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NXP Semiconductors MCIMX6DP4AVT8ABR

Part No.:
MCIMX6DP4AVT8ABR
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
624-FBGA, FCBGA
Datasheet:
AetrixMCIMX6DP4AVT8ABR.pdf
Description:
IC MPU I.MX6DP 852MHZ 624FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,846

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Product details

Overview

MCIMX6DP4AVT8ABR from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm Cortex-A9 cores operating at 852 MHz, integrated OpenGL ES 3.0 3D GPU (198 MTri/s), dual image processing units (IPUv3H), and hardware video processing acceleration. It supports DDR3/DDR3L/LPDDR2 memory, HDMI 1.4, MIPI DSI/CSI-2, dual CAN 2.0B, and Gigabit Ethernet - deployed in reconfigurable instrument clusters and high-performance infotainment systems.

For engineers reviewing the MCIMX6DP4AVT8ABR datasheet, MCIMX6DP4AVT8ABR pinout, MCIMX6DP4AVT8ABR application, or MCIMX6DP4AVT8ABR equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA-624 package with 0.8 mm pitch, absence of VPU in this variant, and verified support for HABv4 secure boot, CAAM cryptographic acceleration, and ASRC audio sample rate conversion.

Technical Context

The MCIMX6DP4AVT8ABR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor. Its memory subsystem includes 512 KB OCRAM and supports DDR3-1066, LPDDR2-800, and NAND Flash with BCH up to 40-bit ECC.

It integrates dedicated multimedia accelerators: GPU3Dv6 (OpenGL ES 3.0), GPU2Dv3 (BitBlt), GPUVG (OpenVG 1.1), two IPUv3H units, and ASRC for multi-channel asynchronous audio resampling. Power management includes DVFS, software state retention, and on-chip LDOs managed by the PMU.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm Cortex-A9 @ 852 MHz - delivers deterministic real-time performance for automotive HMI and concurrent OS tasks.
GPUOpenGL ES 3.0 3D accelerator (198 MTri/s) + OpenVG 1.1 - enables smooth UI rendering and vector graphics without CPU load.
Memory Interface64-bit DDR3/DDR3L/LPDDR2 controller - supports interleaved access and up to 1066 MT/s for low-latency frame buffering.
Video AccelerationNo integrated VPU (VPU disabled per part number suffix '4A') - video decode/encode handled via CPU or external codec.
Automotive InterfacesDual FlexCAN 2.0B (1 Mbps), MLB 150 Mbps, ESAI, ASRC - meets automotive audio networking and bus communication requirements.
SecurityHABv4, CAAM (16 KB secure RAM), SNVS, CSU, TrustZone - enables secure boot, encrypted firmware updates, and runtime integrity verification.
PackageFCPBGA-624, 21 mm × 21 mm, 0.8 mm pitch, lidded - qualified for automotive underhood thermal cycling and vibration.

Pinout & Package

MCIMX6DP4AVT8ABR is housed in a 21 mm × 21 mm FCPBGA package with 624 solder balls and 0.8 mm pitch. The package is lidded and AEC-Q100 qualified for automotive use. Pin assignments follow the standardized signal naming convention defined in IMX6DQPAEC Rev. 3, with functional contact assignments documented in Section 6 of the datasheet.

Pin/TerminalCircuit RoleDesign Meaning
VDD_ARMCore power supply1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling.
VDD_SOCSoC logic power1.1 V ±3% supply for L2 cache, interconnect, and peripheral logic - critical for timing closure.
CLK_24MUSB reference clock input24 MHz crystal oscillator input - mandatory for USB OTG/HS operation and limits max SoC speed to 996 MHz.
CAN1_TX / CAN1_RXFlexCAN 1 differential interfaceHigh-speed CAN 2.0B transceiver pins - require external termination and ESD protection per ISO 11898-2.
HDMI_TX_CLK / HDMI_TX_DATAxHDMI 1.4 TMDS outputDifferential pixel clock and data lanes - demand controlled impedance (100 Ω differential) and length matching.
SD1_CMD / SD1_CLK / SD1_DATAxeMMC/uSDHC interfaceHigh-speed MMC/SDIO host interface supporting UHS-I SDR104 - requires separate power domain and signal integrity layout.

Key Features

FeatureDesign Value
Smart Speed TechnologyDynamic voltage/frequency scaling across CPU, GPU, and memory domains - reduces active power by >40% vs. fixed-frequency operation.
Secure Boot ChainHABv4 with SHA-256, 2048-bit RSA, and version control - prevents unauthorized firmware execution and enforces signed update policy.
Dual Independent IPUv3HHardware-accelerated image scaling, rotation, color space conversion, and overlay blending - offloads CPU for multi-display compositing.
ASRC with 10-channel concurrencyAsynchronous sample rate conversion up to −120 dB THD+N - eliminates audio jitter when bridging multiple clock domains (e.g., Bluetooth + CAN + SPDIF).
PCIe v2.0 x1 Root/EndpointGen2-compliant interface with integrated PHY - enables direct connection to automotive ADAS sensors or NVMe storage without bridge IC.

Applications

Reconfigurable Instrument ClusterHead-Unit Infotainment System

Use Scenario: Digital dashboard with animated gauges, navigation overlays, and driver-alert icons rendered across dual 1280×800 LCDs.

IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, driving parallel LCD and LVDS displays via dual IPUv3H units and GPU3D.

Use Value: Real-time rendering at 60 Hz with <5 ms latency between CAN message arrival and gauge update - enabled by TrustZone-isolated safety-critical tasks and deterministic interrupt handling.

Use Scenario: In-vehicle multimedia hub integrating HDMI video input, Bluetooth audio streaming, rear-seat camera feed, and voice-controlled navigation.

IC Role / Device Role / Timing Role: Central media processor managing HDMI 1.4 sink, MIPI CSI-2 camera input, ESAI/ASRC audio routing, and dual CAN for vehicle telemetry.

Use Value: Simultaneous 1080p decode + 7.1 audio playback + CAN bus monitoring with <15 ms end-to-end audio-video sync - achieved via hardware-accelerated pipelines and dedicated DMA channels.

Automotive Telematics Control Unit (TCU)Advanced Driver Assistance Systems (ADAS) Gateway

Use Scenario: Cellular-connected module aggregating GPS, cellular modem, Wi-Fi, and vehicle bus data for cloud-based fleet management and OTA updates.

IC Role / Device Role / Timing Role: Host processor interfacing with LTE modem via PCIe, GPS via UART, and vehicle networks via dual FlexCAN and MLB interfaces.

Use Value: Secure firmware updates over-the-air using HABv4 signature verification and CAAM AES-256 encryption - ensuring integrity and confidentiality of field-deployed code.

Use Scenario: Sensor fusion gateway consolidating radar, camera, and ultrasonic inputs before forwarding processed alerts to instrument cluster and ADAS ECUs.

IC Role / Device Role / Timing Role: High-bandwidth data router with PCIe-to-CAN bridging, GPMI NAND for sensor log storage, and SNVS RTC for time-stamped event recording.

Use Value: Deterministic timestamping of collision warnings within ±100 ns using SNVS SRTC and hardware-triggered GPIO capture - meeting ISO 26262 ASIL-B timing requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCIMX6QP4AVT8ABRQuad-core Cortex-A9 @ 852 MHz; same package, temperature grade, and peripheral set - but adds third IPU and full VPU capability.Required for simultaneous 1080p encode+decode or triple-display compositing beyond dual-LCD scope of MCIMX6DP4AVT8ABR.Select when higher parallelism is needed for multi-camera ADAS preprocessing or 4K UI rendering - at cost of +15% power and +20% BOM complexity.
MCIMX8MQ6CVTIZABArm Cortex-A53 quad-core @ 1.5 GHz; integrated GC7000Lite GPU; no VPU; supports LPDDR4 and PCIe Gen3 - newer architecture with improved IPC and security (ARMv8-A, TrustZone, OP-TEE).Targets next-gen infotainment with Android 12+, Vulkan API, and virtualized cockpit - lacks MLB and ASRC, requiring external audio bridge IC.Choose for long-term roadmap alignment and enhanced security certification path - not drop-in; requires new PCB layout and BSP migration.

Compared with MCIMX6DP4AVT8ABR, the MCIMX6QP4AVT8ABR offers higher compute throughput for parallel workloads but increases thermal design margin requirements, while the MCIMX8MQ6CVTIZAB provides architectural modernization and future-proof security features at the expense of legacy automotive interface compatibility and mature toolchain support.

Availability

MCIMX6DP4AVT8ABR is available at Aetrix Electronics and suitable for automotive instrument clusters, head-unit infotainment systems, and telematics control units requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6DP4AVT8ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6DualPlus family was designed specifically for high-reliability automotive applications demanding real-time graphics, multi-interface connectivity, and hardware-enforced security - targeting instrument clusters, digital cockpits, and infotainment gateways compliant with AEC-Q100 Grade 2.

FAQ

What is the maximum operating frequency of the MCIMX6DP4AVT8ABR?

The MCIMX6DP4AVT8ABR operates at a guaranteed maximum frequency of 852 MHz under automotive temperature conditions (−40°C to +125°C junction). When a 24 MHz crystal is used for USB functionality - which is required - the SoC speed is limited to 996 MHz; however, this higher speed is not rated or guaranteed for automotive-grade operation per the IMX6DQPAEC datasheet Rev. 3.

Does the MCIMX6DP4AVT8ABR include a Video Processing Unit (VPU)?

No, the MCIMX6DP4AVT8ABR does not include an integrated Video Processing Unit. The part number suffix '4A' explicitly denotes the 'no VPU' configuration. Video encoding and decoding must be performed in software on the Cortex-A9 cores or offloaded to an external codec IC - unlike the '6A' variants which integrate full VPU functionality.

What automotive interfaces are supported by the MCIMX6DP4AVT8ABR?

The MCIMX6DP4AVT8ABR supports dual FlexCAN 2.0B controllers (1 Mbps each), MediaLB (MLB150/50), ESAI audio interface, asynchronous sample rate converter (ASRC), and SRTC in SNVS for automotive-grade timekeeping. These interfaces meet requirements for vehicle network communication, multi-source audio synchronization, and functional safety timing compliance.

Is the MCIMX6DP4AVT8ABR qualified to AEC-Q100 standards?

Yes, the MCIMX6DP4AVT8ABR is AEC-Q100 qualified for Grade 2 (−40°C to +105°C ambient / −40°C to +125°C junction). This qualification is confirmed in the ordering information table and package description of the IMX6DQPAEC datasheet Rev. 3, and applies to the FCPBGA-624 lidded package variant.

What security features are implemented in the MCIMX6DP4AVT8ABR?

The MCIMX6DP4AVT8ABR implements HABv4 secure boot with SHA-256 and 2048-bit RSA, CAAM cryptographic acceleration (AES-256, SHA, RNG), SNVS with secure RTC, CSU for policy enforcement, and Arm TrustZone for hardware-isolated execution environments - all documented in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).

MCIMX6DP4AVT8ABR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
624-FBGA, FCBGA
Series:
i.MX6DP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Supplier Device Package:
624-FCBGA (21x21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

MCIMX6DP4AVT8ABR FAQ

1.How can I place an order for MCIMX6DP4AVT8ABR through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6DP4AVT8ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6DP4AVT8ABR reliable?

The price and inventory of MCIMX6DP4AVT8ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6DP4AVT8ABR is usually 5 days.

3.What payment methods are accepted for MCIMX6DP4AVT8ABR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6DP4AVT8ABR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6DP4AVT8ABR?

MCIMX6DP4AVT8ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6DP4AVT8ABR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6DP4AVT8ABR?

For technical support, including MCIMX6DP4AVT8ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6DP4AVT8ABR requirements.

6.How does Aetrix verify that MCIMX6DP4AVT8ABR is sourced from the original manufacturer or authorized distributors?

All MCIMX6DP4AVT8ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6DP4AVT8ABR meets industry standards.

7.What is the process for return or replacement of MCIMX6DP4AVT8ABR?

All MCIMX6DP4AVT8ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6DP4AVT8ABR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6DP4AVT8ABR part is unused and in its original packaging.

Return procedure for MCIMX6DP4AVT8ABR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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