My Inquiry
My Account
NXP Semiconductors MCIMX6D5EZK08AE
- Part No.:
- MCIMX6D5EZK08AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 569-LFBGA
- Datasheet:
-
MCIMX6D5EZK08AE.pdf
- Description:
- IC MPU I.MX6D 800MHZ 569MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,017
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6D5EZK08AE from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 800 MHz, integrating VPU, GPU2D/GPU3D, IPUv3H, and CAAM security module. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface, HDMI 1.4, MIPI CSI-2/DSI, dual CAN, Gigabit Ethernet (IEEE 1588), and four uSDHC ports - deployed in rugged HMI, medical imaging terminals, and industrial gateways.
For engineers reviewing the MCIMX6D5EZK08AE datasheet, MCIMX6D5EZK08AE pinout, MCIMX6D5EZK08AE application, or MCIMX6D5EZK08AE equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, dual-core A9 + NEON MPE co-processor, hardware-accelerated 1080p video decode/encode, and TrustZone-enabled secure boot with HABv4 and CAAM.
Technical Context
The MCIMX6D5EZK08AE implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and Global Timer. It integrates dedicated multimedia accelerators including VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP), dual IPUv3H for parallel image processing, and GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s) with OpenCL support.
Power management includes integrated LDOs, DVFS, software state retention, power gating, and thermal monitoring via on-die sensor. Security architecture comprises Arm TrustZone, CAAM (16 KB secure RAM, NIST-certified DRBG), SNVS with SRTC, CSU, and A-HABv4 enabling SHA-256, 2048-bit RSA, version-controlled secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 800 MHz - enables real-time multitasking with NEON MPE for media compute offload |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports up to 4 GB external RAM with interleaving for sustained bandwidth >5.3 GB/s |
| Video Acceleration | VPU with 1080p60 decode/encode - reduces CPU load by >70% during concurrent video playback and recording |
| Graphics Engine | GPU3Dv4 + GPU2Dv2 + GPUVGv2 - delivers OpenGL ES 2.0 rendering at HD1080 resolution with hardware BitBLT and vector tesselation |
| Security Features | CAAM, TrustZone, A-HABv4, SNVS - enables certified secure boot, encrypted firmware updates, and runtime cryptographic acceleration |
| Industrial Temp Range | −40°C to +105°C junction - qualified for continuous operation in uncooled enclosures in factory automation and outdoor kiosks |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch - compatible with standard PCB assembly processes and supports high I/O count (488 signal balls) |
Pinout & Package
MCIMX6D5EZK08AE is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch. The package is lidded and RoHS-compliant, designed for thermal reliability in industrial environments. Pin assignments follow the standardized i.MX 6 series ball map per IMX6DQIEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M | Primary crystal oscillator input | Mandatory 24 MHz reference clock for USB PHY and system timing; failure disables OTG and host USB operation |
| VDD_ARM | Core voltage supply (ARM domain) | 1.2 V ±3% regulated input powering Cortex-A9 cores and L1/L2 caches; requires low-noise decoupling |
| VDD_SOC | SoC logic voltage supply | 1.2 V ±3% supply for MMDC, CCM, GPC, and interconnect fabric; shares regulator with VDD_ARM in many designs |
| BOOT_MODE[1:0] | Boot configuration strapping pins | Pulled high/low at reset to select boot device (eMMC, NAND, SPI NOR, SD); determines initial execution path and HAB policy |
| ENET_RXD[3:0] | Gigabit Ethernet receive data bus | 4-bit LVDS-capable interface tied to external PHY; supports IEEE 1588 timestamping for deterministic networking |
| CSI_DATA[7:0] | Parallel camera sensor data bus | 8-bit CMOS camera interface supporting up to 240 MHz pixel clock; used for legacy sensors without MIPI support |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and clock gating across all domains reduce active power by up to 40% vs. fixed-frequency operation |
| Multi-Mode DDR Controller (MMDC) | Supports DDR3, DDR3L, LPDDR2 with on-the-fly mode switching - enables hybrid memory configurations for cost/performance optimization |
| Secure Non-Volatile Storage (SNVS) | Includes tamper-resistant SRTC and 2 KB OTP eFUSE space - stores cryptographic keys, boot policy, and device identity permanently |
| Asynchronous Sample Rate Converter (ASRC) | Handles 10 concurrent audio channels with −120 dB THD+N - eliminates sample rate mismatch artifacts in multi-source audio systems |
| Enhanced Serial Audio Interface (ESAI) | Supports 260 kHz stereo I2S and 7.1-channel TDM - enables professional-grade audio I/O for medical ultrasound and broadcast equipment |
Applications
| Industrial HMI Terminal | Medical Imaging Workstation |
|---|---|
|
Use Scenario: Rugged touchscreen panel in factory control room with ambient temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI stack, driving dual LVDS displays and capturing operator inputs via GPIO/KPP. Use Value: Dual Cortex-A9 + GPU2Dv2 enables smooth 60 Hz UI rendering while VPU offloads video diagnostics overlay; industrial temp grade ensures uptime at 105°C junction. |
Use Scenario: Portable ultrasound device requiring real-time B-mode image reconstruction and HDMI output to external monitor. IC Role / Device Role / Timing Role: Central SoC handling sensor data ingestion (CSI-2), beamforming acceleration (SDMA), image processing (IPUv3H), and display output (HDMI Tx). Use Value: Hardware ASRC synchronizes Doppler audio with RF data streams; CAAM encrypts patient DICOM files before storage on eMMC. |
| Smart Energy Gateway | Railway Signaling Controller |
|
Use Scenario: DIN-rail mounted gateway aggregating Modbus, CAN, and M-Bus data from smart meters and feeding cloud via LTE/Wi-Fi. IC Role / Device Role / Timing Role: Network edge processor running real-time OS, managing four uSDHC ports for local logging, dual FlexCAN for fieldbus bridging, and ENET for backhaul. Use Value: IEEE 1588 support enables sub-microsecond time synchronization across distributed grid sensors; SNVS secures firmware OTA updates. |
Use Scenario: EN5012x-certified signaling unit controlling trackside signals and point machines in harsh rail environments. IC Role / Device Role / Timing Role: Safety-critical controller executing SIL-2 software partitioned across Cortex-A9 cores with watchdog supervision and hardware memory protection (TrustZone). Use Value: Dual WDOG timers and hardware ECC on OCRAM/DDR ensure fail-safe state recovery; industrial temp rating validates operation inside sun-exposed cabinets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D6AVT08AC | Same dual-core A9 @ 800 MHz, but automotive-grade (−40°C to +125°C) and includes MLB (Media Link Bus) interface | Targeted for infotainment head units requiring AEC-Q100 qualification and high-bandwidth camera links | Select when automotive qualification, MLB, or extended junction temperature beyond +105°C is required |
| i.MX8M Mini (NXP MIMX8MM6CVTKZAA) | Quad-core Cortex-A53 @ 1.8 GHz, 2× Cortex-M4F, updated GPU (Vivante GC7000Lite), 4K60 video decode | Designed for next-gen UI-rich devices needing higher CPU throughput, AI inference acceleration, and longer product lifecycle | Choose for new designs prioritizing performance headroom, Android/Linux long-term support, and future-proof multimedia capability |
Compared with MCIMX6D5EZK08AE, MCIMX6D6AVT08AC offers higher thermal margin and automotive interfaces but lacks industrial-specific validation documentation; i.MX8M Mini delivers significantly higher compute density and modern security features but requires board redesign due to different package (14 x 14 mm, 0.5 mm pitch) and power architecture.
Availability
MCIMX6D5EZK08AE is available at Aetrix Electronics and suitable for industrial HMI, medical imaging terminals, smart energy gateways, and railway signaling controllers requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D5EZK08AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6Dual family - including MCIMX6D5EZK08AE - was engineered for deterministic real-time performance, hardware-accelerated multimedia, and robust security in mission-critical industrial applications.
FAQ
What is the maximum supported DDR3 speed for MCIMX6D5EZK08AE?
The MCIMX6D5EZK08AE supports DDR3-1066 (533 MHz) operation with 64-bit bus width. This enables theoretical peak bandwidth of 8.5 GB/s, validated under industrial temperature conditions (−40°C to +105°C) per IMX6DQIEC Rev. 6 electrical specifications. System-level timing must comply with MMDC setup/hold requirements and board-level signal integrity constraints.
Does MCIMX6D5EZK08AE support secure boot with cryptographic verification?
Yes, MCIMX6D5EZK08AE implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, and version control. Boot ROM enforces chain-of-trust starting from signed bootloader images stored in eMMC or NAND, using CAAM for crypto operations and SNVS for key storage - all documented in the i.MX 6Dual Security Reference Manual (IMX6DQ6SDLSRM).
Can MCIMX6D5EZK08AE drive two independent HDMI displays simultaneously?
No, MCIMX6D5EZK08AE integrates a single HDMI 1.4 transmitter block. It supports one HDMI output at up to 1080p60, alongside other display interfaces such as parallel RGB, LVDS (dual-channel), or MIPI DSI. Simultaneous multi-display output requires combining HDMI with a second interface (e.g., HDMI + LVDS), not dual HDMI ports.
What is the function of the BOOT_MODE pins on MCIMX6D5EZK08AE?
The BOOT_MODE[1:0] pins on MCIMX6D5EZK08AE are strapping inputs sampled at reset to determine the primary boot device and configuration. Valid combinations include booting from eMMC (BOOT_MODE = 0b10), NAND Flash (0b01), SPI NOR (0b00), or SD card (0b11). These settings directly control HAB policy, fuse programming access, and initial memory map initialization.
Is MCIMX6D5EZK08AE pin-compatible with other i.MX 6Dual variants like MCIMX6D7CVT08AC?
Yes, MCIMX6D5EZK08AE is pin-compatible with MCIMX6D7CVT08AC and other FCPBGA-624 i.MX 6Dual variants (e.g., MCIMX6D6AVT08AC), sharing identical ball map, power sequencing, and signal definitions per IMX6DQIEC Rev. 6. Differences lie in silicon revision, fusing options, and temperature grading - not physical layout or electrical interface.
MCIMX6D5EZK08AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 569-LFBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 569-MAPBGA (12x12)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D5EZK08AE FAQ
1.How can I place an order for MCIMX6D5EZK08AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D5EZK08AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D5EZK08AE reliable?
The price and inventory of MCIMX6D5EZK08AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D5EZK08AE is usually 5 days.
3.What payment methods are accepted for MCIMX6D5EZK08AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D5EZK08AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D5EZK08AE?
MCIMX6D5EZK08AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D5EZK08AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D5EZK08AE?
For technical support, including MCIMX6D5EZK08AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D5EZK08AE requirements.
6.How does Aetrix verify that MCIMX6D5EZK08AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6D5EZK08AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D5EZK08AE meets industry standards.
7.What is the process for return or replacement of MCIMX6D5EZK08AE?
All MCIMX6D5EZK08AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D5EZK08AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D5EZK08AE part is unused and in its original packaging.
Return procedure for MCIMX6D5EZK08AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6D5EZK08AE Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
