NXP Semiconductors MCIMX6DP5EYM1AB

Overview

MCIMX6DP5EYM1AB from NXP Semiconductors is an i.MX 6DualPlus applications processor featuring dual Arm Cortex-A9 cores operating at 1 GHz, integrated VPU and GPU for 1080p video processing and OpenGL ES 3.0 graphics acceleration, and a 64-bit DDR3/DDR3L/LPDDR2 memory interface - deployed in industrial HMI, portable navigation devices, and high-end media players requiring concurrent display, camera, and network connectivity.

For engineers reviewing the MCIMX6DP5EYM1AB datasheet, MCIMX6DP5EYM1AB pinout, MCIMX6DP5EYM1AB application, or MCIMX6DP5EYM1AB equivalent, key selection criteria include its FCPBGA-529 (21 × 21 mm, 0.8 mm pitch) package, extended commercial temperature range (–20 °C to +105 °C), dual-core DVFS power management, and support for HDMI 1.4, MIPI CSI-2/DSI, Gigabit Ethernet, and dual FlexCAN interfaces.

Technical Context

The MCIMX6DP5EYM1AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor - enabling concurrent real-time OS execution and media processing. Its memory subsystem includes boot ROM (96 KB), OCRAM (512 KB), and support for DDR3-1066, LPDDR2-800, and NAND Flash with up to 40-bit BCH ECC.

System-level integration includes dedicated hardware accelerators: VPU for H.264/AVC decode/encode, dual IPUv3H for image scaling/compositing, GPU3Dv6 (OpenGL ES 3.0, 198 MTri/s), GPU2Dv3, and GPUVG for OpenVG 1.1 rendering - all coordinated via AXI/AMBA interconnect and managed by GPC power controller and CCM clock module.

Key Specifications

Pinout & Package

MCIMX6DP5EYM1AB is housed in a 529-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and non-lidded construction - optimized for thermal dissipation in compact industrial enclosures and compatible with standard PCB reflow profiles.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6DP5EYM1AB, MCIMX6QP5EYM1AB offers greater multithreaded throughput at the cost of higher static power, while MCIMX6DP5EVT2AB delivers higher single-thread performance within the same dual-core footprint - both require board-level validation of thermal design and DDR signal integrity.

Availability

MCIMX6DP5EYM1AB is available at Aetrix Electronics and suitable for industrial HMI terminals, portable navigation devices, and medical imaging workstations requiring stable component supply across multi-year production cycles and long-term obsolescence planning.

Supply support for MCIMX6DP5EYM1AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications - delivering high-performance, low-power processors with integrated security and mixed-signal IP.

The i.MX 6DualPlus family, including MCIMX6DP5EYM1AB, was designed for graphics-intensive embedded applications demanding balanced CPU/GPU/VPU performance, broad peripheral integration, and robust security - targeting human-machine interfaces, portable media, and intelligent edge devices.

FAQ

What is the maximum supported DDR3 memory speed for MCIMX6DP5EYM1AB?

The MCIMX6DP5EYM1AB supports DDR3-1066 (532 MHz) operation with 64-bit bus width, achieving up to 12.8 GB/s theoretical bandwidth. This is confirmed in Section 4.10 "Multi-Mode DDR Controller (MMDC)" of the IMX6DQPCEC datasheet Rev. 3. The processor also supports DDR3L-1066 and LPDDR2-800, with timing parameters validated for industrial temperature ranges. MCIMX6DP5EYM1AB requires precise PCB layout for DQS-to-clock skew control to maintain signal integrity at full speed.

Does MCIMX6DP5EYM1AB support HDMI 2.0 or only HDMI 1.4?

MCIMX6DP5EYM1AB supports HDMI 1.4 only, as specified in Section 1.2 "Features" and Figure 2 of the IMX6DQPCEC datasheet. It delivers up to 1080p60 video output with HDCP 1.4 compliance but lacks HDMI 2.0 features such as 4K@60Hz, HDR metadata, or enhanced audio return channel (eARC). The HDMI transmitter block is implemented as a single-port PHY with TMDS clock up to 165 MHz - sufficient for HDMI 1.4's 3.4 Gbps per lane but not HDMI 2.0's 6 Gbps requirement.

Can MCIMX6DP5EYM1AB boot directly from eMMC 4.5 or later?

Yes, MCIMX6DP5EYM1AB supports boot from eMMC up to specification rev 4.41, as stated in Section 1.2 "Features" and Table 1 of the IMX6DQPCEC datasheet. Boot mode configuration via BOOT_MODE[1:0] pins selects eMMC as primary device, and the internal boot ROM initializes the uSDHC4 controller to load FSBL from eMMC boot partitions. While eMMC 4.5 adds HS400 mode, MCIMX6DP5EYM1AB's uSDHC does not implement HS400 timing - it operates in HS200 mode (200 MHz DDR) for optimal boot performance.

What is the thermal design power (TDP) rating for MCIMX6DP5EYM1AB?

MCIMX6DP5EYM1AB does not specify a formal TDP value; instead, its power consumption is characterized by junction temperature limits and voltage domains. Under typical 1 GHz operation with active DDR3, GPU, and VPU, measured power is ≈1.3 W (Section 4.2 "Power Supplies Requirements"). The extended commercial grade (–20 °C to +105 °C) requires heatsink design targeting ≤85 °C case temperature under continuous load - verified using the thermal resistance θ_JA = 22.5 °C/W (FCPBGA-529, 4-layer board) from NXP AN4948.

Is MCIMX6DP5EYM1AB pin-compatible with MCIMX6QP5EYM1AB?

Yes, MCIMX6DP5EYM1AB and MCIMX6QP5EYM1AB share identical FCPBGA-529 package dimensions, ball pitch (0.8 mm), and pinout - confirmed in Section 6.2 "21 x 21 mm Package Information" and Table 6-1 "Ball Map" of IMX6DQPCEC Rev. 3. Both parts use the same mechanical footprint and electrical signaling (1.2 V core, 3.3 V I/O), allowing direct PCB substitution where quad-core performance is needed. However, software must be recompiled for quad-core SMP Linux to utilize all four Cortex-A9 cores.