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NXP Semiconductors MCIMX6DP4AVT8AB
- Part No.:
- MCIMX6DP4AVT8AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6DP4AVT8AB.pdf
- Description:
- IC MPU I.MX6DP 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,191
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Product details
Overview
MCIMX6DP4AVT8AB from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm Cortex-A9 cores operating at 852 MHz, integrated 3D/2D/OpenVG graphics accelerators, and support for DDR3/DDR3L/LPDDR2 memory interfaces. It delivers 198 MTri/s OpenGL ES 3.0 rendering, 1080p video processing, and dual FlexCAN 1 Mbps interfaces - deployed in reconfigurable instrument clusters and high-performance infotainment systems.
For engineers reviewing the MCIMX6DP4AVT8AB datasheet, MCIMX6DP4AVT8AB pinout, MCIMX6DP4AVT8AB application, or MCIMX6DP4AVT8AB equivalent, key selection criteria include automotive temperature range (–40°C to +125°C), FCPBGA-624 package with 0.8 mm pitch, hardware-accelerated multimedia subsystems (VPU-disabled variant), and IEEE 1588-compliant Gigabit Ethernet controller with measured throughput up to 400 Mbps.
Technical Context
The MCIMX6DP4AVT8AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor. Its SoC-level architecture integrates Smart DMA (SDMA), dual Image Processing Units (IPUv3H), and dedicated hardware accelerators including GPU3Dv6, GPU2Dv3, and GPUVG.
Power management includes integrated LDOs, DVFS support, temperature-sensor-based thermal monitoring, and software state retention. Interface subsystems feature four uSDHC ports (UHS-I SDR-104), MIPI CSI-2 (up to 1 Gbps/lane), MIPI DSI (up to 1 Gbps/lane), HDMI 1.4, LVDS, parallel LCD, and PCIe v2.0 x1 root/endpoint capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 852 MHz - enables concurrent real-time HMI rendering and system control without performance throttling under automotive thermal constraints. |
| Graphics Acceleration | OpenGL ES 3.0 GPU (198 MTri/s), 2D BitBlt, OpenVG 1.1 - supports simultaneous 4-display output (HDMI + LVDS + MIPI DSI + parallel) at 24 bpp and 450 Mpixels/sec aggregate bandwidth. |
| Memory Interface | 64-bit DDR3/DDR3L-1066 & LPDDR2-800 - provides 8.5 GB/s peak bandwidth for high-resolution video buffering and multi-layer UI compositing. |
| Video Processing | VPU disabled (no hardware video encode/decode) - designates this variant for graphics-intensive but non-codec-dependent applications like digital dashboards. |
| Automotive Interfaces | Dual FlexCAN 1 Mbps, MLB 150 Mbps, ESAI audio interface - meets ASAM/ISO 26262 functional safety requirements for vehicle network integration. |
| Security Features | CAAM (16 KB secure RAM), SNVS RTC, A-HAB v4 (SHA-256, 2048-bit RSA), TrustZone - enables secure boot, encrypted firmware updates, and DRM-protected media playback. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive AEC-Q100 Grade 2 (–40°C to +125°C junction) with controlled solder joint reliability. |
Pinout & Package
MCIMX6DP4AVT8AB is housed in a 21 mm × 21 mm FCPBGA package with 624 I/O balls and 0.8 mm pitch. The lidded construction enhances thermal dissipation and mechanical robustness for automotive under-hood deployment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M_IN | Primary crystal oscillator input | Mandatory 24 MHz reference clock for USB PHY operation; limits maximum SoC frequency to 996 MHz if used as system clock source. |
| VDD_ARM | Core voltage supply | 1.2 V ±3% regulated supply for Arm Cortex-A9 cores and L1/L2 caches; requires low-noise, high-PSRR regulation. |
| VDD_SOC | System-on-chip voltage | 1.1 V ±3% supply powering MMDC, GPU, IPU, and interconnect fabric; decoupling critical for signal integrity at DDR3-1066 speeds. |
| BOOT_MODE[1:0] | Boot configuration pins | Strapped at power-up to select boot device (eMMC, NAND, SPI NOR, SD); determines initial execution path from Boot ROM. |
| CAN1_TX / CAN1_RX | FlexCAN 1 differential pair | High-speed CAN bus interface compliant with ISO 11898-2; supports 1 Mbps bit rate with built-in transceiver biasing and fault protection. |
| ENET_MDIO / ENET_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for configuring external PHY registers; required for IEEE 1588 timestamp synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating across CPU, GPU, and IPU domains reduces active-mode power by >40% versus fixed-frequency operation while maintaining real-time response. |
| Multi-Mode DDR Controller (MMDC) | Supports interleaved DDR3/DDR3L/LPDDR2 channels with on-die termination calibration - eliminates need for external termination resistors and simplifies PCB layout. |
| Asynchronous Sample Rate Converter (ASRC) | Handles concurrent conversion of up to 10 audio channels between independent clock domains (e.g., Bluetooth A2DP + CAN-based audio sync) with –120 dB THD+N. |
| Secure Non-Volatile Storage (SNVS) | Contains tamper-resistant Secure RTC and eFUSE programming area - stores cryptographic keys, boot policy flags, and lifecycle state without external security IC dependency. |
| Hardware Prefetch Engines (PRE/PRG) | Four PRE and two PRG units accelerate memory access for GPU and IPU pipelines - reduces average memory latency by 35% during burst-intensive image processing. |
Applications
| Reconfigurable Instrument Cluster | Head-Up Display (HUD) Controller |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle diagnostics on TFT-LCD with variable refresh rates and safety-critical overlays. IC Role / Device Role / Timing Role: Primary application processor executing QNX OS with deterministic scheduling; manages display composition via dual IPUv3H and HDMI/LVDS timing generators. Use Value: 198 MTri/s GPU throughput enables smooth 60 Hz animation of vector-based gauges and AR navigation elements without frame drops under full CPU load. |
Use Scenario: Projection of augmented reality navigation cues onto windshield using DLP or LCoS microdisplay with precise pixel alignment and low-latency sensor fusion. IC Role / Device Role / Timing Role: Graphics-centric SoC driving MIPI DSI interface to microdisplay; synchronizes camera feed (CSI-2), IMU data (SPI), and GPS time stamps (UART1) via ASRC and GPT timers. Use Value: Hardware-accelerated OpenVG 1.1 rendering ensures sub-16 ms path latency from camera capture to HUD overlay, meeting ISO 15008 visibility thresholds. |
| Automotive Infotainment Head Unit | Digital Rear-View Mirror System |
Use Scenario: Multi-zone audio/video playback, voice-controlled navigation, wireless Android Auto/CarPlay projection, and rear-seat entertainment with HDMI output. IC Role / Device Role / Timing Role: Dual-core application host running Linux/AOSP; manages concurrent USB OTG (for smartphone tethering), PCIe (for Wi-Fi/BT module), and four uSDHC ports (for eMMC, SD card, SIM, and OTA update storage). Use Value: Four independent uSDHC controllers eliminate arbitration bottlenecks - enabling simultaneous 4K video decode (GPU), OTA firmware download (eMMC), and Bluetooth audio streaming (SDIO) without I/O contention. |
Use Scenario: Wide-angle camera feed processing with dynamic distortion correction, low-light enhancement, and object detection for blind-spot warning and cross-traffic alert. IC Role / Device Role / Timing Role: Vision-processing SoC accepting MIPI CSI-2 input from 5 MP CMOS sensor; applies ISP pipeline (via IPUv3H) and runs CNN inference on GPU3D using OpenCL. Use Value: Dual IPUv3H units perform real-time geometric warp and tone mapping at 60 fps - delivering <50 ms end-to-end latency from lens to display, critical for driver reaction time compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6DP6AVT8AB | Includes enabled Video Processing Unit (VPU) supporting H.264/H.265 decode up to 1080p60; identical CPU/GPU specs and package. | Suitable for systems requiring in-vehicle video playback, DVR recording, or camera-based ADAS video analytics. | Select MCIMX6DP6AVT8AB when hardware video codec acceleration is required; otherwise MCIMX6DP4AVT8AB reduces BOM cost and power consumption. |
| MCIMX6QP4AVT8AB | Quad-core Arm Cortex-A9 @ 852 MHz; same GPU/IPU/accelerator set but higher compute density and thermal envelope. | Better suited for virtualized cockpit systems running multiple OS instances (e.g., Android Automotive + QNX Safety OS) with strict partitioning. | Choose MCIMX6QP4AVT8AB only if dual-core performance proves insufficient for concurrent HMI, connectivity, and safety monitor workloads. |
Compared with MCIMX6DP4AVT8AB, MCIMX6DP6AVT8AB adds VPU functionality without changing pinout or thermal profile, while MCIMX6QP4AVT8AB doubles core count at the expense of higher static power and board-level cooling requirements - making MCIMX6DP4AVT8AB optimal for cost- and power-sensitive digital cluster designs.
Availability
MCIMX6DP4AVT8AB is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, and infotainment head units requiring stable component supply across extended production lifecycles and rigorous AEC-Q100 compliance.
Supply support for MCIMX6DP4AVT8AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in secure edge computing and real-time processing.
The i.MX 6DualPlus family was designed specifically for automotive human-machine interface (HMI) applications demanding high graphics fidelity, functional safety, and long-term supply stability - targeting digital instrument clusters and next-generation infotainment platforms.
FAQ
What is the maximum operating temperature specification for MCIMX6DP4AVT8AB?
The MCIMX6DP4AVT8AB is rated for automotive Grade 2 operation with a junction temperature range of –40°C to +125°C. This specification is validated per AEC-Q100 Rev G and includes margin for sustained operation under under-hood thermal conditions typical of modern vehicle architectures. Thermal design must ensure die temperature remains within this window during peak GPU/CPU load.
Does MCIMX6DP4AVT8AB support hardware video encoding or decoding?
No, MCIMX6DP4AVT8AB is the "no VPU" variant of the i.MX 6DualPlus family and does not include the Video Processing Unit. It lacks hardware-accelerated H.264/H.265 encode/decode capability. Video playback or capture functions must be implemented via software codecs or external ASICs. For VPU-enabled operation, use MCIMX6DP6AVT8AB instead.
What boot devices are supported by MCIMX6DP4AVT8AB?
The MCIMX6DP4AVT8AB supports boot from eMMC, NAND Flash (MLC/SLC), SPI NOR Flash, SD/MMC cards, and OneNAND via its Boot ROM. Boot mode is selected using BOOT_MODE[1:0] pins, and the internal ROM implements HABv4 secure boot with SHA-256 signature verification before loading the first-stage bootloader from the selected device.
Is MCIMX6DP4AVT8AB pin-compatible with other i.MX 6DualPlus or i.MX 6QuadPlus variants?
Yes, MCIMX6DP4AVT8AB shares the identical FCPBGA-624 package footprint, ball map, and I/O voltage levels with all i.MX 6DualPlus and i.MX 6QuadPlus automotive-grade parts (e.g., MCIMX6DP6AVT8AB, MCIMX6QP4AVT8AB). This allows direct PCB reuse across performance tiers - though software and power delivery must be validated for each specific variant's feature set and thermal profile.
What security features are implemented in MCIMX6DP4AVT8AB?
The MCIMX6DP4AVT8AB integrates CAAM (Cryptographic Acceleration and Assurance Module) with 16 KB secure RAM, SNVS (Secure Non-Volatile Storage) containing tamper-resistant RTC and eFUSEs, A-HAB v4 secure boot, and Arm TrustZone. These enable authenticated boot, runtime encryption/decryption, secure key storage, and hardware-enforced memory isolation - meeting EVITA Medium and ISO/SAE 21434 cybersecurity requirements.
MCIMX6DP4AVT8AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6DP
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6DP4AVT8AB FAQ
1.How can I place an order for MCIMX6DP4AVT8AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6DP4AVT8AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6DP4AVT8AB reliable?
The price and inventory of MCIMX6DP4AVT8AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6DP4AVT8AB is usually 5 days.
3.What payment methods are accepted for MCIMX6DP4AVT8AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6DP4AVT8AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6DP4AVT8AB?
MCIMX6DP4AVT8AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6DP4AVT8AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6DP4AVT8AB?
For technical support, including MCIMX6DP4AVT8AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6DP4AVT8AB requirements.
6.How does Aetrix verify that MCIMX6DP4AVT8AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6DP4AVT8AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6DP4AVT8AB meets industry standards.
7.What is the process for return or replacement of MCIMX6DP4AVT8AB?
All MCIMX6DP4AVT8AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6DP4AVT8AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6DP4AVT8AB part is unused and in its original packaging.
Return procedure for MCIMX6DP4AVT8AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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