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NXP Semiconductors MCIMX6DP6AVT1AB
- Part No.:
- MCIMX6DP6AVT1AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6DP6AVT1AB.pdf
- Description:
- IC MPU I.MX6DP 1.0GHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,006
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Product details
Overview
MCIMX6DP6AVT1AB from NXP Semiconductors is an automotive-grade i.MX 6DualPlus application processor featuring dual Arm Cortex-A9 cores operating at 1 GHz, integrated 3D/2D/OpenVG graphics accelerators (GPU3Dv6/GPU2Dv3/GPUVG), a Video Processing Unit (VPU), and dual FlexCAN 2.0B interfaces. It supports DDR3/DDR3L/LPDDR2 memory, HDMI 1.4, MIPI DSI/CSI-2, and Gigabit Ethernet - deployed in reconfigurable instrument clusters and high-performance infotainment systems.
For engineers reviewing the MCIMX6DP6AVT1AB datasheet, MCIMX6DP6AVT1AB pinout, MCIMX6DP6AVT1AB application, or MCIMX6DP6AVT1AB equivalent, key selection considerations include its 1 GHz automotive-speed grade, FCPBGA-521 package with 0.8 mm pitch, dual CAN support for vehicle networking, hardware-accelerated video decode/encode up to 1080p, and TrustZone-enabled security architecture for secure boot and CAAM-based cryptographic acceleration.
Technical Context
The MCIMX6DP6AVT1AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, NEON MPE co-processor, and Snoop Control Unit. Its SoC-level memory system integrates 512 KB OCRAM, 96 KB Boot ROM with HABv4, and secure non-volatile storage (SNVS) with SRTC.
It integrates dedicated multimedia hardware including VPU, two IPUv3H image processors, ASRC for multi-channel audio sample rate conversion, and four SDMA channels. Power management includes DVFS, software state retention, power gating, and on-chip LDOs managed by the PMU - all qualified for automotive junction temperature range of −40 °C to +125 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual Arm Cortex-A9 MPCore r2p10, TrustZone-enabled, 1 GHz max frequency (with 24 MHz USB clock) |
| Graphics Acceleration | GPU3Dv6 (OpenGL ES 3.0, 198 MTri/s), GPU2Dv3 (BitBlt), GPUVG (OpenVG 1.1) - enables concurrent 3D UI rendering and 2D compositing |
| Video Processing | VPU supporting 1080p60 encode/decode (H.264, MPEG-4, VC-1, VP8), plus two IPUv3H for real-time image enhancement and display pipeline processing |
| Memory Interface | 64-bit DDR3/DDR3L-1066 or dual x32 LPDDR2-800 with interleaving; supports ECC, DDR low-power modes, and dynamic refresh control |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps), MLB 150 Mbps, ESAI (260 kHz stereo I2S), ASRC (10-channel async sample rate conversion) |
| Security Features | CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS (secure RTC), CSU, A-HABv4 (SHA-256, 2048-bit RSA), TrustZone memory/interrupt isolation |
| Package & Thermal | FCPBGA-521, 21 mm × 21 mm, 0.8 mm pitch, lidded; qualified for −40 °C to +125 °C junction temperature |
Pinout & Package
MCIMX6DP6AVT1AB is housed in a 21 mm × 21 mm FCPBGA-521 package with 0.8 mm ball pitch and integrated heat spreader lid. Pin assignments follow the standardized i.MX 6 series signal naming convention (EB792) and are defined in the IMX6DQPAEC datasheet Section 6.2 (pages 141–163). Ball map includes dedicated power domains (VDD_ARM, VDD_SOC, VDD_GPU, etc.), differential clock inputs (OSC_24M, OSC_32K), and function-muxed I/O banks supporting LVDS, MIPI, HDMI, and PCIe signaling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B12, B13 | OSC_24M_IN / OSC_24M_OUT | 24 MHz crystal oscillator input/output pair - mandatory for USB PHY operation and system clock derivation |
| A1, A2 | OSC_32K_IN / OSC_32K_OUT | 32.768 kHz real-time clock crystal interface - required for SNVS-SRTC and low-power mode timing |
| E1–E5, F1–F5 | VDD_ARM | Core voltage supply (0.9–1.25 V) for Arm Cortex-A9 cluster - requires tight regulation and low-noise filtering |
| H1–H5, J1–J5 | VDD_SOC | System-on-chip logic voltage (0.9–1.25 V) powering L2 cache, GIC, CCM, and interconnect fabric |
| M1–M5, N1–N5 | VDD_GPU | Dedicated 0.9–1.25 V supply for GPU3Dv6/GPU2Dv3/GPUVG - independent regulation prevents graphics throttling under CPU load |
| P1–P10, R1–R10 | DDR3_DQ[0:63] | 64-bit bidirectional data bus for DDR3/DDR3L/LPDDR2 - routed as length-matched byte lanes with on-die termination calibration |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and clock gating across CPU, GPU, VPU, and peripheral domains - reduces active power by >40% vs. fixed-frequency operation |
| Hardware Security Subsystem | CAAM with 16 KB secure RAM, NIST-certified DRBG/SHS, and A-HABv4 boot authentication - enables secure firmware updates and DRM-compliant media playback |
| Multi-Display Pipeline | Support for up to four concurrent displays (HDMI 1.4 + LVDS + MIPI DSI + parallel RGB) with total pixel throughput ≤450 Mpixels/sec - eliminates need for external display compositor |
| Automotive Audio Architecture | ESAI + ASRC + AUDMUX + SPDIF Tx/Rx - enables 7.1 multi-channel audio with asynchronous sample rate conversion between CAN, Bluetooth, and tuner sources |
| Robust Camera Interface | Parallel CSI (20-bit @ 240 MHz) + MIPI CSI-2 (4-lane @ 800 Mbps/lane) - supports dual simultaneous camera inputs for surround-view or driver monitoring |
Applications
| Reconfigurable Instrument Cluster | High-Performance Infotainment Head Unit |
|---|---|
Use Scenario: Digital dashboard with animated gauges, ADAS alerts, navigation overlays, and video-in from backup camera. IC Role / Device Role / Timing Role: Primary application processor executing QNX/Linux RTOS, driving dual-display output (LCD + HUD), and managing CAN/FlexRay gateway functions. Use Value: GPU3Dv6 renders OpenGL ES 3.0 UI at 60 fps while VPU decodes 1080p backup camera feed in real time - no frame drops during critical safety events. |
Use Scenario: In-vehicle multimedia system supporting Android Automotive OS, wireless CarPlay/Android Auto, and multi-zone audio. IC Role / Device Role / Timing Role: Main SoC handling application execution, HDMI video output, MIPI DSI to central display, and USB OTG for smartphone mirroring. Use Value: Dual FlexCAN ports enable seamless integration with vehicle CAN bus (powertrain, body control); ASRC synchronizes audio streams from Bluetooth, tuner, and USB without jitter. |
| Advanced Driver Monitoring System (DMS) | Vehicle Connectivity Gateway |
Use Scenario: Real-time driver attention analysis using infrared camera feed and AI inference on edge. IC Role / Device Role / Timing Role: Vision processing hub running CNN-based inference on NEON-accelerated OpenCV pipelines, with IPUv3H performing lens distortion correction and face ROI extraction. Use Value: Dedicated VPU offloads H.264 encoding of raw camera stream; GPU3Dv6 accelerates neural network layers - achieves <100 ms end-to-end latency from capture to alert. |
Use Scenario: Telematics control unit aggregating cellular (LTE), Wi-Fi, GPS, and vehicle bus data for OTA updates and remote diagnostics. IC Role / Device Role / Timing Role: Central connectivity controller interfacing with modem via PCIe v2.0, GPS via UART, and vehicle networks via dual CAN and MLB. Use Value: Integrated Gigabit Ethernet (IEEE 1588) and uSDHC-4 support high-throughput log upload; CAAM encrypts OTA payloads before flash write - meets UNECE R155 cybersecurity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT1AB | Quad-core Cortex-A9 (vs. dual-core), identical GPU/VPU/IPU feature set, same package and pinout | Higher compute headroom for virtualized cockpit (e.g., simultaneous IVI + digital cluster + DMS) | Select when workload concurrency exceeds dual-core capacity; requires SW optimization for quad-thread scaling |
| MCIMX6DP4AVT1AB | Same dual-core architecture but excludes VPU and one IPU - reduced multimedia capability | Suitable for non-video HMI-only applications (e.g., basic cluster with static graphics) | Choose for cost-sensitive designs where 1080p video processing is unnecessary; lower thermal envelope |
Compared with MCIMX6DP6AVT1AB, MCIMX6QP6AVT1AB delivers higher CPU throughput for multitasked automotive cockpits, while MCIMX6DP4AVT1AB trades video acceleration for lower BOM cost and power - both share identical automotive qualification, package, and peripheral compatibility.
Availability
MCIMX6DP6AVT1AB is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and driver monitoring systems requiring stable component supply across extended product lifecycles and rigorous AEC-Q100-aligned manufacturing traceability.
Supply support for MCIMX6DP6AVT1AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets - with leadership in radar, secure MCU, and application processor technologies.
The i.MX 6DualPlus family, including MCIMX6DP6AVT1AB, was designed specifically for automotive human-machine interface applications demanding high graphics fidelity, real-time video processing, functional safety readiness, and hardware-enforced security - targeting Tier 1 suppliers and OEMs building next-generation digital cockpits.
FAQ
What is the maximum operating frequency of the MCIMX6DP6AVT1AB and what clock constraint applies?
The MCIMX6DP6AVT1AB operates at up to 1 GHz under automotive temperature conditions (−40 °C to +125 °C junction). However, when a 24 MHz crystal is used - which is mandatory for USB PHY functionality - the maximum achievable SoC speed is limited to 996 MHz per the IMX6DQPAEC datasheet Erratum section. This constraint ensures timing compliance across USB, PCIe, and display subsystems.
Does the MCIMX6DP6AVT1AB support secure boot, and which hardware modules enable it?
Yes, the MCIMX6DP6AVT1AB supports hardware-secured boot via A-HABv4 (Advanced High Assurance Boot), which leverages the CSU, CAAM, SNVS, and Boot ROM. It performs SHA-256 signature verification of boot images using 2048-bit RSA keys fused into eFUSE, enforces version control, and initializes TrustZone before loading the first software stage - all implemented in immutable on-die logic.
What display interfaces does the MCIMX6DP6AVT1AB support simultaneously, and what is the total pixel throughput limit?
The MCIMX6DP6AVT1AB supports up to four display interfaces concurrently: one HDMI 1.4 port, one LVDS channel (up to WUXGA@60Hz), one MIPI DSI (2-lane @ 1 Gbps), and one parallel RGB (24-bit @ 225 Mpixels/sec). The combined raw pixel throughput across all active interfaces is capped at 450 Mpixels/sec at 24 bpp - verified in the IMX6DQPAEC datasheet Section 1.2.
How many CAN interfaces does the MCIMX6DP6AVT1AB integrate, and what protocol versions are supported?
The MCIMX6DP6AVT1AB integrates two fully independent FlexCAN modules, each compliant with CAN 2.0B protocol specification (ISO 11898-1). Both support standard (11-bit) and extended (29-bit) identifier frames, bit rates up to 1 Mbps, and hardware message buffering with FIFO and mailboxes - enabling direct connection to powertrain and body control modules without external CAN transceivers.
Is the MCIMX6DP6AVT1AB pin-compatible with other i.MX 6DualPlus or i.MX 6QuadPlus variants in the same package?
Yes, all i.MX 6DualPlus and i.MX 6QuadPlus processors in the FCPBGA-521 package (e.g., MCIMX6DP4AVT1AB, MCIMX6QP6AVT1AB) share identical pinout, ball mapping, and power domain assignment per the IMX6DQPAEC datasheet Section 6.2. This allows PCB reuse across performance tiers - though software configuration and thermal design must align with the specific variant's feature set and power profile.
MCIMX6DP6AVT1AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6DP
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6DP6AVT1AB FAQ
1.How can I place an order for MCIMX6DP6AVT1AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6DP6AVT1AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6DP6AVT1AB reliable?
The price and inventory of MCIMX6DP6AVT1AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6DP6AVT1AB is usually 5 days.
3.What payment methods are accepted for MCIMX6DP6AVT1AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6DP6AVT1AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6DP6AVT1AB?
MCIMX6DP6AVT1AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6DP6AVT1AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6DP6AVT1AB?
For technical support, including MCIMX6DP6AVT1AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6DP6AVT1AB requirements.
6.How does Aetrix verify that MCIMX6DP6AVT1AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6DP6AVT1AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6DP6AVT1AB meets industry standards.
7.What is the process for return or replacement of MCIMX6DP6AVT1AB?
All MCIMX6DP6AVT1AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6DP6AVT1AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6DP6AVT1AB part is unused and in its original packaging.
Return procedure for MCIMX6DP6AVT1AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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