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NXP Semiconductors MCIMX6D6AVT08AER

Part No.:
MCIMX6D6AVT08AER
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
624-FBGA, FCBGA
Datasheet:
AetrixMCIMX6D6AVT08AER.pdf
Description:
IC MPU I.MX6D 852MHZ 624FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,341

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Product details

Overview

MCIMX6D6AVT08AER from NXP Semiconductors is an automotive-grade dual-core Arm Cortex-A9 application processor with integrated VPU and GPU, operating at 852 MHz, featuring 1 MB L2 cache, 64-bit DDR3/DDR3L/LPDDR2 memory interface, and hardware-accelerated 1080p video decode/encode for infotainment head units.

For engineers reviewing the MCIMX6D6AVT08AER datasheet, MCIMX6D6AVT08AER pinout, MCIMX6D6AVT08AER application, or MCIMX6D6AVT08AER equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA-624 package compatibility, dual-CPU + VPU+GPU feature set, and compliance with ISO 26262 ASIL-B ready system-level safety requirements.

Technical Context

The MCIMX6D6AVT08AER implements a symmetric dual-core Arm Cortex-A9 MPCore platform with TrustZone security, each core including 32 KB L1 instruction and data caches plus NEON MPE coprocessor. The SoC integrates SCU, GIC supporting 128 interrupts, and shared 1 MB unified L2 cache.

It features dedicated multimedia accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode up to 1080p30, dual IPUv3H for image scaling/compositing, GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2, and GPUVG (OpenVG 1.1), all coordinated via Smart DMA (SDMA) controller and AXI/AMBA interconnect fabric.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm Cortex-A9 @ 852 MHz - enables real-time OS support and parallel task execution in automotive HMI stacks.
L2 Cache1 MB unified - reduces external memory bandwidth demand and improves deterministic latency for safety-critical tasks.
Memory Interface64-bit DDR3/DDR3L/LPDDR2 up to 532 MHz - supports ≥2 GB system RAM with interleaving for high-throughput graphics/video buffers.
Video ProcessingVPU with 1080p30 decode/encode - offloads CPU for navigation map rendering, rear-view camera processing, and multi-display video playback.
Graphics AccelerationGPU3Dv4 (OpenGL ES 2.0, 200 MTri/s) + GPU2Dv2 + GPUVG - enables smooth 3D instrument cluster rendering and 2D UI compositing without CPU intervention.
Automotive Interfaces2× FlexCAN 1 Mbps, MLB150, ESAI, ASRC - meets automotive audio/video synchronization, diagnostics, and MOST network integration requirements.
SecurityCAAM (16 KB secure RAM), SNVS, A-HAB v4, TrustZone - enables secure boot, DRM, encrypted firmware updates, and tamper-resistant key storage.
PackageFCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive under-hood thermal cycling and vibration environments.

Pinout & Package

MCIMX6D6AVT08AER uses a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 21 mm × 21 mm footprint, 0.8 mm ball pitch, and integrated heat spreader lid. Pin assignments follow NXP's standardized signal naming convention per IMX6DQAEC Rev. 6, with functional contact mapping defined in Section 6 of the datasheet.

Pin/TerminalCircuit RoleDesign Meaning
VDD_ARMCore voltage supply1.2 V ±3% regulated input for dual Cortex-A9 cores and L1/L2 caches - requires low-noise, high-PSRR LDO or PMIC regulation.
VDD_SOCSoC logic voltage1.2 V ±3% supply for interconnect, peripherals, and GPU/VPU - must be sequenced after VDD_ARM during power-up.
DDR_VREFDDR reference voltage0.6 V ±1% termination reference for 64-bit DDR3/DDR3L interface - critical for signal integrity across high-speed memory bus.
ENET_REF_CLKGigabit Ethernet clock input125 MHz differential clock source for IEEE 802.3ab-compliant ENET MAC - must meet jitter <1 ps RMS for reliable 1 Gbps link operation.
CAN1_TX / CAN1_RXFlexCAN channel 1 differential pairISO 11898-2 compliant physical layer interface - supports 1 Mbps automotive diagnostics and ECU communication without external transceiver biasing.
BOOT_MODE[1:0]Boot configuration inputsPull-up/pull-down resistors define boot source (eMMC, NAND, SPI NOR, SD card) - determines initial firmware load path and security policy enforcement.

Key Features

FeatureDesign Value
Smart Speed Power ManagementDynamic voltage/frequency scaling (DVFS) and software state retention reduce active power by >40% vs. fixed-frequency operation while maintaining real-time responsiveness.
Multi-Standard Video CodecHardware-accelerated decode/encode for H.264, VC-1, MPEG-2/4, VP8, and JPEG - eliminates CPU load for concurrent video streams in rear-seat entertainment systems.
Dual Independent IPUv3HParallel image processing pipelines enable simultaneous camera feed de-warping, display scaling, and overlay composition - essential for surround-view systems with ≤30 ms end-to-end latency.
ASRC Audio Conversion10-channel asynchronous sample rate conversion with −120 dB THD+N - synchronizes audio from multiple sources (Bluetooth, tuner, USB) to single output clock domain without jitter-induced artifacts.
Secure Boot ChainA-HAB v4 with SHA-256, 2048-bit RSA, and version control ensures only cryptographically signed firmware executes - prevents unauthorized code injection in OTA update scenarios.
Automotive Safety SupportIntegrated DCIC modules monitor display content integrity per IPU; SNVS RTC and watchdog timers support ASIL-B diagnostic coverage per ISO 26262 Part 5.

Applications

Automotive Digital Instrument ClusterInfotainment Head Unit

Use Scenario: Real-time rendering of vehicle speed, RPM, navigation turn-by-turn, and ADAS alerts on TFT-LCD or OLED display with <50 ms latency.

IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, driving dual-display outputs (LCD + HUD) via LVDS/HDMI, and managing CAN/FlexRay gateway functions.

Use Value: Dual Cortex-A9 + GPU3Dv4 delivers 200 MTri/s geometry throughput for smooth 3D gauges; VPU enables concurrent 720p backup camera preview without frame drops.

Use Scenario: Integrated navigation, media playback, voice assistant, and smartphone projection (CarPlay/Android Auto) in OEM dashboard systems.

IC Role / Device Role / Timing Role: Central multimedia hub interfacing with GPS, Wi-Fi/BT module, eMMC storage, HDMI output, and multi-microphone array via I2S/ESAI.

Use Value: ASRC synchronizes audio from 4+ sources; dual IPUv3H processes front/rear camera feeds simultaneously; CAAM secures OTA firmware updates and DRM-protected streaming content.

Rear-Seat Entertainment SystemAutomotive Telematics Control Unit (TCU)

Use Scenario: Dual-screen video playback (H.264/VP8) with independent volume control, Bluetooth audio streaming, and HDMI mirroring for passenger tablets.

IC Role / Device Role / Timing Role: Media processor handling 1080p decode, audio post-processing, and HDMI/MIPI DSI display output - decoupled from main cluster CPU for fail-operational redundancy.

Use Value: Dedicated VPU offloads CPU for uninterrupted video playback; GPU2Dv2 composites UI overlays on decoded frames; LPDDR2 interface sustains 2.1 GB/s memory bandwidth for dual-stream buffering.

Use Scenario: Cellular-connected vehicle-to-cloud communication with GNSS positioning, remote diagnostics, emergency call (eCall), and firmware management.

IC Role / Device Role / Timing Role: Application processor running Linux-based telematics stack, interfacing with LTE modem via PCIe/USB, GNSS receiver via UART/SPDIF, and vehicle CAN bus via FlexCAN.

Use Value: Two FlexCAN ports enable simultaneous access to powertrain and body networks; SNVS RTC maintains accurate time stamping for event logs; CAAM encrypts cellular data payloads per UMTS/GSM security standards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive application processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCIMX6D6AVT10ACSame dual-core Cortex-A9 + VPU + GPU, but rated for 1 GHz operation (vs. 852 MHz); identical FCPBGA-624 package and automotive temperature range.Higher CPU/GPU performance margin for future-proofing complex HMI or additional virtualization layers; same pinout and power delivery requirements.Select when design requires guaranteed 1 GHz sustained operation under worst-case thermal conditions (e.g., sealed enclosure with no forced airflow).
MCIMX6D4AVT08ACSame 852 MHz speed and automotive grade, but excludes VPU - retains GPU2D/GPU3D and dual IPUv3H; identical package and memory interface.Suitable for graphics-intensive but video-light applications (e.g., digital cluster without camera processing); lower power consumption and reduced BOM cost due to eliminated VPU power domain.Select when video decode/encode is not required, enabling simpler thermal design and lower system power budget without sacrificing 3D UI performance.

Compared with MCIMX6D6AVT08AER, MCIMX6D6AVT10AC offers higher deterministic compute throughput for safety-critical real-time tasks, while MCIMX6D4AVT08AC reduces silicon complexity and power envelope where video acceleration is unnecessary - both maintain identical mechanical, electrical, and software compatibility within the i.MX 6Dual family.

Availability

MCIMX6D6AVT08AER is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles and rigorous AEC-Q100 qualification.

Supply support for MCIMX6D6AVT08AER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive-grade SoCs.

The i.MX 6Dual series, including MCIMX6D6AVT08AER, was designed specifically for automotive infotainment and digital cockpit systems requiring high-performance multimedia processing, functional safety readiness, and long-term supply stability under harsh environmental conditions.

FAQ

What is the maximum operating frequency of the MCIMX6D6AVT08AER processor core?

The MCIMX6D6AVT08AER operates at a guaranteed maximum frequency of 852 MHz for its dual Arm Cortex-A9 cores. This speed is validated under automotive temperature conditions (−40°C to +125°C junction) and assumes use of a 24 MHz crystal oscillator for USB functionality. Performance is maintained across the full voltage and temperature range specified in the IMX6DQAEC datasheet Rev. 6.

Does the MCIMX6D6AVT08AER include hardware video encoding capability?

Yes, the MCIMX6D6AVT08AER includes a dedicated Video Processing Unit (VPU) that supports hardware-accelerated encoding for H.264, MPEG-4, and VC-1 standards up to 1080p30 resolution. This offloads video encode tasks from the CPU, reducing system power consumption and enabling concurrent processing of navigation, audio, and camera feeds in automotive infotainment systems.

What package type and ball count does the MCIMX6D6AVT08AER use?

The MCIMX6D6AVT08AER uses a Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls, measuring 21 mm × 21 mm with 0.8 mm pitch and an integrated heat spreader lid. This package is qualified to automotive AEC-Q100 Grade 2 and supports standard PCB assembly processes including reflow soldering per IPC-J-STD-020.

Which automotive serial interfaces are integrated into the MCIMX6D6AVT08AER?

The MCIMX6D6AVT08AER integrates two FlexCAN controllers (1 Mbps each), one MLB150 interface (150 Mbps), ESAI for multichannel audio, ASRC for asynchronous sample rate conversion, and dual I2C buses (400 kbps). These interfaces meet automotive requirements for ECU communication, audio networking, and sensor data aggregation in infotainment and telematics systems.

Is the MCIMX6D6AVT08AER supported for secure boot and cryptographic operations?

Yes, the MCIMX6D6AVT08AER includes comprehensive hardware security features: Advanced High Assurance Boot (A-HAB v4) with SHA-256 and 2048-bit RSA, Cryptographic Acceleration and Assurance Module (CAAM) with NIST-certified PRNG and 16 KB secure RAM, Secure Non-Volatile Storage (SNVS), and Arm TrustZone. These enable secure firmware authentication, encrypted storage, and tamper-resistant key management per automotive cybersecurity standards.

MCIMX6D6AVT08AER Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
624-FBGA, FCBGA
Series:
i.MX6D
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
624-FCBGA (21x21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

MCIMX6D6AVT08AER FAQ

1.How can I place an order for MCIMX6D6AVT08AER through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT08AER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6D6AVT08AER reliable?

The price and inventory of MCIMX6D6AVT08AER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT08AER is usually 5 days.

3.What payment methods are accepted for MCIMX6D6AVT08AER?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT08AER transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6D6AVT08AER?

MCIMX6D6AVT08AER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6D6AVT08AER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6D6AVT08AER?

For technical support, including MCIMX6D6AVT08AER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT08AER requirements.

6.How does Aetrix verify that MCIMX6D6AVT08AER is sourced from the original manufacturer or authorized distributors?

All MCIMX6D6AVT08AER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT08AER meets industry standards.

7.What is the process for return or replacement of MCIMX6D6AVT08AER?

All MCIMX6D6AVT08AER units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT08AER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6D6AVT08AER part is unused and in its original packaging.

Return procedure for MCIMX6D6AVT08AER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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