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NXP Semiconductors MCIMX6D6AVT10ADR
- Part No.:
- MCIMX6D6AVT10ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D6AVT10ADR.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:854
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Product details
Overview
MCIMX6D6AVT10ADR from NXP Semiconductors is an industrial-grade dual-core Arm Cortex-A9 applications processor with integrated GPU, VPU, and multimedia accelerators. It operates at 1.0 GHz, supports DDR3/DDR3L/LPDDR2-800 memory, delivers 1080p video decode/encode via hardware VPU, and integrates OpenGL ES 2.0 3D graphics (200 MTri/s), OpenVG 1.1, and 2D BitBlt acceleration. It is deployed in rugged HMI terminals, industrial gateways, and edge vision systems requiring real-time imaging and deterministic I/O.
For engineers reviewing the MCIMX6D6AVT10ADR datasheet, MCIMX6D6AVT10ADR pinout, MCIMX6D6AVT10ADR application, or MCIMX6D6AVT10ADR equivalent, key selection criteria include its -40°C to +105°C industrial temperature rating, FCPBGA 21×21 mm 0.8 mm pitch package, dual Cortex-A9 core configuration with TrustZone, 1 MB shared L2 cache, and support for HDMI 1.4, MIPI CSI-2 (4-lane), LVDS, and dual FlexCAN interfaces.
Technical Context
The MCIMX6D6AVT10ADR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB unified L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP), dual IPUv3H image processors, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), and GPUVGv2 (OpenVG 1.1).
Its memory subsystem includes boot ROM (96 KB), OCRAM (256 KB), secure RAM (16 KB), and a 64-bit MMDC supporting DDR3-1066, DDR3L-1066, and LPDDR2-800. Power management features dynamic voltage and frequency scaling (DVFS), software state retention, power gating, and integrated LDOs - enabling operation across industrial thermal profiles without external PMIC dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 1.0 GHz - enables parallel real-time task execution with TrustZone security isolation. |
| L2 Cache | 1 MB unified - reduces memory bandwidth pressure and improves deterministic response in multi-threaded industrial control. |
| Video Processing | Hardware VPU supporting 1080p60 decode/encode - offloads CPU for continuous video analytics pipelines without frame drops. |
| Graphics | GPU3Dv4 (200 MTri/s, OpenGL ES 2.0), GPU2Dv2, GPUVGv2 - enables smooth GUI rendering on dual displays up to WUXGA resolution. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - provides ≥6.4 GB/s peak bandwidth for high-throughput sensor fusion and buffer streaming. |
| Industrial Temp Range | -40°C to +105°C junction - ensures reliable operation in uncontrolled factory, transportation, and outdoor edge environments. |
| Package | FCPBGA, 21 × 21 mm, 0.8 mm pitch, 624-ball - supports high-density routing for industrial PCBs with thermal vias and EMI shielding. |
Pinout & Package
MCIMX6D6AVT10ADR is housed in a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and lidded construction for thermal and mechanical robustness in industrial deployments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for dual Cortex-A9 cores - requires low-noise regulation and local decoupling for stable 1.0 GHz operation. |
| VDD_SOC | SoC logic voltage | 1.2 V ±3% supply for L2 cache, MMDC, and interconnect fabric - shared rail with ARM domain but independently filtered. |
| VDD_DDR | DDR interface voltage | 1.5 V (DDR3) or 1.35 V (DDR3L) - must meet tight slew rate and noise specs per JEDEC for reliable 1066 MT/s operation. |
| BOOT_MODE[1:0] | Boot configuration inputs | Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR, SD) - determines initial firmware load path and security policy. |
| ENET_REF_CLK | Gigabit Ethernet reference clock | 125 MHz differential input - drives IEEE 1588-compliant ENET MAC; jitter <1 ps RMS required for timestamp accuracy. |
| CSI_DATA[7:0] | Parallel camera data bus | 8-bit bidirectional interface supporting up to 240 MHz pixel clock - used for legacy CMOS sensors or FPGA bridging. |
| MIPI_CSI_CLK_P/N | MIPI CSI-2 clock lane | Differential 100 Ω terminated pair - carries embedded clock for 4-lane CSI-2 up to 1 Gbps/lane (800 Mbps/lane in 4-lane mode). |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and DVFS across CPU, GPU, VPU, and memory domains - reduces active power by >40% vs fixed-frequency operation under variable workload. |
| Hardware Security Suite | CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS (secure RTC), CSU, A-HAB v4 (SHA-256, 2048-bit RSA) - enables secure boot, encrypted firmware updates, and DRM-compliant content playback. |
| Multi-Display Support | Five concurrent display interfaces: HDMI 1.4, dual LVDS, parallel RGB, MIPI DSI - allows simultaneous HMI, diagnostics, and operator view on separate panels without external compositor. |
| Flexible Camera Input | Dual MIPI CSI-2 receivers (4-lane each) + parallel 20-bit camera port - supports stereo vision, time-of-flight, or dual-sensor redundancy in machine vision systems. |
| Industrial Connectivity | Dual FlexCAN 2.0B (1 Mbps), Gigabit ENET (IEEE 1588), 5x UART (5 Mbps), 3x I²C (400 kbps), PCIe v2.0 x1 - meets deterministic fieldbus, time-sync, and legacy device integration requirements. |
Applications
| Industrial HMI Terminal | Edge Vision Gateway |
|---|---|
|
Use Scenario: Rugged touchscreen panel in factory automation controlling PLCs, monitoring sensors, and displaying real-time OEE dashboards. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based HMI stack, driving dual LVDS displays, and managing CAN/Ethernet fieldbus communication. Use Value: 1.0 GHz dual-core performance ensures <50 ms UI response under full graphics load; industrial temp rating eliminates fan requirement and extends MTBF. |
Use Scenario: On-machine vision node performing real-time defect detection on production line using two synchronized cameras. IC Role / Device Role / Timing Role: Central vision SoC running YOLOv3-tiny inference on GPU3D, processing raw MIPI CSI-2 streams via dual IPUv3H, and uploading results via Gigabit ENET. Use Value: Hardware VPU and IPU offload >90% of image preprocessing; deterministic latency (<12 ms end-to-end) enables closed-loop rejection control. |
| Railway Signaling Controller | Smart Energy Metering Hub |
|
Use Scenario: EN5012x-certified signaling unit in train control system handling GPS timing, track circuit monitoring, and cab display. IC Role / Device Role / Timing Role: Safety-critical host processor executing SIL2-certified software, synchronizing to GPS PPS via ENET IEEE 1588, and driving redundant displays. Use Value: Dual Cortex-A9 with TrustZone isolates safety and non-safety partitions; -40°C to +105°C rating ensures reliability in railcar underhood environments. |
Use Scenario: DIN-rail mounted gateway aggregating smart meter data (DLMS/COSEM) over RS485, M-Bus, and LoRaWAN, with local analytics. IC Role / Device Role / Timing Role: Secure data concentrator running RTOS + Linux container, encrypting payloads via CAAM, and managing multiple physical layer interfaces. Use Value: Integrated CAAM accelerates AES-128/GCM encryption at line rate; eMMC boot + SNVS RTC enables tamper-resistant firmware and time-stamped event logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D7CVT08AC | 800 MHz max frequency, same package, identical feature set except lower speed grade. | Suitable for cost-sensitive designs where 1.0 GHz headroom is unnecessary; lower dynamic power at same thermal envelope. | Select when thermal budget is constrained or application workload fits within 800 MHz sustained throughput. |
| MCIMX6Y2DVM05AB | Single-core Cortex-A7 @ 528 MHz, 14 mm × 14 mm BGA, no VPU/GPU3D, lower peripheral count. | Targeted at lightweight HMI or protocol gateway; lacks hardware video acceleration and multi-display capability. | Choose only for footprint- and power-constrained applications where multimedia features are not required. |
Compared with MCIMX6D7CVT08AC, MCIMX6D6AVT10ADR delivers 25% higher CPU throughput and improved VPU frame rates for video analytics; compared with MCIMX6Y2DVM05AB, it provides full dual-core scalability, hardware 3D graphics, and industrial-grade multimedia acceleration - making it the only option for demanding edge vision and multi-display HMI.
Availability
MCIMX6D6AVT10ADR is available at Aetrix Electronics and suitable for industrial HMI terminals, edge vision gateways, railway signaling controllers, and smart energy metering hubs requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6D6AVT10ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based applications processors and edge AI acceleration.
The i.MX 6Dual family, including MCIMX6D6AVT10ADR, was designed specifically for industrial edge computing - emphasizing long-term availability, extended temperature operation, functional safety readiness, and hardware-enforced security for mission-critical embedded systems.
FAQ
What is the maximum operating frequency of the MCIMX6D6AVT10ADR?
The MCIMX6D6AVT10ADR is rated for operation at up to 1.0 GHz across its entire industrial temperature range (-40°C to +105°C). This frequency is achievable with a 24 MHz crystal input and proper power delivery; if USB functionality is enabled, the SoC speed remains fully supported at 1.0 GHz per NXP's IMX6DQIEC Rev. 6 specification.
Does the MCIMX6D6AVT10ADR support hardware-accelerated video encoding and decoding?
Yes, the MCIMX6D6AVT10ADR includes a dedicated Video Processing Unit (VPU) that supports hardware-accelerated H.264 Baseline/Main/High Profile, MPEG-4 ASP, and VC-1 Advanced Profile decode and encode up to 1080p60 resolution. This offloads video processing from the CPU cores and enables real-time analytics pipelines in the MCIMX6D6AVT10ADR-based system.
What package type and ball count does the MCIMX6D6AVT10ADR use?
The MCIMX6D6AVT10ADR uses a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with dimensions of 21 mm × 21 mm and a 0.8 mm ball pitch. It is a lidded package designed for thermal dissipation and mechanical robustness in industrial applications, and its pinout is documented in Section 6 of the IMX6DQIEC datasheet.
Which security features are integrated into the MCIMX6D6AVT10ADR?
The MCIMX6D6AVT10ADR integrates multiple hardware security blocks: Cryptographic Acceleration and Assurance Module (CAAM) with 16 KB secure RAM and NIST-certified PRNG; Secure Non-Volatile Storage (SNVS) with secure RTC; Central Security Unit (CSU); Advanced High Assurance Boot (A-HAB v4) supporting SHA-256 and 2048-bit RSA; and Arm TrustZone for memory and interrupt isolation - all confirmed in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).
Can the MCIMX6D6AVT10ADR drive multiple displays simultaneously?
Yes, the MCIMX6D6AVT10ADR supports up to five display interfaces concurrently: HDMI 1.4, dual LVDS ports, parallel RGB, and MIPI DSI. Up to four can be active simultaneously, with a combined raw pixel rate of up to 450 Mpixels/sec at 24 bpp - enabling dual independent HD1080 displays or one WUXGA + auxiliary diagnostic screen in a single MCIMX6D6AVT10ADR-based design.
MCIMX6D6AVT10ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D6AVT10ADR FAQ
1.How can I place an order for MCIMX6D6AVT10ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT10ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D6AVT10ADR reliable?
The price and inventory of MCIMX6D6AVT10ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT10ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6D6AVT10ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT10ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D6AVT10ADR?
MCIMX6D6AVT10ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D6AVT10ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D6AVT10ADR?
For technical support, including MCIMX6D6AVT10ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT10ADR requirements.
6.How does Aetrix verify that MCIMX6D6AVT10ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6D6AVT10ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT10ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6D6AVT10ADR?
All MCIMX6D6AVT10ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT10ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D6AVT10ADR part is unused and in its original packaging.
Return procedure for MCIMX6D6AVT10ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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