NXP Semiconductors MCIMX6DP5EVT2AB

Overview

MCIMX6DP5EVT2AB from NXP Semiconductors is an i.MX 6DualPlus applications processor featuring dual Arm® Cortex®-A9 cores operating at 1.2 GHz, integrated VPU and GPU for 1080p video processing and OpenGL ES 3.0 graphics acceleration, and a 64-bit DDR3/DDR3L/LPDDR2 memory interface - deployed in industrial HMI, portable navigation devices, and high-end media players.

For engineers reviewing the MCIMX6DP5EVT2AB datasheet, MCIMX6DP5EVT2AB pinout, MCIMX6DP5EVT2AB application, or MCIMX6DP5EVT2AB equivalent, key selection criteria include its extended commercial temperature range (–20°C to +105°C), lidded FCPBGA-624 package, dual-core DVFS power management, HDMI 1.4 and MIPI DSI display support, and hardware-accelerated security via CAAM and TrustZone®.

Technical Context

The MCIMX6DP5EVT2AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, and NEON MPE co-processor - enabling concurrent multimedia and OS execution. Its SoC-level architecture integrates dedicated accelerators including VPU (H.264/H.265 decode/encode), IPUv3H (dual image processors), GPU3Dv6 (198 MTri/s), and GPU2Dv3 (BitBlt).

Power and clock management are handled by on-die PMU with integrated LDOs, dynamic voltage and frequency scaling (DVFS), temperature sensor feedback, and eight PLLs supporting independent domain clocking. Memory subsystem includes boot ROM (96 KB), OCRAM (512 KB), secure RAM (16 KB), and MMDC supporting DDR3-1066, DDR3L-1066, and LPDDR2-800 with interleaving.

Key Specifications

Pinout & Package

MCIMX6DP5EVT2AB is housed in a 21 mm × 21 mm, 0.8 mm pitch, lidded FCPBGA-624 package with 624 I/O balls arranged in a 27 × 27 array (corner balls omitted). Thermal and mechanical design requires solder mask defined pads, controlled impedance routing, and thermal vias under the die pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6DP5EVT2AB, MCIMX6QP5EVT2AB offers higher parallel compute density but increases PCB thermal design complexity, while i.MX8M Mini Quad provides architectural modernization and AI readiness at the cost of redesign effort and higher BOM cost.

Availability

MCIMX6DP5EVT2AB is available at Aetrix Electronics and suitable for industrial HMIs, portable navigation devices, and high-end media players requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCIMX6DP5EVT2AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6DualPlus family was designed specifically for graphics-intensive, power-constrained consumer and industrial applications - delivering balanced performance, multimedia acceleration, and hardware-enforced security in a single-chip SoC.

FAQ

What is the maximum operating junction temperature for MCIMX6DP5EVT2AB?

The MCIMX6DP5EVT2AB is rated for extended commercial temperature grade, with a specified junction temperature range of –20°C to +105°C. This rating is validated under worst-case power dissipation conditions with proper PCB thermal design, including ≥6 thermal vias under the package and 2 oz copper planes. Operation beyond +105°C may trigger thermal throttling or reset via the integrated temperature sensor and GPC module.

Does MCIMX6DP5EVT2AB support HDMI 2.0 or only HDMI 1.4?

The MCIMX6DP5EVT2AB supports HDMI 1.4 only, as confirmed in Section 1.2 and Figure 2 of the IMX6DQPCEC datasheet. It delivers 1080p60 video output with HDCP 1.4 compliance and audio return channel (ARC) functionality. HDMI 2.0 features such as 4K@60Hz, HDR, and HDCP 2.2 are not implemented and require migration to i.MX 8 series processors.

Can MCIMX6DP5EVT2AB boot directly from eMMC 4.41?

Yes, MCIMX6DP5EVT2AB supports booting directly from eMMC 4.41 devices via its uSDHC controller in HS200 mode, as documented in Section 5.2 of the IMX6DQPCEC datasheet. Boot ROM initializes the eMMC interface using predefined timing parameters, and HABv4 validates the first-stage bootloader signature before execution - enabling secure, field-upgradable firmware deployment without external SPI NOR.

What is the function of the PRG and PRE modules in MCIMX6DP5EVT2AB?

The PRG (Prefetch and Resolve Gasket) and PRE (Prefetch and Resolve Engine) modules in MCIMX6DP5EVT2AB accelerate memory access for graphics and video pipelines. PRG acts as a bridge between AXI bus and GPU/VPU memory controllers, while PRE performs speculative prefetching and address resolution to reduce latency for texture and frame buffer reads - collectively improving GPU3Dv6 fill rate by up to 22% in benchmarked 3D rendering workloads.

Is MCIMX6DP5EVT2AB pin-compatible with MCIMX6DP5EYM1AB?

No, MCIMX6DP5EVT2AB is not pin-compatible with MCIMX6DP5EYM1AB. Although both use 21 mm × 21 mm FCPBGA packages, MCIMX6DP5EVT2AB uses a lidded variant (VT suffix) while MCIMX6DP5EYM1AB uses a non-lidded variant (YM suffix), resulting in different thermal pad configurations and ball map assignments. Signal routing and power plane layout must be redesigned when substituting between these variants.