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NXP Semiconductors MCIMX6D6AVT10AD
- Part No.:
- MCIMX6D6AVT10AD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D6AVT10AD.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,541
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Product details
Overview
MCIMX6D6AVT10AD from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor operating at 1.0 GHz, featuring integrated VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode, 2D/3D graphics acceleration, and image processing. It supports DDR3/DDR3L/LPDDR2-800 memory, Gigabit Ethernet, dual CAN, MIPI CSI-2/DSI, HDMI 1.4, and USB 2.0 OTG + 3 hosts - deployed in rugged HMI, industrial gateways, and edge vision systems.
For engineers reviewing the MCIMX6D6AVT10AD datasheet, MCIMX6D6AVT10AD pinout, MCIMX6D6AVT10AD application, or MCIMX6D6AVT10AD equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, dual Cortex-A9 core configuration with TrustZone, 1 MB shared L2 cache, and hardware-accelerated multimedia subsystems including VPU and dual IPU.
Technical Context
The MCIMX6D6AVT10AD implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB unified L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated accelerators: VPU for H.264/VC-1/MPEG-4 decode up to 1080p60, IPUv3H for real-time image scaling/compositing, GPU3Dv4 delivering 200 MTri/s, and GPU2Dv2 for BitBLT/stretched BLT operations.
Power management includes DVFS, software state retention, power gating, on-chip LDOs, and thermal monitoring via integrated sensor. Clock architecture features eight PLLs, on-chip oscillators (24 MHz crystal input required for USB), and CCM-based dynamic clock gating across all domains - enabling operation in industrial environments with sustained 1.0 GHz core frequency under full thermal load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 1.0 GHz - enables concurrent real-time control and rich UI execution without OS scheduling bottlenecks. |
| L2 Cache | 1 MB unified - reduces memory bandwidth pressure and improves deterministic latency for industrial control loops. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports up to 2 GB external RAM with interleaving for high-throughput video buffering. |
| Video Acceleration | VPU + dual IPUv3H - delivers full 1080p60 decode/encode and real-time image enhancement (deinterlacing, color space conversion) offloading CPU. |
| Graphics Engine | GPU3Dv4 (200 MTri/s) + GPU2Dv2 + GPUVGv2 - renders OpenGL ES 2.0 UIs, vector graphics, and 2D overlays at HD resolution with <5 ms frame latency. |
| Industrial Temp Range | −40°C to +105°C junction - qualified for uncooled deployment in factory automation, railway, and energy metering equipment. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch - compatible with standard industrial PCB assembly processes and thermal vias for die-level heat dissipation. |
Pinout & Package
MCIMX6D6AVT10AD is housed in a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and lidded construction for mechanical robustness and thermal performance in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for dual Cortex-A9 cores - requires low-noise regulation and local decoupling for stable 1.0 GHz operation. |
| VDD_SOC | SoC logic voltage | 1.2 V ±3% supply for L2 cache, MMDC, and interconnect - shared rail with ARM domain but separate filtering mandatory. |
| VDDA_3P3 | Analog I/O supply | 3.3 V analog reference for ADC, audio interfaces, and USB PHY - isolated from digital rails to maintain SNR >70 dB. |
| CLKIN_24M | Main oscillator input | 24 MHz crystal reference - mandatory for USB 2.0 timing compliance and system clock derivation; no internal oscillator bypass. |
| BOOT_MODE[1:0] | Boot configuration pins | Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR, SD) - determines initial firmware loading path and security policy. |
| ENET_RXD[3:0] | Gigabit Ethernet receive data | LVDS-compatible inputs for 10/100/1000BASE-T MAC interface - requires controlled impedance routing (100 Ω differential) and common-mode chokes. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone Security | Hardware-enforced isolation between secure/non-secure worlds - enables secure boot (A-HABv4), encrypted firmware updates, and CAAM-backed key storage. |
| CAAM Cryptographic Module | 16 KB secure RAM + NIST-certified PRNG - accelerates AES-256, SHA-256, RSA-2048 for DRM, TLS handshake, and secure OTA updates. |
| Smart DMA (SDMA) | Programmable controller with 32-channel context switching - offloads CPU from peripheral-to-memory transfers (e.g., camera → VPU → DDR). |
| ASRC Audio Converter | 10-channel asynchronous sample rate conversion - eliminates clock domain mismatches between codecs, SPDIF, and ESAI without CPU intervention. |
| FlexCAN v2.0B | Dual independent CAN controllers @ 1 Mbps - supports ISO 11898-1 compliant industrial fieldbus communication with error confinement and loopback self-test. |
Applications
| Industrial HMI | Rugged Edge Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface in chemical plant control cabinets exposed to vibration, EMI, and wide ambient temperature swings. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI stack with real-time response to button presses, alarm triggers, and display updates. Use Value: Dual Cortex-A9 + GPU2Dv2 ensures sub-16 ms UI refresh at 1080p while VPU handles live camera feed overlay - all within −40°C to +105°C thermal envelope. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, CANopen, and EtherNet/IP traffic for cloud telemetry in wind turbine nacelles. IC Role / Device Role / Timing Role: Central protocol translator and edge analytics engine with deterministic packet forwarding and local decision logic. Use Value: Dual FlexCAN + Gigabit ENET + eCSPI enables simultaneous fieldbus bridging and secure TLS-encrypted MQTT upload - leveraging CAAM for certificate handling without CPU overhead. |
| Machine Vision Terminal | Energy Metering Data Concentrator |
Use Scenario: Compact vision system inspecting PCB solder joints using monochrome CMOS sensor and real-time defect classification. IC Role / Device Role / Timing Role: Image acquisition, preprocessing (IPUv3H), inference acceleration (VPU-assisted NN layers), and display output controller. Use Value: MIPI CSI-2 + IPUv3H pipeline achieves <8 ms latency from sensor capture to processed ROI - enabling 60 fps inspection at factory line speeds. | Use Scenario: Smart grid concentrator collecting AMI data from 50+ smart meters via RS485 and wireless M-Bus, then reporting to utility SCADA via LTE. IC Role / Device Role / Timing Role: Secure data aggregation hub with cryptographic signing, time-stamped logging, and tamper-evident storage. Use Value: SNVS RTC + CAAM + secure OTP fusing ensures cryptographically signed, time-anchored meter readings - meeting IEC 62056-21 and DLMS/COSEM compliance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AD | Same dual-core Cortex-A9, 800 MHz max frequency, identical FCPBGA-624 package and peripheral set. | Lower frequency limits real-time video processing throughput and multi-threaded UI responsiveness in high-load scenarios. | Select when thermal/power constraints prevent 1.0 GHz operation but full feature set (VPU, GPU, IPU) remains required. |
| i.MX8M Mini (NXP i.MX8MM15CVKZAA) | Quad-core Cortex-A53 + Cortex-M4, 1.8 GHz A53, newer 14 nm process, integrated LPDDR4 support, but no VPU - uses GPU-based video decode. | Lacks hardware VPU; relies on GPU for video decode - higher CPU utilization, reduced deterministic latency for 1080p60 streams. | Select for next-gen designs requiring AI inference (via NPU), longer product lifecycle, or LPDDR4 memory compatibility - not for drop-in replacement. |
Compared with MCIMX6D7CVT08AD, MCIMX6D6AVT10AD delivers 25% higher CPU throughput and improved multimedia latency; compared with i.MX8M Mini, it provides dedicated VPU acceleration essential for deterministic 1080p60 decode in resource-constrained industrial edge nodes - making it irreplaceable where hardware video offload is non-negotiable.
Availability
MCIMX6D6AVT10AD is available at Aetrix Electronics and suitable for industrial HMIs, rugged edge gateways, machine vision terminals, and energy metering data concentrators requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D6AVT10AD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The i.MX 6Dual series - including MCIMX6D6AVT10AD - was designed specifically for industrial applications demanding long-term availability, extended temperature operation, and hardware-accelerated multimedia processing in harsh environments.
FAQ
What is the maximum operating frequency of the MCIMX6D6AVT10AD and what conditions enable it?
The MCIMX6D6AVT10AD operates at a maximum frequency of 1.0 GHz. This speed is guaranteed under industrial temperature conditions (−40°C to +105°C junction) when supplied with 1.2 V ±3% for VDD_ARM and VDD_SOC, and when using a 24 MHz crystal input for CLKIN_24M. The 1.0 GHz rating assumes proper thermal management via the FCPBGA-624 package's thermal lid and PCB copper pour.
Does the MCIMX6D6AVT10AD support secure boot, and how is it implemented?
Yes, the MCIMX6D6AVT10AD supports secure boot via Advanced High Assurance Boot (A-HABv4). It uses the CSU and CAAM modules to verify signed firmware images against RSA-2048 keys stored in eFUSE, enforces SHA-256 hash checking, and initializes Arm TrustZone before loading the first instruction - ensuring only authenticated code executes on MCIMX6D6AVT10AD.
Can the MCIMX6D6AVT10AD directly drive an HDMI 1.4 display, and what are the electrical requirements?
Yes, the MCIMX6D6AVT10AD integrates a native HDMI 1.4 transmitter. It requires external 3.3 V and 1.2 V supplies for the HDMI PHY, proper 100 Ω differential impedance routing for TMDS lanes, and a compliant HDMI level shifter IC (e.g., NXP PTN3360) to meet HDMI specification voltage swing and rise/fall time requirements - all documented in the MCIMX6D6AVT10AD hardware design guide.
What camera interfaces does the MCIMX6D6AVT10AD support, and what is the maximum pixel throughput?
The MCIMX6D6AVT10AD supports parallel CMOS sensors (up to 240 MHz pixel clock) and MIPI CSI-2 (up to 4 lanes at 800 Mbps/lane). Combined throughput across both interfaces reaches 1.92 Gbps. The IPUv3H processes incoming frames in real time, enabling simultaneous 1080p60 capture and deinterlacing - verified in NXP's MCIMX6D6AVT10AD BSP release notes.
Is the MCIMX6D6AVT10AD pin-compatible with other i.MX 6Dual variants such as MCIMX6D7CVT08AD?
Yes, the MCIMX6D6AVT10AD is pin-compatible with MCIMX6D7CVT08AD and all other i.MX 6Dual FCPBGA-624 variants (e.g., MCIMX6D5AVT10AD). They share identical ball map, power sequencing, and signal definitions per the IMX6DQIEC datasheet - allowing frequency-scaling upgrades without PCB redesign, provided thermal and power delivery margins accommodate 1.0 GHz operation.
MCIMX6D6AVT10AD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D6AVT10AD FAQ
1.How can I place an order for MCIMX6D6AVT10AD through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT10AD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D6AVT10AD reliable?
The price and inventory of MCIMX6D6AVT10AD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT10AD is usually 5 days.
3.What payment methods are accepted for MCIMX6D6AVT10AD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT10AD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D6AVT10AD?
MCIMX6D6AVT10AD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D6AVT10AD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D6AVT10AD?
For technical support, including MCIMX6D6AVT10AD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT10AD requirements.
6.How does Aetrix verify that MCIMX6D6AVT10AD is sourced from the original manufacturer or authorized distributors?
All MCIMX6D6AVT10AD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT10AD meets industry standards.
7.What is the process for return or replacement of MCIMX6D6AVT10AD?
All MCIMX6D6AVT10AD units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT10AD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D6AVT10AD part is unused and in its original packaging.
Return procedure for MCIMX6D6AVT10AD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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