NXP Semiconductors MCIMX6DP6AVT1ABR

Overview

MCIMX6DP6AVT1ABR from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm Cortex-A9 cores operating at 1 GHz, integrated VPU and GPU (OpenGL ES 3.0), 1 MB L2 cache, and FCPBGA-521 package (21 × 21 mm, 0.8 mm pitch). It delivers full multimedia acceleration for reconfigurable instrument clusters and high-performance infotainment systems.

For engineers reviewing the MCIMX6DP6AVT1ABR datasheet, MCIMX6DP6AVT1ABR pinout, MCIMX6DP6AVT1ABR application, or MCIMX6DP6AVT1ABR equivalent, key selection criteria include automotive temperature range (−40°C to +125°C), dual-core 1 GHz operation with TrustZone, integrated 3D/2D/VPU accelerators, DDR3L/LPDDR2 memory interface, and dual FlexCAN support for vehicle networking.

Technical Context

The MCIMX6DP6AVT1ABR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, unified 1 MB L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (1080p decode/encode), IPUv3H (dual image processing units), GPU3Dv6 (198 MTri/s), GPU2Dv3, and GPUVG.

Its system architecture includes a 64-bit DDR3/DDR3L/LPDDR2 memory controller, four uSDHC interfaces supporting UHS-I SDR-104, dual MIPI CSI-2 (up to 4 lanes @ 800 Mbps/lane), HDMI 1.4, LVDS, parallel LCD, PCIe v2.0 x1, Gigabit Ethernet (IEEE 1588 compliant), five UARTs, three I²C, five eCSPI, two FlexCAN (1 Mbps), ESAI, ASRC, and CAAM cryptographic module with 16 KB secure RAM.

Key Specifications

Pinout & Package

MCIMX6DP6AVT1ABR uses a 521-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 21 mm × 21 mm footprint, 0.8 mm ball pitch, and integrated heat spreader lid. Pin assignments follow the standardized signal naming convention defined in IMX6DQPAEC Rev. 3, with functional contact assignments detailed across 17 signal groups (e.g., DDR, NAND, USB, CAN, MIPI, HDMI).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive application processor applications.

Compared with MCIMX6DP6AVT1ABR, the MCIMX6QP6AVT1ABR offers higher CPU concurrency for virtualized instrument clusters, while the MCIMX8MQ6CVTIZAB trades VPU acceleration for advanced GPU compute and process node efficiency - neither is pin-compatible, and both require PCB redesign and BSP migration.

Availability

MCIMX6DP6AVT1ABR is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, and central infotainment systems requiring stable component supply across extended product lifecycles and AEC-Q100-compliant manufacturing.

Supply support for MCIMX6DP6AVT1ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 40 years of automotive IC heritage and ISO/TS 16949-certified manufacturing.

The i.MX 6DualPlus family was designed specifically for high-reliability automotive human-machine interfaces, integrating graphics, vision, and network acceleration into a single AEC-Q100 Grade 2 SoC to replace multi-chip instrument cluster solutions.

FAQ

What is the maximum operating temperature specification for MCIMX6DP6AVT1ABR?

The MCIMX6DP6AVT1ABR is qualified to AEC-Q100 Grade 2 with a junction temperature range of −40°C to +125°C. This rating is validated per NXP's automotive qualification protocol and supports under-dash and center-stack mounting in passenger vehicles without forced cooling. Thermal derating begins above 105°C ambient per IMX6DQPAEC Section 4.1.

Does MCIMX6DP6AVT1ABR support secure boot with hardware root-of-trust?

Yes, MCIMX6DP6AVT1ABR implements Advanced High Assurance Boot (A-HAB v4) with SHA-256 hashing, 2048-bit RSA signature verification, and eFUSE-based key provisioning. The boot ROM validates signed images before loading, and CAAM provides secure key storage and cryptographic acceleration for subsequent firmware authentication steps.

Can MCIMX6DP6AVT1ABR drive multiple displays simultaneously?

Yes, MCIMX6DP6AVT1ABR supports up to four concurrent displays: one HDMI 1.4 port, one LVDS channel (dual-link capable), one MIPI DSI interface (2-lane), and one parallel RGB interface. Total raw pixel throughput reaches 450 Mpixels/sec, enabling WUXGA + HD + WVGA configurations with hardware composition via IPUv3H and GPU2D.

What camera interfaces does MCIMX6DP6AVT1ABR provide for surround-view systems?

MCIMX6DP6AVT1ABR integrates two MIPI CSI-2 receivers, each supporting up to four data lanes at 800 Mbps/lane, plus one parallel CMOS camera interface (20-bit, 240 MHz). This enables direct connection of up to four fisheye cameras - two via MIPI and two via parallel - with hardware ISP preprocessing in dual IPUv3H units.

Is MCIMX6DP6AVT1ABR pin-compatible with other i.MX 6DualPlus variants like MCIMX6DP4AVT1ABR?

Yes, all i.MX 6DualPlus FCPBGA-521 packages including MCIMX6DP6AVT1ABR and MCIMX6DP4AVT1ABR share identical mechanical footprint, ball map, and power/ground pin assignments. Frequency and feature differences (e.g., VPU enablement) are configured via eFUSE and software, allowing drop-in replacement within the same temperature grade and package variant.