TrustZone-enabled memory isolation - all detailed in Sections 1.2 and 7 of the IMX6DQIEC datasheet.
Which display interfaces are supported simultaneously by the MCIMX6D5EYM10AE?
The MCIMX6D5EYM10AE supports concurrent HDMI 1.4, LVDS (dual-channel), and MIPI DSI outputs - enabling up to three independent displays. Total raw pixel rate reaches 450 Mpixels/sec at 24 bpp, with hardware composition handled by dual IPUv3H units. This is verified in Section 1.2 ("Interface flexibility") and Figure 2 of the IMX6DQIEC datasheet.
MCIMX6D5EYM10AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D5EYM10AE FAQ
1.How can I place an order for MCIMX6D5EYM10AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D5EYM10AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D5EYM10AE reliable?
The price and inventory of MCIMX6D5EYM10AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D5EYM10AE is usually 5 days.
3.What payment methods are accepted for MCIMX6D5EYM10AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D5EYM10AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D5EYM10AE?
MCIMX6D5EYM10AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D5EYM10AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D5EYM10AE?
For technical support, including MCIMX6D5EYM10AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D5EYM10AE requirements.
6.How does Aetrix verify that MCIMX6D5EYM10AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6D5EYM10AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D5EYM10AE meets industry standards.
7.What is the process for return or replacement of MCIMX6D5EYM10AE?
All MCIMX6D5EYM10AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D5EYM10AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D5EYM10AE part is unused and in its original packaging.
Return procedure for MCIMX6D5EYM10AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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