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NXP Semiconductors MCIMX6D6AVT10AE
- Part No.:
- MCIMX6D6AVT10AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6D6AVT10AE.pdf
- Description:
- IC MPU I.MX6D 1.0GHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:120
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Product details
Overview
MCIMX6D6AVT10AE from NXP Semiconductors is an automotive-grade i.MX 6Dual applications processor featuring dual Arm Cortex-A9 cores running at 1 GHz, integrated VPU and GPU, 1 MB shared L2 cache, and FCPBGA-529 (21 × 21 mm, 0.8 mm pitch) packaging. It delivers 1080p video decode/encode, OpenGL ES 2.0 3D graphics (200 MTri/s), and dual CAN interfaces for use in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6D6AVT10AE datasheet, MCIMX6D6AVT10AE pinout, MCIMX6D6AVT10AE application, or MCIMX6D6AVT10AE equivalent, key selection criteria include automotive temperature range (−40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface support, hardware-accelerated multimedia processing, and compliance with ISO 26262 ASIL-B functional safety requirements per i.MX 6Dual automotive qualification.
Technical Context
The MCIMX6D6AVT10AE implements a symmetric dual-core Arm Cortex-A9 MPCore platform with TrustZone security, each core including 32 KB L1 instruction and data caches plus NEON MPE coprocessor. The SoC integrates a 1 MB unified L2 cache, SCU, GIC supporting 128 interrupts, and dual AXI master interfaces.
It features dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 1080p encode/decode, dual IPUv3H for image scaling/composition, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), GPUVG (OpenVG 1.1), and ASRC for multi-channel audio sample rate conversion - all coordinated via Smart DMA (SDMA) controller and SPBA interconnect fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 1 GHz - enables concurrent real-time OS and rich UI execution with deterministic latency |
| L2 Cache | 1 MB unified - reduces external memory bandwidth demand and improves multi-threaded throughput |
| Video Processing | VPU supporting 1080p60 decode/encode - offloads CPU for seamless navigation map rendering and rear-view camera display |
| Graphics Acceleration | GPU3Dv4 (200 MTri/s, OpenGL ES 2.0) + GPU2Dv2 - renders complex HMI widgets and layered displays without frame drops |
| Memory Interface | 64-bit DDR3/DDR3L-1066 or dual x32 LPDDR2-800 - supports ≥2 GB system RAM for Android Automotive or QNX-based IVI stacks |
| Automotive Interfaces | 2× FlexCAN 1 Mbps + MLB150 + ESAI + ASRC - enables integration with vehicle bus networks and multi-microphone audio processing |
| Security | CAAM (16 KB secure RAM), SNVS, A-HAB v4, TrustZone - provides hardware-rooted secure boot, DRM, and encrypted firmware updates |
| Package | FCPBGA-529, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive reflow profiles and mechanical shock/vibration environments |
Pinout & Package
MCIMX6D6AVT10AE is housed in a 529-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and integrated heat spreader lid. Pin assignments follow the standardized i.MX 6 series signal naming convention defined in EB792 and documented in Section 6 of IMX6DQAEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling per layout guidelines |
| VDD_SOC | SoC logic power | 1.2 V ±3% supply for L2 cache, MMDC, and interconnect - shares regulator domain with VDD_ARM in many designs |
| VDDA_3P3 | Analog I/O supply | 3.3 V analog rail for USB PHY, HDMI, and audio interfaces - must be isolated from digital noise sources |
| BOOT_MODE[1:0] | Boot configuration | Strapped inputs determining boot source (eMMC, NAND, SPI NOR, SD) - critical for production programming and fail-safe recovery |
| CAN1_RX / CAN1_TX | FlexCAN channel 1 | Differential pair for ISO 11898-1 compliant CAN bus - supports 1 Mbps operation with integrated transceiver biasing |
| ENET_MDIO / ENET_MDC | Ethernet management | I²C-like interface for configuring external PHY registers - required for IEEE 1588 timestamp synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage/frequency scaling (DVFS) across CPU, GPU, VPU, and memory domains - reduces active power by up to 40% vs. fixed-frequency operation |
| Multi-Standard Video Codec | Hardware-accelerated decode/encode for H.264, VC-1, MPEG-2/4, VP8 - eliminates software-only bottlenecks in multi-camera DVR systems |
| Dual Independent IPUv3H | Parallel image processing pipelines for simultaneous camera feed overlay, color space conversion, and display composition - enables split-screen rear-view + surround-view output |
| ASRC with 10-Channel Support | Asynchronous sample rate conversion between independent audio clocks (e.g., Bluetooth A2DP + CAN bus audio sync) - eliminates jitter in multi-source cabin audio systems |
| CAAM Cryptographic Engine | NIST-certified PRNG and AES-128/256, SHA-256 acceleration - enables secure OTA updates and HDCP 2.2 content protection without CPU overhead |
| Automotive Qualification | AEC-Q100 Grade 2 (−40°C to +105°C junction) and full automotive PPAP support - meets Tier-1 supplier requirements for dashboard ECUs |
Applications
| Automotive Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Digital gauge cluster with animated speedometer, ADAS warnings, and navigation turn-by-turn arrows rendered on TFT-LCD. IC Role / Device Role / Timing Role: Primary application processor executing real-time OS, driving parallel RGB display interface and LVDS timing generator. Use Value: GPU3Dv4 and dual IPUv3H enable <16 ms frame latency for safety-critical overlays while maintaining 60 Hz refresh rate. | Use Scenario: Central infotainment unit supporting voice-controlled navigation, wireless CarPlay/Android Auto, and multi-zone audio playback. IC Role / Device Role / Timing Role: System-on-chip host managing HDMI 1.4 video output, USB OTG for smartphone mirroring, and dual CAN for vehicle data access. Use Value: Integrated VPU and ASRC allow simultaneous 1080p video decode and 7.1-channel audio resampling without external co-processors. |
| Rear-View Camera System | Telematics Control Unit (TCU) |
Use Scenario: Multi-camera surround-view system stitching four fisheye feeds into top-down bird's-eye view with dynamic guidelines. IC Role / Device Role / Timing Role: Vision processing hub using CSI-2 interfaces, GPMI for eMMC storage, and GPU2Dv2 for real-time warping/composition. Use Value: Hardware-accelerated image processing achieves sub-100 ms end-to-end latency from sensor capture to display output. | Use Scenario: Cellular-connected TCU aggregating CAN bus diagnostics, GNSS positioning, and remote vehicle control via LTE. IC Role / Device Role / Timing Role: Secure gateway processor interfacing with modem IC via PCIe v2.0, running Linux with CAAM-secured TLS stack. Use Value: Integrated CAAM and SNVS enable FIPS 140-2 Level 3–compliant key storage and secure boot for regulatory compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D5AVT10AC | Same dual-core Cortex-A9, 1 GHz, but industrial temperature grade (−40°C to +105°C) and no MLB interface | Targeted at non-automotive industrial HMIs requiring extended temp but lacking vehicle bus integration | Select when automotive qualification (AEC-Q100 Grade 2) and MLB150 are not required |
| MCIMX6D6AVT10AD | Identical silicon and feature set; differs only in marking and traceability - same automotive qualification and FCPBGA package | No functional difference; used interchangeably in Tier-1 BOMs where lot traceability requirements differ | Select when specific manufacturing lot documentation or regional compliance certifications apply |
Compared with MCIMX6D6AVT10AE, MCIMX6D5AVT10AC lacks automotive-specific interfaces (MLB, enhanced CAN timing), while MCIMX6D6AVT10AD offers identical performance and qualification - making the latter a direct sourcing alternative without design change.
Availability
MCIMX6D6AVT10AE is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across long product lifecycles and rigorous environmental validation.
Supply support for MCIMX6D6AVT10AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of automotive electronics heritage and AEC-Q100-compliant manufacturing.
The i.MX 6Dual family was designed specifically for automotive infotainment and digital cockpit applications, emphasizing functional safety, multimedia performance, and vehicle network integration - with MCIMX6D6AVT10AE representing the highest-speed automotive-qualified variant.
FAQ
What is the maximum operating temperature specification for MCIMX6D6AVT10AE?
The MCIMX6D6AVT10AE is rated for automotive temperature grade A (−40°C to +125°C junction temperature), validated per AEC-Q100 Grade 2 requirements. This specification ensures reliable operation in under-hood and dashboard-mounted automotive environments where ambient temperatures exceed 85°C. Thermal design must maintain die temperature within this range using the recommended PCB copper pour and thermal vias per NXP AN4948.
Does MCIMX6D6AVT10AE support secure boot and cryptographic operations?
Yes, MCIMX6D6AVT10AE includes hardware-accelerated security features: Advanced High Assurance Boot (A-HAB v4) with SHA-256 and 2048-bit RSA verification, Cryptographic Acceleration and Assurance Module (CAAM) with NIST-certified PRNG and AES/SHA engines, and Secure Non-Volatile Storage (SNVS). These enable verified secure boot, encrypted firmware updates, and DRM key management - all implemented without CPU intervention.
What display interfaces does MCIMX6D6AVT10AE support simultaneously?
MCIMX6D6AVT10AE supports up to four concurrent display interfaces: one parallel RGB (24-bit, up to WUXGA), one LVDS (dual-channel, up to WUXGA), one HDMI 1.4 (1080p60), and one MIPI DSI (2-lane, 1 Gbps). Total raw pixel throughput is capped at 450 Mpixels/sec (24 bpp), and interface combinations are constrained by IOMUX pin sharing - e.g., LVDS and HDMI cannot operate simultaneously due to overlapping clock domains.
Can MCIMX6D6AVT10AE interface directly with a USB 3.0 device?
No, MCIMX6D6AVT10AE provides only USB 2.0 interfaces: one HS USB OTG (480 Mbps) with integrated PHY and three HS USB hosts (480 Mbps), two of which use HS-IC USB PHY. USB 3.0 (5 Gbps) support is not integrated; adding it requires an external USB 3.0 hub or bridge IC connected via PCIe v2.0 or SATA II - both of which are available on MCIMX6D6AVT10AE.
What memory types are supported by the MMDC controller in MCIMX6D6AVT10AE?
The Multi-Mode DDR Controller (MMDC) in MCIMX6D6AVT10AE supports DDR3-1066, DDR3L-1066, and LPDDR2-800 across 16-, 32-, or 64-bit configurations. It also enables DDR interleaving mode for dual x32 LPDDR2 channels. External memory support extends to NAND Flash (MLC/SLC, BCH ECC up to 40-bit), NOR Flash, PSRAM, and eMMC 4.41 - all managed via the GPMI and EIM peripherals.
MCIMX6D6AVT10AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D6AVT10AE FAQ
1.How can I place an order for MCIMX6D6AVT10AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D6AVT10AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D6AVT10AE reliable?
The price and inventory of MCIMX6D6AVT10AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D6AVT10AE is usually 5 days.
3.What payment methods are accepted for MCIMX6D6AVT10AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D6AVT10AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D6AVT10AE?
MCIMX6D6AVT10AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D6AVT10AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D6AVT10AE?
For technical support, including MCIMX6D6AVT10AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D6AVT10AE requirements.
6.How does Aetrix verify that MCIMX6D6AVT10AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6D6AVT10AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D6AVT10AE meets industry standards.
7.What is the process for return or replacement of MCIMX6D6AVT10AE?
All MCIMX6D6AVT10AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D6AVT10AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D6AVT10AE part is unused and in its original packaging.
Return procedure for MCIMX6D6AVT10AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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