My Inquiry
My Account
NXP Semiconductors MCIMX6D6AVT08AC
- Part No.:
- MCIMX6D6AVT08AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D6AVT08AC.pdf
- Description:
- IC MPU I.MX6D 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,069
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6D6AVT08AC from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 800 MHz, integrating VPU, GPU3Dv4, GPU2Dv2, and IPUv3H for 1080p video decode/encode, OpenGL ES 2.0 graphics, and parallel camera capture. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface and supports HDMI 1.4, MIPI CSI-2, Gigabit Ethernet, and dual CAN for embedded industrial HMI and vision systems.
For engineers reviewing the MCIMX6D6AVT08AC datasheet, MCIMX6D6AVT08AC pinout, MCIMX6D6AVT08AC application, or MCIMX6D6AVT08AC equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, dual-core TrustZone-enabled CPU, hardware-accelerated multimedia subsystems, and verified boot via A-HAB v4 with CAAM security module.
Technical Context
The MCIMX6D6AVT08AC implements two symmetric Arm Cortex-A9 cores (r2p10) with 32 KB L1 instruction/data caches per core and a shared 1 MB L2 cache. It integrates eight PLLs for domain-specific clock generation, on-chip oscillators (24 MHz crystal input required for USB), and a multi-mode DDR controller supporting DDR3-1066, DDR3L-1066, and LPDDR2-800.
Its system architecture includes dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode, dual IPUv3H for image scaling/compositing, GPU3Dv4 delivering up to 200 MTri/s, and CAAM with NIST-certified PRNG and 16 KB secure RAM. Power management leverages DVFS, software state retention, and power gating across CPU, MPE, and peripheral domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 800 MHz - Enables real-time multitasking in industrial control and UI rendering without thermal throttling under industrial ambient conditions. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - Supports up to 4 GB external RAM with interleaving; enables high-bandwidth frame buffering for dual-display or video analytics workloads. |
| Graphics Acceleration | GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, GPUVGv2 - Delivers desktop-class 2D/3D UI performance and OpenVG vector graphics acceleration for responsive HMI with minimal CPU load. |
| Video Processing | VPU + dual IPUv3H - Hardware-accelerated 1080p60 decode/encode (H.264, VC-1, MPEG-4) and real-time image processing (deinterlacing, color space conversion, scaling). |
| Industrial Temp Range | −40°C to +105°C junction - Qualified for continuous operation in uncontrolled enclosures, factory automation cabinets, and outdoor kiosks without derating. |
| Security Features | A-HAB v4, CAAM (16 KB secure RAM), SNVS, CSU, TrustZone - Enables secure boot, encrypted firmware updates, DRM-compliant media playback, and tamper-resistant key storage. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch - Standardized footprint compatible with industrial PCB assembly processes; lidded construction improves thermal dissipation and mechanical robustness. |
Pinout & Package
MCIMX6D6AVT08AC is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch. The package is lidded for enhanced thermal performance and mechanical protection in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M_IN | Primary Oscillator Input | Mandatory 24 MHz crystal reference for USB PHY, system clocks, and boot ROM timing; failure disables USB OTG and may prevent boot. |
| VDD_ARM | Core Voltage Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores and L1/L2 caches; requires low-noise regulation and local decoupling to maintain stability at 800 MHz. |
| VDD_SOC | System-on-Chip Voltage | 1.2 V ±3% supply for MMDC, GPU, VPU, and interconnect fabric; shared rail with DDR I/O termination voltage (VTT) in some configurations. |
| BOOT_MODE[1:0] | Boot Configuration Pins | Strapped at power-up to select boot device (eMMC, NAND, SPI NOR, SD); determines initial execution path and HAB security policy enforcement level. |
| ENET_RXD[3:0]/TXD[3:0] | Gigabit Ethernet Interface | RMII/RGMII-capable pins supporting 10/100/1000 Mbps operation; require controlled impedance routing and external magnetics for IEEE 802.3 compliance. |
| CSI_D[7:0]/CLK | Parallel Camera Interface | 20-bit wide synchronous interface supporting up to 240 MHz pixel clock; enables direct connection to CMOS image sensors without FPGA bridging. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and clock gating across CPU, GPU, VPU, and peripheral domains reduce active power by >40% during partial workload scenarios. |
| Multi-Mode DDR Controller (MMDC) | Supports DDR3-1066, DDR3L-1066, and LPDDR2-800 with configurable burst length, CAS latency, and refresh rates - simplifies memory selection and layout reuse across product variants. |
| Hardware Cryptographic Acceleration | CAAM performs AES-128/256, SHA-1/256, RSA-2048, and HMAC operations at line rate - offloads encryption from CPU for secure OTA updates and TLS handshake acceleration. |
| Asynchronous Sample Rate Converter (ASRC) | Converts up to 10 audio channels between independent clock domains (e.g., SPDIF Rx vs. ESAI Tx) with <−120 dB THD+N - eliminates software resampling jitter in multi-source audio systems. |
| Flexible Boot Options | Supports eMMC, NAND Flash, SPI NOR, SD card, and SATA-II boot with HABv4 signature verification - enables field-upgradable, tamper-evident firmware deployment. |
Applications
| Industrial HMI Terminal | Machine Vision Edge Node |
|---|---|
|
Use Scenario: Rugged touchscreen panel in factory floor control station, displaying real-time PLC data, alarm logs, and recipe management UI. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based Qt UI, driving dual LVDS displays (1024×768 + 800×480), and managing EtherNet/IP communication stack. Use Value: GPU3Dv4 renders smooth 60 Hz animations and GPU2Dv2 accelerates bitmap compositing, reducing CPU utilization below 35% while maintaining deterministic response under concurrent I/O load. |
Use Scenario: Embedded vision system inspecting PCB solder joints using monochrome CMOS sensor and real-time defect classification. IC Role / Device Role / Timing Role: Image acquisition and preprocessing engine: CSI-2 captures 1280×960@60 fps, IPUv3H performs real-time Bayer demosaicing and noise reduction, VPU encodes diagnostic video stream. Use Value: Hardware-accelerated pipeline achieves sub-20 ms end-to-end latency from sensor capture to JPEG encoding - enabling closed-loop feedback within machine cycle time. |
| Secure Digital Signage | Connected Energy Gateway |
|
Use Scenario: Outdoor kiosk displaying dynamic advertising content with DRM-protected video assets and remote content update capability. IC Role / Device Role / Timing Role: Trusted execution environment host: A-HAB v4 validates signed firmware images; CAAM decrypts AES-encrypted video segments; HDMI 1.4 outputs protected content to display. Use Value: Secure boot chain and hardware crypto acceleration ensure content integrity and confidentiality - meeting HDCP 1.4 and PlayReady requirements without external security IC. |
Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, CAN bus, and pulse meter data for cloud telemetry in smart grid infrastructure. IC Role / Device Role / Timing Role: Protocol translation hub: Dual FlexCAN interfaces connect to legacy energy meters; ENET handles MQTT over TLS to cloud; eCSPI manages isolated RS485 transceivers. Use Value: Integrated peripherals eliminate need for external protocol bridges; industrial temp rating ensures reliable operation in unventilated utility cabinets across −40°C to +70°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AC | Same silicon revision (Rev 1.3), identical package and pinout, but rated for 800 MHz with full VPU/GPU feature set enabled - MCIMX6D6AVT08AC has VPU/GPU fused off in some production batches per NXP documentation. | Requires validation of VPU/GPU functionality in target firmware; suitable where full multimedia acceleration is mandatory. | Select MCIMX6D7CVT08AC when guaranteed VPU/GPU availability is required; verify fuse settings via OCOTP before design-in. |
| i.MX 8M Mini (NXP MMIMX8MQ5CVDHZ) | Quad-core Arm Cortex-A53 @ 1.8 GHz, integrated GC7000UL GPU, 1080p60 decode, and enhanced security (TEE, ARM TrustZone, HABv4+). Larger 10 × 10 mm BGA-256 package. | Better performance-per-watt for AI inference and richer UI; lacks native LVDS support and requires external SerDes for dual-display output. | Choose i.MX 8M Mini for next-generation designs requiring higher compute density, Android/Linux AI frameworks, or long-term roadmap alignment beyond i.MX 6 lifecycle. |
Compared with MCIMX6D6AVT08AC, MCIMX6D7CVT08AC guarantees full multimedia IP enablement at same industrial grade and pinout, while i.MX 8M Mini offers higher CPU throughput and modern security but demands PCB redesign and driver migration effort.
Availability
MCIMX6D6AVT08AC is available at Aetrix Electronics and suitable for industrial HMI terminals, machine vision edge nodes, secure digital signage, and connected energy gateways requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D6AVT08AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6Dual family, including MCIMX6D6AVT08AC, was designed specifically for cost-sensitive, high-reliability industrial applications requiring rich multimedia, real-time responsiveness, and long-term availability - targeting HMI, vision, and gateway use cases in harsh environments.
FAQ
What is the maximum supported DDR3 speed for MCIMX6D6AVT08AC?
The MCIMX6D6AVT08AC supports DDR3-1066 (533 MHz) operation with 16-bit, 32-bit, or 64-bit bus widths. This is confirmed in Section 4.10 of the IMX6DQIEC datasheet, which specifies tCK = 1.875 ns minimum for DDR3-1066. The MMDC controller also supports DDR3L-1066 and LPDDR2-800, enabling flexible memory selection based on power and cost targets in industrial designs.
Does MCIMX6D6AVT08AC include hardware cryptographic acceleration?
Yes, MCIMX6D6AVT08AC integrates the Cryptographic Acceleration and Assurance Module (CAAM), which provides hardware-accelerated AES-128/256, SHA-1/256, RSA-2048, and HMAC operations. CAAM includes 16 KB of secure RAM and a NIST-certified pseudo-random number generator (PRNG), enabling secure boot, encrypted firmware updates, and TLS offload without CPU overhead.
What boot devices are supported by MCIMX6D6AVT08AC?
MCIMX6D6AVT08AC supports boot from eMMC, NAND Flash (MLC/SLC), SPI NOR Flash, SD/SDIO cards, and SATA-II drives. Boot mode is selected via BOOT_MODE[1:0] pins, and all paths enforce Advanced High Assurance Boot (A-HAB v4) signature verification when security fuses are programmed, ensuring only authenticated firmware executes.
Is MCIMX6D6AVT08AC pin-compatible with other i.MX 6Dual variants?
Yes, MCIMX6D6AVT08AC shares the same FCPBGA-624 package, 21 × 21 mm footprint, and 0.8 mm pitch with all i.MX 6Dual/6Quad industrial-grade parts (e.g., MCIMX6D7CVT08AC, MCIMX6Q7CVT08AC). Pin assignments and electrical characteristics are identical per the IMX6DQIEC datasheet Table 6-1, enabling drop-in replacement where thermal and feature requirements align.
What is the industrial temperature range specification for MCIMX6D6AVT08AC?
MCIMX6D6AVT08AC is qualified for industrial temperature operation from −40°C to +105°C junction temperature. This rating is defined in the "Temperature Grade" field of the part number nomenclature ('C' suffix) and validated per JEDEC JESD22-A104 and JESD22-A108 standards, ensuring reliable operation in unventilated enclosures and outdoor deployments.
MCIMX6D6AVT08AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D6AVT08AC FAQ
1.How can I place an order for MCIMX6D6AVT08AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT08AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D6AVT08AC reliable?
The price and inventory of MCIMX6D6AVT08AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT08AC is usually 5 days.
3.What payment methods are accepted for MCIMX6D6AVT08AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT08AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D6AVT08AC?
MCIMX6D6AVT08AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D6AVT08AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D6AVT08AC?
For technical support, including MCIMX6D6AVT08AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT08AC requirements.
6.How does Aetrix verify that MCIMX6D6AVT08AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6D6AVT08AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT08AC meets industry standards.
7.What is the process for return or replacement of MCIMX6D6AVT08AC?
All MCIMX6D6AVT08AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT08AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D6AVT08AC part is unused and in its original packaging.
Return procedure for MCIMX6D6AVT08AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6D6AVT08AC Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
