My Inquiry
My Account
NXP Semiconductors MCIMX6D7CZK08AE
- Part No.:
- MCIMX6D7CZK08AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 569-LFBGA
- Datasheet:
-
MCIMX6D7CZK08AE.pdf
- Description:
- IC MPU I.MX6D 800MHZ 569MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,525
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6D7CZK08AE from NXP Semiconductors is a dual-core Arm Cortex-A9 applications processor operating at 800 MHz, featuring integrated VPU, GPU3Dv4, GPU2Dv2, and IPUv3H for multimedia acceleration, 2×32-bit LPDDR2-800 memory interface, and industrial-grade temperature support (−40°C to +105°C) in a 12 mm × 12 mm FCBGA Package-on-Package (PoP) with 0.4 mm pitch - deployed in rugged embedded HMI and industrial display systems.
For engineers reviewing the MCIMX6D7CZK08AE datasheet, MCIMX6D7CZK08AE pinout, MCIMX6D7CZK08AE application, or MCIMX6D7CZK08AE equivalent, key selection considerations include verified industrial temperature operation, PoP-compatible DDR2/LPDDR2 stack integration, HDMI 1.4 + LVDS + MIPI DSI display concurrency, dual FlexCAN 1 Mbps interfaces, and hardware-accelerated video decode up to 1080p60.
Technical Context
The MCIMX6D7CZK08AE implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (1080p60 decode/encode), dual IPUv3H for image processing, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2 (BitBLT), and GPUVG (OpenVG 1.1).
Its system architecture supports concurrent high-bandwidth peripherals: 4x uSDHC (UHS-I SDR104), 3x USB 2.0 hosts + 1x OTG with PHY, PCIe v2.0 x1, Gigabit Ethernet (IEEE 1588), 5x UART (up to 5 Mbps), 3x I²C (400 kbps), and dual MIPI CSI-2 (up to 1 Gbps/lane) - all managed via AXI/AHB fabric with DVFS and software state retention for industrial power efficiency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 800 MHz - delivers deterministic real-time response for industrial control tasks while enabling Linux/Yocto-based HMI stacks. |
| Memory Interface | 2×32-bit LPDDR2-800 - supports up to 2 GB PoP stack with interleaved access, enabling sustained 6.4 GB/s bandwidth for multi-display rendering. |
| Video Processing | VPU + dual IPUv3H - enables simultaneous 1080p60 decode + 720p60 encode + real-time image enhancement (deinterlacing, scaling, color correction). |
| Display Outputs | HDMI 1.4 + 2×LVDS + MIPI DSI + parallel RGB - drives up to four displays concurrently (e.g., main HMI + rear-view + diagnostics + camera feed) at ≤450 Mpixels/sec total. |
| Industrial Temp Range | −40°C to +105°C junction - validated for continuous operation in sealed enclosures without active cooling in factory automation and transportation systems. |
| Security | CAAM (16 KB secure RAM), SNVS RTC, A-HAB v4 (SHA-256, 2048-bit RSA), CSU, TrustZone - enables secure boot, encrypted firmware updates, and DRM-compliant media playback. |
| Networking | Gigabit Ethernet MAC (IEEE 1588) + dual FlexCAN 2.0B - supports time-synchronized motion control networks and automotive-grade CAN diagnostics in hybrid industrial-automotive platforms. |
Pinout & Package
MCIMX6D7CZK08AE is housed in a 12 mm × 12 mm, 0.4 mm pitch, 484-ball FCBGA Package-on-Package (PoP) optimized for stacking with LPDDR2 memory. Ball map follows i.MX 6Dual standard assignment per IMX6DQCPOPEC Rev. 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M_IN | Primary crystal oscillator input | Mandatory 24 MHz reference for USB PHY and system clock generation; deviation >±50 ppm invalidates HS USB compliance. |
| VDD_ARM | Core voltage supply | 1.2 V ±3% regulated input for Cortex-A9 cores; requires low-noise, high-PSRR LDO with ≥2 A peak current capability. |
| VDD_SOC | SoC logic voltage supply | 1.1 V ±3% for L2 cache, MMDC, and interconnect; decoupling must meet 100 nF + 1 µF per power domain per NXP layout guidelines. |
| BOOT_MODE[1:0] | Boot configuration strapping | Pulled high/low at power-up to select boot source (eMMC, NAND, SPI NOR, or SD); latched at reset release and immutable until next POR. |
| ENET_RXD[3:0]/TXD[3:0] | Gigabit Ethernet PHY interface | RMII/RGMII-capable 8-bit bus; RGMII mode requires 125 MHz differential clock and strict <0.2 ns skew between data and clock pairs. |
| CSI_D[3:0]/CLK | MIPI CSI-2 data and clock lanes | Supports 1–4 lane configurations up to 1 Gbps/lane; requires controlled-impedance 100 Ω differential routing and 1.8 V I/O voltage. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Hardware-managed DVFS and power gating across CPU, GPU, VPU, and IPU domains - reduces active power by up to 40% during partial-load video playback or GUI idle states. |
| Multi-Standard Video Codec | Hardware-accelerated decode/encode for H.264 BP/MP/HP, MPEG-4 ASP, VC-1, VP8, and JPEG - eliminates CPU load for 1080p60 streaming in digital signage and medical imaging. |
| Secure Boot Chain | A-HAB v4 with SHA-256 hash verification, 2048-bit RSA signature validation, and eFUSE-based key provisioning - ensures only cryptographically signed firmware executes on MCIMX6D7CZK08AE. |
| Flexible Display Pipeline | Independent alpha-blending, color-space conversion (YUV↔RGB), and overlay composition across HDMI, LVDS, and MIPI paths - enables seamless multi-source UI layering without GPU intervention. |
| Industrial I/O Integration | Dual FlexCAN 1 Mbps, 5x UART (RS485-ready), 4x PWM, 8×8 KPP, and SPDIF I/O - supports direct connection to PLCs, motor drives, and audio subsystems without external bridge ICs. |
Applications
| Industrial HMI Terminal | Digital Signage Player |
|---|---|
Use Scenario: Rugged touchscreen panel in factory floor control room, operating continuously at 55°C ambient with vibration and EMI exposure. IC Role / Device Role / Timing Role: Main applications processor executing Qt-based HMI with real-time CAN bus monitoring, local video logging, and secure OTA updates. Use Value: Dual Cortex-A9 + VPU offloads GUI rendering and 1080p video decode from CPU, while industrial temp rating and CAAM ensure reliability and firmware integrity under harsh conditions. |
Use Scenario: Wall-mounted retail display showing dynamic ads, inventory status, and promotional video loops in shopping malls. IC Role / Device Role / Timing Role: Central media engine driving HDMI output to LCD panel and decoding multiple H.264 streams from network storage. Use Value: GPU3Dv4 + GPU2Dv2 enables smooth 60 Hz UI transitions and hardware compositing of layered graphics/video; LPDDR2 PoP minimizes board footprint and thermal mass. |
| Transportation Infotainment | Medical Imaging Display |
Use Scenario: In-vehicle infotainment unit in commercial fleet vehicles requiring GPS navigation, Bluetooth hands-free, and rear-camera preview. IC Role / Device Role / Timing Role: Applications processor managing Android Automotive OS, dual-display output (instrument cluster + center console), and real-time camera feed overlay. Use Value: Dual MIPI CSI-2 + dual IPUv3H enable simultaneous 720p camera input and deinterlaced display output; FlexCAN interfaces directly with vehicle CAN bus for telemetry. |
Use Scenario: Portable ultrasound or endoscopy display unit requiring DICOM-compliant image rendering and touch-based annotation. IC Role / Device Role / Timing Role: High-fidelity imaging processor performing real-time YUV→RGB conversion, gamma correction, and lossless JPEG decompression. Use Value: Dedicated ASRC + ESAI + SPDIF support synchronized multi-channel audio/video playback; SNVS RTC and secure boot meet FDA Class II device traceability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6D5EZK08AD | Same dual-core Cortex-A9 @ 800 MHz, but extended commercial temp range (−20°C to +105°C) and PoP package; lacks industrial-grade qualification testing. | Suitable for climate-controlled indoor deployments (e.g., office kiosks), not rated for uncooled industrial enclosures or automotive under-hood environments. | Select when cost sensitivity outweighs need for full industrial qualification; verify thermal margin in final enclosure design. |
| i.MX 8M Mini (NXP, MIMX8MM6CVTKZAA) | Quad-core Cortex-A53 @ 1.8 GHz, 2 GB LPDDR4, integrated GC7000UL GPU, and enhanced security (TEE, HSM); larger 14 mm × 14 mm BGA, higher power envelope. | Targets next-gen UIs with AI inference, voice assistant, and 4K video; requires PCB redesign due to different package, power delivery, and DDR4 interface. | Choose for future-proofing with ARMv8-A, richer multimedia, and advanced security - not a drop-in replacement for MCIMX6D7CZK08AE. |
Compared with MCIMX6D7CZK08AE, MCIMX6D5EZK08AD trades industrial qualification for lower cost in benign environments, while i.MX 8M Mini offers higher performance and modern architecture at the expense of compatibility, power, and layout redesign effort.
Availability
MCIMX6D7CZK08AE is available at Aetrix Electronics and suitable for industrial HMI terminals, digital signage players, transportation infotainment units, and medical imaging displays requiring stable component supply across long production lifecycles.
Supply support for MCIMX6D7CZK08AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.
The i.MX 6Dual family - including MCIMX6D7CZK08AE - was designed specifically for high-reliability embedded applications demanding rich multimedia, real-time responsiveness, and industrial-grade environmental resilience.
FAQ
What is the maximum supported LPDDR2 speed for MCIMX6D7CZK08AE?
The MCIMX6D7CZK08AE supports LPDDR2-800 operation, meaning it interfaces with LPDDR2 memory modules running at 400 MHz clock frequency (800 MT/s data rate). This is implemented across two independent 32-bit channels, enabling up to 6.4 GB/s aggregate bandwidth. The memory controller complies with JEDEC JESD209-2 specification and requires matched trace lengths and proper termination per NXP's i.MX 6Dual Hardware Development Guide.
Does MCIMX6D7CZK08AE support HDMI 2.0?
No, MCIMX6D7CZK08AE supports HDMI 1.4 only, with maximum resolution of 1080p60 and features including deep color (up to 12-bit), xvYCC, and audio return channel (ARC). HDMI 2.0 capabilities such as 4K@60Hz, HDR, and HDCP 2.2 are not implemented in the i.MX 6Dual series; those require i.MX 8M or later platforms.
Can MCIMX6D7CZK08AE boot directly from eMMC?
Yes, MCIMX6D7CZK08AE supports booting directly from eMMC version 4.41 via its uSDHC3 interface. Boot mode is selected using BOOT_MODE[1:0] pins, and the internal Boot ROM loads the SPL (Secondary Program Loader) from eMMC boot partitions. This configuration requires proper eMMC partitioning and FAT32-formatted boot partition containing the bootloader image.
What security certifications apply to MCIMX6D7CZK08AE?
The MCIMX6D7CZK08AE incorporates NIST-certified cryptographic primitives: CAAM's PRNG is validated under CAVP (DRBG #94, SHS #1455), and A-HAB v4 supports SHA-256 and 2048-bit RSA. While the silicon itself is not individually certified to Common Criteria or FIPS 140-2, it provides the hardware foundation required to achieve those certifications at the system level when combined with compliant software and secure key management.
Is there a pin-compatible upgrade path from MCIMX6D7CZK08AE to a newer NXP processor?
No direct pin-compatible upgrade exists. The MCIMX6D7CZK08AE uses a 484-ball 12 mm × 12 mm FCBGA PoP package, whereas newer i.MX 8M series processors use larger packages (e.g., 14 mm × 14 mm or 17 mm × 17 mm) with different ball counts, power delivery requirements, and DDR4 vs. LPDDR2 memory interfaces. Migration requires full PCB redesign and software adaptation.
MCIMX6D7CZK08AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 569-LFBGA
- Series:
- i.MX6D
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 569-MAPBGA (12x12)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6D7CZK08AE FAQ
1.How can I place an order for MCIMX6D7CZK08AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6D7CZK08AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6D7CZK08AE reliable?
The price and inventory of MCIMX6D7CZK08AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6D7CZK08AE is usually 5 days.
3.What payment methods are accepted for MCIMX6D7CZK08AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6D7CZK08AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6D7CZK08AE?
MCIMX6D7CZK08AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6D7CZK08AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6D7CZK08AE?
For technical support, including MCIMX6D7CZK08AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6D7CZK08AE requirements.
6.How does Aetrix verify that MCIMX6D7CZK08AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6D7CZK08AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6D7CZK08AE meets industry standards.
7.What is the process for return or replacement of MCIMX6D7CZK08AE?
All MCIMX6D7CZK08AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6D7CZK08AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6D7CZK08AE part is unused and in its original packaging.
Return procedure for MCIMX6D7CZK08AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6D7CZK08AE Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
