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NXP Semiconductors MCIMX6D6AVT08AE
- Part No.:
- MCIMX6D6AVT08AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D6AVT08AE.pdf
- Description:
- IC MPU I.MX6D 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,531
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Product details
Overview
MCIMX6D6AVT08AE from NXP Semiconductors is an automotive-grade i.MX 6Dual applications processor featuring dual Arm Cortex-A9 cores running at 852 MHz, integrated VPU and GPU (OpenGL ES 2.0), 1 MB shared L2 cache, and support for DDR3/DDR3L/LPDDR2 memory interfaces. It targets infotainment head units, digital instrument clusters, and telematics gateways requiring real-time multimedia processing, secure boot, and CAN-based vehicle networking.
For engineers reviewing the MCIMX6D6AVT08AE datasheet, MCIMX6D6AVT08AE pinout, MCIMX6D6AVT08AE application, or MCIMX6D6AVT08AE equivalent, key selection criteria include its AEC-Q100 Grade 2 qualification (–40°C to +125°C), FCPBGA-624 package with 0.8 mm pitch, dual FlexCAN 2.0B interfaces, hardware-accelerated video decode/encode (1080p), and TrustZone-enabled security architecture.
Technical Context
The MCIMX6D6AVT08AE implements a symmetric dual-core Arm Cortex-A9 MPCore platform with private L1 caches (32 KB I/D per core), unified 1 MB L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. Its memory subsystem includes boot ROM (96 KB), OCRAM (256 KB), and secure RAM (16 KB), coupled with a 64-bit MMDC supporting DDR3-1066 and LPDDR2-800.
It integrates dedicated multimedia accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode, dual IPUv3H for image scaling/compositing, GPU3Dv4 (200 MTri/s), GPU2Dv2, and GPUVG for OpenVG 1.1 rendering. Power management includes DVFS, software state retention, and hardware power gating across CPU, MPE, and peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual Arm Cortex-A9 r2p10 cores with TrustZone, 852 MHz max frequency under automotive thermal conditions. |
| L2 Cache | 1 MB unified instruction/data cache shared between both cores, reducing inter-core latency and memory bandwidth pressure. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 controller supporting up to DDR3-1066 (532 MHz) and LPDDR2-800 (400 MHz) with interleaving mode. |
| Video Acceleration | Hardware VPU supporting 1080p30 H.264 decode/encode, VC-1 decode, MPEG-4 ASP decode, and JPEG encode/decode. |
| Graphics Units | GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s, OpenCL support), GPU2Dv2 (BitBlt), GPUVG (OpenVG 1.1) - enabling concurrent 2D/3D/VG rendering. |
| Automotive Interfaces | Two FlexCAN 2.0B controllers (1 Mbps), MLB150 interface, ESAI audio interface, and asynchronous sample rate converter (ASRC) for multi-source audio synchronization. |
| Security Features | CAAM with 16 KB secure RAM, SNVS with SRTC, CSU, A-HAB v4 (SHA-256, 2048-bit RSA), and TrustZone isolation for secure boot and runtime protection. |
Pinout & Package
MCIMX6D6AVT08AE is housed in a 21 mm × 21 mm FCBGA package with 624 balls and 0.8 mm pitch, lidded construction for automotive thermal reliability. Ball mapping follows standardized signal naming per IMX6 Series Signal Name Map (EB792).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | Provides regulated 1.2 V ±3% to Arm Cortex-A9 cores; requires low-noise external regulation and decoupling. |
| VDD_SOC | SoC logic voltage | Supplies 1.2 V ±3% to L2 cache, MMDC, and most on-die logic; shares regulator domain with VDD_ARM in many designs. |
| DDR_VREF | DDR reference voltage | Mid-point reference (0.6 V) for DDR3/LPDDR2 I/Os; must be tightly controlled (±1%) to ensure signal integrity. |
| CAN1_TX / CAN1_RX | FlexCAN 1 differential pair | Direct connection to external CAN transceiver; supports ISO 11898-2 compliant 1 Mbps operation with built-in filtering. |
| ENET_MDIO / ENET_MDC | Ethernet management interface | Provides IEEE 802.3-compliant MDIO/MDC bus to configure external PHY; required for Gigabit Ethernet initialization. |
| BOOT_MODE[1:0] | Boot configuration inputs | Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR, SD card); determines initial firmware load path. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power management across CPU, GPU, VPU, and peripherals enables <1.5 W typical active power in infotainment HMI use cases. |
| Dual Independent IPUv3H | Enables simultaneous camera feed preprocessing (deinterlacing, color space conversion) and display pipeline compositing without CPU involvement. |
| Hardware ASRC | Supports concurrent conversion of up to 10 audio channels between asynchronous clocks (e.g., Bluetooth A2DP + USB audio + CAN bus audio telemetry). |
| Secure Boot via A-HAB v4 | Verifies signed firmware images using SHA-256 hash and 2048-bit RSA signature before execution, preventing unauthorized code injection. |
| PCIe v2.0 x1 Root/Endpoint | Enables direct attachment of automotive-grade peripherals (e.g., LTE modems, radar processors) with deterministic latency and DMA access to system memory. |
Applications
| Automotive Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
|
Use Scenario: Central multimedia hub integrating navigation, media playback, voice assistant, and smartphone projection (CarPlay/Android Auto). IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX OS, managing HDMI/LVDS display output, MIPI CSI-2 camera input, and dual CAN for vehicle data fusion. Use Value: Hardware VPU offloads 1080p video decode from CPU, enabling smooth UI animation while maintaining <50 ms audio-video sync tolerance. |
Use Scenario: Real-time rendering of speed, RPM, ADAS warnings, and navigation turn-by-turn on TFT-LCD or OLED cluster displays. IC Role / Device Role / Timing Role: High-reliability graphics processor driving up to four independent display outputs (LVDS + HDMI + DSI) with GPU3D/GPU2D acceleration and safety-critical watchdog supervision. Use Value: Dual IPUv3H units process front/rear camera feeds for surround-view stitching while GPUVG renders vector-based gauges with sub-10 ms frame latency. |
| Telematics Control Unit (TCU) | Vehicle Gateway / Domain Controller |
|
Use Scenario: Cellular-connected module aggregating GPS, cellular modem, and vehicle diagnostics for remote monitoring and OTA updates. IC Role / Device Role / Timing Role: Secure host processor managing eMMC storage, PCIe-connected LTE modem, dual CAN for OBD-II and chassis networks, and CAAM-secured firmware update verification. Use Value: A-HAB v4 and CAAM enable cryptographically signed OTA updates with rollback protection, meeting UNECE R155 cybersecurity management system requirements. |
Use Scenario: Central gateway bridging CAN FD, Ethernet AVB, and LIN networks in zonal architectures, translating protocols and routing messages. IC Role / Device Role / Timing Role: High-throughput network processor with Gigabit Ethernet MAC, dual FlexCAN, and PCIe interface - performing time-synchronized message forwarding and firewall policy enforcement. Use Value: Hardware ASRC synchronizes audio streams from multiple domains (infotainment, ADAS, telephony), while ENET IEEE 1588 support enables sub-1 µs timestamp alignment across ECUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D6AVT10AE | Same i.MX 6Dual core, but rated for 1 GHz operation (vs. 852 MHz); identical package, temperature grade, and peripheral set. | Higher CPU throughput for compute-intensive tasks (e.g., multi-zone audio DSP, advanced speech recognition), with increased dynamic power draw. | Select when sustained >852 MHz performance is required and thermal design accommodates higher junction temperatures. |
| MCIMX6Y2DVM05AB | i.MX 6SoloLite (single Cortex-A9 @ 528 MHz), smaller 14x14 mm BGA-289 package, no VPU, reduced GPU capability, and single CAN. | Targeted at cost-sensitive entry-level clusters or body control modules where 1080p video or dual-display support is unnecessary. | Choose for simplified BOM and layout when full i.MX 6Dual multimedia features are over-provisioned for the application. |
Compared with MCIMX6D6AVT10AE, the MCIMX6D6AVT08AE delivers identical feature set at lower frequency and power envelope; versus MCIMX6Y2DVM05AB, it provides double the CPU cores, full VPU acceleration, dual CAN, and automotive-grade thermal robustness - making it suitable for mid-tier infotainment and gateway roles where performance and integration are balanced.
Availability
MCIMX6D6AVT08AE is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles and AEC-Q100-compliant manufacturing traceability.
Supply support for MCIMX6D6AVT08AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive functional safety.
The i.MX 6Dual series, including MCIMX6D6AVT08AE, was designed specifically for automotive infotainment and digital cockpit systems - emphasizing AEC-Q100 qualification, hardware security, real-time multimedia acceleration, and CAN/Ethernet/MLB interface integration.
FAQ
What is the maximum operating frequency of the MCIMX6D6AVT08AE under automotive conditions?
The MCIMX6D6AVT08AE is rated for a maximum core frequency of 852 MHz when operating across its full automotive temperature range (–40°C to +125°C junction). This frequency is validated with a 24 MHz crystal input (required for USB functionality) and assumes proper power delivery and thermal management per NXP's i.MX 6Dual Automotive datasheet (IMX6DQAEC Rev. 6).
Does the MCIMX6D6AVT08AE support secure boot, and what cryptographic standards does it implement?
Yes, the MCIMX6D6AVT08AE implements Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hashing and 2048-bit RSA signature verification. It uses the CAAM module for cryptographic acceleration and SNVS for secure non-volatile storage, enabling tamper-resistant firmware authentication and secure key provisioning during boot - fully documented in the i.MX 6Dual Security Reference Manual (IMX6DQ6SDLSRM).
What display interfaces are supported by the MCIMX6D6AVT08AE, and how many can operate simultaneously?
The MCIMX6D6AVT08AE supports up to five display interfaces: parallel RGB (24-bit), LVDS (dual-port), HDMI 1.4, MIPI DSI, and LDB. Up to four interfaces may be active concurrently, with a total raw pixel throughput of 450 Mpixels/sec at 24 bpp - sufficient for dual HD1080 + WXGA displays or WUXGA + LVDS configurations, as specified in Section 6 of the IMX6DQAEC datasheet.
Is the MCIMX6D6AVT08AE pin-compatible with other i.MX 6Dual or i.MX 6Quad variants in the same package?
No, the MCIMX6D6AVT08AE is not pin-compatible with i.MX 6Quad variants (e.g., MCIMX6Q6AVT08AE) despite sharing the same 21×21 mm FCPBGA-624 package. Pin assignments differ significantly between Dual and Quad SKUs due to distinct internal bus structures and peripheral allocations - confirmed by comparing ball maps in Sections 6.2 and 6.3 of IMX6DQAEC.
What memory types does the MCIMX6D6AVT08AE support, and what is the maximum DDR3 data rate?
The MCIMX6D6AVT08AE supports DDR3-1066 (532 MHz), DDR3L-1066, and LPDDR2-800 (400 MHz) via its 64-bit MMDC interface. Maximum DDR3 data rate is 1066 MT/s with interleaving enabled; it also supports NAND Flash (MLC/SLC, BCH up to 40-bit ECC), NOR Flash, PSRAM, and eMMC 4.41 - all detailed in Table 6-1 of the IMX6DQAEC datasheet.
MCIMX6D6AVT08AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D6AVT08AE FAQ
1.How can I place an order for MCIMX6D6AVT08AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT08AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D6AVT08AE reliable?
The price and inventory of MCIMX6D6AVT08AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT08AE is usually 5 days.
3.What payment methods are accepted for MCIMX6D6AVT08AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT08AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D6AVT08AE?
MCIMX6D6AVT08AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D6AVT08AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D6AVT08AE?
For technical support, including MCIMX6D6AVT08AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT08AE requirements.
6.How does Aetrix verify that MCIMX6D6AVT08AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6D6AVT08AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT08AE meets industry standards.
7.What is the process for return or replacement of MCIMX6D6AVT08AE?
All MCIMX6D6AVT08AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT08AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D6AVT08AE part is unused and in its original packaging.
Return procedure for MCIMX6D6AVT08AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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