NXP Semiconductors MCIMX6D6AVT08ADR
- Part No.:
- MCIMX6D6AVT08ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D6AVT08ADR.pdf
- Description:
- IC MPU I.MX6D 852MHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6D6AVT08ADR from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 800 MHz, integrating VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode and parallel image processing. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface, Gigabit Ethernet controller (IEEE 1588 compliant), and dual FlexCAN interfaces - deployed in rugged HMI, industrial gateways, and medical imaging edge devices.
For engineers reviewing the MCIMX6D6AVT08ADR datasheet, MCIMX6D6AVT08ADR pinout, MCIMX6D6AVT08ADR application, or MCIMX6D6AVT08ADR equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, dual-core DVFS support, hardware-accelerated multimedia subsystems, and secure boot via A-HAB v4 with SHA-256 and 2048-bit RSA.
Technical Context
The MCIMX6D6AVT08ADR implements two symmetric Arm Cortex-A9 cores (r2p10), each with 32 KB L1 instruction and data caches, backed by a shared 1 MB unified L2 cache. Its memory subsystem supports interleaved dual-channel LPDDR2-800 and DDR3-1066 with on-die termination and dynamic calibration.
Hardware acceleration is distributed across dedicated units: VPU handles H.264/H.263/MPEG-4 decode up to 1080p30, IPUv3H performs real-time deinterlacing and color-space conversion, while GPU3Dv4 delivers up to 200 MTri/s with OpenCL support and GPU2Dv2 accelerates BitBlt and stretch operations - all coordinated via Smart DMA (SDMA) with 32 channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 800 MHz - enables concurrent real-time control and UI rendering without OS scheduling bottlenecks. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports ≥2 GB system RAM with ECC-capable external DRAM for industrial reliability. |
| Graphics Units | GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, GPUVGv2 - enables smooth 1080p GUI with hardware compositing and vector graphics acceleration. |
| Video Processing | VPU + dual IPUv3H - decodes H.264 BP/MP/HP up to 1080p30 and performs simultaneous image scaling, rotation, and overlay blending. |
| Security | A-HAB v4, CAAM (16 KB secure RAM), SNVS, TrustZone - enforces secure boot, encrypted firmware updates, and runtime cryptographic offload. |
| Industrial Temp Range | −40°C to +105°C junction - validated for continuous operation in uncooled enclosures and outdoor automation environments. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch - compatible with standard PCB assembly processes and thermal vias for high-power dissipation. |
Pinout & Package
MCIMX6D6AVT08ADR is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch. The package includes integrated heat spreader (lidded) and supports JEDEC-standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise, high-PSRR regulator with ≤10 mV ripple. |
| VDD_SOC | SoC logic voltage | 1.35 V ±3% supply for L2 cache, MMDC, and interconnect fabric - critical for DDR timing stability. |
| DDR_DQ[0:63] | DDR data bus | 64-bit bidirectional data lines - routed as length-matched differential pairs with controlled impedance (40 Ω ±10%). |
| ENET_MDIO / ENET_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC pair - used for PHY configuration and link status monitoring in industrial Ethernet stacks. |
| FLEXCAN1_TX / FLEXCAN1_RX | CAN 2.0B physical layer | Differential signaling pair supporting 1 Mbps baud rate - directly connects to ISO 11898-2 transceiver without level-shifting. |
| BOOT_MODE[0:1] | Boot configuration inputs | Pull-up/pull-down selectable at power-on - determines boot source (eMMC, NAND, SPI NOR, or SD card) before ROM execution. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage/frequency scaling (DVFS) per core domain - reduces active power by >40% during partial-load HMI rendering. |
| Multi-Standard Video Decode | H.264, MPEG-4, VC-1, VP8 up to 1080p30 - eliminates need for external codec IC in video surveillance edge nodes. |
| Secure Boot Chain | A-HAB v4 with SHA-256 hash verification and 2048-bit RSA signature check - prevents unauthorized firmware execution at cold start. |
| Parallel Display Support | Four independent display interfaces (LVDS, HDMI 1.4, MIPI DSI, parallel RGB) - enables multi-screen HMIs with independent refresh rates. |
| Industrial Connectivity | Dual FlexCAN 2.0B, Gigabit Ethernet (IEEE 1588), 5x UART (including RS-485 multidrop), 4x uSDHC - meets IEC 61131-3 PLC and gateway requirements. |
Applications
| Industrial HMI | Medical Imaging Edge Node |
|---|---|
Use Scenario: Touch-enabled operator interface in factory-floor PLC cabinets exposed to vibration, EMI, and wide ambient temperature swings. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based Qt GUI, real-time CAN bus data aggregation, and local video diagnostics. Use Value: Dual-core isolation allows deterministic CAN messaging (core 0) while core 1 renders fluid 1080p UI using GPU2Dv2 and IPUv3H - no frame drops at −40°C. |
Use Scenario: Portable ultrasound device requiring real-time beamforming, DICOM image compression, and battery-efficient display output. IC Role / Device Role / Timing Role: Central SoC handling sensor data ingestion via CSI-2, FPGA-assisted signal processing, and JPEG2000 encoding in VPU. Use Value: Hardware ASRC and dual IPUv3H enable synchronized audio/video capture at variable sample rates while maintaining <50 µs latency for trigger-response loops. |
| Ruggedized Gateway | Smart Building Controller |
Use Scenario: DIN-rail mounted edge gateway aggregating Modbus RTU, BACnet MS/TP, and LoRaWAN sensor data into MQTT over cellular. IC Role / Device Role / Timing Role: Applications processor running Yocto Linux with containerized protocol stacks, managing multiple isolated network domains. Use Value: Secure Non-Volatile Storage (SNVS) stores TLS certificates and device identity keys; CAAM accelerates AES-256 encryption for OTA firmware payloads. |
Use Scenario: HVAC control panel with embedded web server, touchscreen UI, and local analytics for occupancy and energy optimization. IC Role / Device Role / Timing Role: Real-time scheduler host for BACnet/IP stack, graphics engine for animated HVAC schematics, and crypto engine for secure cloud API calls. Use Value: GPU3Dv4 renders SVG-based building maps with live sensor overlays; eCSPI and I2C peripherals interface to environmental sensors without CPU polling overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AD | Same silicon revision (D), identical 800 MHz speed and industrial temp grade, but includes MLB (Media Link Bus) support not present in MCIMX6D6AVT08ADR. | Required only when interfacing with NXP analog front-end companion chips (e.g., PFxxx PMICs) via MLB; otherwise functionally redundant. | Select MCIMX6D7CVT08AD only if MLB peripheral integration is mandatory; otherwise MCIMX6D6AVT08ADR offers identical core functionality at lower cost. |
| i.MX 8M Mini (NXP MIMX8MM6CVTKZAA) | Quad-core Arm Cortex-A53 + Cortex-M4, 1.8 GHz A53, integrated MIPI-CSI2/D-PHY, and enhanced security (TEE, OP-TEE), but larger 14 x 14 mm FCBGA-378 package. | Better suited for AI inference at edge (via NN accelerator), higher-resolution camera pipelines, and long-term roadmap alignment beyond i.MX 6 lifecycle. | Choose MIMX8MM6CVTKZAA for new designs requiring future-proofing, neural network acceleration, or MIPI camera bandwidth >1 Gbps; retain MCIMX6D6AVT08ADR for cost-sensitive, thermally constrained legacy upgrades. |
Compared with MCIMX6D6AVT08ADR, MCIMX6D7CVT08AD adds MLB interface capability without altering CPU performance or thermal profile, while MIMX8MM6CVTKZAA shifts to a newer architecture with higher compute density and advanced vision interfaces - making it suitable for next-generation designs but requiring PCB redesign and software migration.
Availability
MCIMX6D6AVT08ADR is available at Aetrix Electronics and suitable for industrial HMIs, medical edge devices, rugged gateways, and smart building controllers requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D6AVT08ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.
The i.MX 6Dual series, including MCIMX6D6AVT08ADR, was engineered for deterministic real-time performance in harsh industrial environments - delivering balanced compute, graphics, and connectivity within strict thermal and power envelopes.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6D6AVT08ADR?
The MCIMX6D6AVT08ADR supports DDR3-1066 (533 MHz clock) with 64-bit bus width and on-die termination. This enables sustained memory bandwidth of up to 8.5 GB/s in dual-channel interleaved mode, sufficient for concurrent 1080p video decode, GUI rendering, and real-time control tasks - verified under industrial temperature conditions per IMX6DQIEC Rev. 6.
Does MCIMX6D6AVT08ADR include hardware cryptographic acceleration?
Yes, MCIMX6D6AVT08ADR integrates the Cryptographic Acceleration and Assurance Module (CAAM) with 16 KB of secure RAM, certified NIST PRNG, and support for AES-128/256, SHA-1/256, RSA-2048, and HMAC. This enables secure boot (A-HAB v4), encrypted filesystems, and TLS offload without software-only crypto overhead.
Can MCIMX6D6AVT08ADR boot directly from eMMC 4.41?
Yes, MCIMX6D6AVT08ADR supports boot from eMMC 4.41 via its uSDHC2 interface in HS200 mode. The internal Boot ROM validates the first 4 KB of boot image using SHA-256 and RSA-2048 signatures stored in eFUSEs, ensuring authenticated and tamper-resistant startup - documented in Section 5.2 of IMX6DQIEC Rev. 6.
What display interfaces does MCIMX6D6AVT08ADR natively support?
MCIMX6D6AVT08ADR provides five native display interfaces: one parallel RGB (24-bit, up to WUXGA), one HDMI 1.4 transmitter, two LVDS serial ports (supporting WUXGA at 60 Hz), and one MIPI DSI (1 Gbps/lane). All operate concurrently with independent timing controllers and pixel clocks - enabling quad-display HMIs without external bridge ICs.
Is MCIMX6D6AVT08ADR pin-compatible with other i.MX 6Dual variants like MCIMX6D7CVT08AD?
Yes, MCIMX6D6AVT08ADR is pin-compatible with MCIMX6D7CVT08AD and other i.MX 6Dual FCPBGA-624 variants (e.g., MCIMX6D6AVT10AD). All share identical ball map, power sequencing, and signal definitions per IMX6DQIEC Section 6.2 - allowing drop-in replacement where MLB interface is unused.
MCIMX6D6AVT08ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D6AVT08ADR FAQ
1.How can I place an order for MCIMX6D6AVT08ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT08ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D6AVT08ADR reliable?
The price and inventory of MCIMX6D6AVT08ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT08ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6D6AVT08ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT08ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D6AVT08ADR?
MCIMX6D6AVT08ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D6AVT08ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D6AVT08ADR?
For technical support, including MCIMX6D6AVT08ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT08ADR requirements.
6.How does Aetrix verify that MCIMX6D6AVT08ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6D6AVT08ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT08ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6D6AVT08ADR?
All MCIMX6D6AVT08ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT08ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D6AVT08ADR part is unused and in its original packaging.
Return procedure for MCIMX6D6AVT08ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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