NXP Semiconductors MCIMX6DP4AVT1AB

Overview

MCIMX6DP4AVT1AB from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm® Cortex®-A9 cores operating at 1 GHz, integrated 3D/2D/OpenVG graphics accelerators (OpenGL ES 3.0), and support for DDR3/DDR3L/LPDDR2 memory interfaces. It delivers hardware-accelerated 1080p video processing, dual FlexCAN 1 Mbps interfaces, and is qualified for -40°C to +125°C junction temperature operation in reconfigurable instrument clusters and high-performance infotainment systems.

For engineers reviewing the MCIMX6DP4AVT1AB datasheet, MCIMX6DP4AVT1AB pinout, MCIMX6DP4AVT1AB application, or MCIMX6DP4AVT1AB equivalent, key selection criteria include its automotive AEC-Q100 qualification, absence of VPU (Video Processing Unit), FCPBGA 21×21 mm 0.8 mm pitch package, and dual-core Cortex-A9 architecture with TrustZone® security - critical for safety-critical HMI and domain controller designs.

Technical Context

The MCIMX6DP4AVT1AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, and NEON MPE co-processor. It integrates dedicated hardware accelerators including GPU3Dv6 (OpenGL ES 3.0), GPU2Dv3, GPUVG, two IPUv3H image processors, and ASRC for multi-channel audio sample rate conversion.

Its system-level architecture includes a 64-bit DDR3/DDR3L/LPDDR2 memory interface, four uSDHC ports supporting UHS-I SDR-104, PCIe v2.0 x1 root/endpoint, Gigabit Ethernet (IEEE 1588 compliant), five UARTs (up to 5 Mbps), three I²C buses (400 kbps), and dual FlexCAN controllers - all configured for deterministic real-time operation in automotive environments.

Key Specifications

Pinout & Package

MCIMX6DP4AVT1AB is housed in a 21 mm × 21 mm FCPBGA package with 0.8 mm ball pitch and lid protection. Pin assignments follow the standardized i.MX 6 series signal naming convention (per IMX6 Series Standardized Signal Name Map EB792), with functional contact assignments documented in Section 6 of IMX6DQPAEC Rev. 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive applications.

Compared with MCIMX6DP6AVT1AB, MCIMX6DP4AVT1AB removes VPU to reduce die size and dynamic power, making it ideal for cost-sensitive, graphics-intensive but video-light automotive HMIs; versus MCIMX6QP4AVT1AB, it trades core count for lower static power and simplified thermal design in space-constrained dashboard layouts.

Availability

MCIMX6DP4AVT1AB is available at Aetrix Electronics and suitable for reconfigurable instrument clusters, head-unit infotainment systems, and automotive domain controllers requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 Grade 2 qualification.

Supply support for MCIMX6DP4AVT1AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 50 years of innovation in microcontrollers and processors.

The i.MX 6DualPlus product line was designed specifically for high-reliability automotive human-machine interfaces, delivering balanced CPU performance, advanced graphics, and hardware-enforced security in a thermally optimized FCPBGA package.

FAQ

What is the maximum operating frequency of the MCIMX6DP4AVT1AB processor?

The MCIMX6DP4AVT1AB operates at a maximum CPU frequency of 1 GHz. However, when a 24 MHz crystal is used for the USB reference clock - which is mandatory for USB OTG and host functionality - the maximum achievable SoC speed is limited to 996 MHz per the IMX6DQPAEC Rev. 3 datasheet. This constraint applies to all i.MX 6DualPlus/6QuadPlus variants using the 24 MHz clock source.

Does the MCIMX6DP4AVT1AB include a Video Processing Unit (VPU)?

No, the MCIMX6DP4AVT1AB does not include a Video Processing Unit. Its part number suffix "4A" explicitly denotes the "no VPU" configuration, as confirmed in Table 1 of the IMX6DQPAEC Rev. 3 datasheet. For VPU-enabled variants, refer to MCIMX6DP6AVT1AB or MCIMX6QP6AVT1AB, which support hardware-accelerated H.264/H.265 encode/decode.

What package type and dimensions does the MCIMX6DP4AVT1AB use?

The MCIMX6DP4AVT1AB uses a FCBGA (Flip Chip Ball Grid Array) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and a protective lid. This package is specified in Section 6.2 of the IMX6DQPAEC Rev. 3 datasheet and is qualified for automotive under-hood and dashboard environments with JEDEC J-STD-020 moisture sensitivity level 3.

Which security features are implemented in the MCIMX6DP4AVT1AB?

The MCIMX6DP4AVT1AB integrates multiple hardware security blocks: CAAM (Cryptographic Acceleration and Assurance Module) with 16 KB secure RAM and NIST-certified PRNG; SNVS (Secure Non-Volatile Storage) with Secure RTC; CSU (Central Security Unit); and A-HABv4 (Advanced High Assurance Boot) supporting SHA-256 hashing and 2048-bit RSA signature verification - all documented in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).

What display interfaces does the MCIMX6DP4AVT1AB support?

The MCIMX6DP4AVT1AB supports five concurrent display interfaces: parallel RGB (24-bit, up to 225 Mpixels/sec), LVDS (single/dual port, up to 170 Mpixels/sec), HDMI 1.4, MIPI DSI (1 Gbps per lane), and MIPI CSI-2 (1 Gbps per lane). These are detailed in Section 1.2 and Figure 2 of the IMX6DQPAEC Rev. 3 datasheet and enable multi-display HMI architectures such as WUXGA instrument cluster plus HD center display.