NXP Semiconductors MCIMX6DP6AVT8AAR
- Part No.:
- MCIMX6DP6AVT8AAR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6DP6AVT8AAR.pdf
- Description:
- IC MPU I.MX6DP 852MHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6DP6AVT8AAR from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm Cortex-A9 cores operating at 852 MHz, integrated VPU, GPU3Dv6 (OpenGL ES 3.0), GPU2Dv3, and IPUv3H for concurrent video decode/encode and image processing. It delivers up to 198 MTri/s 3D graphics performance and supports 1080p60 video processing, making it suitable for reconfigurable digital instrument clusters and high-performance automotive infotainment systems.
For engineers reviewing the MCIMX6DP6AVT8AAR datasheet, MCIMX6DP6AVT8AAR pinout, MCIMX6DP6AVT8AAR application, or MCIMX6DP6AVT8AAR equivalent, key selection considerations include its FCPBGA-624 package with 0.8 mm pitch, automotive temperature range (–40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface, dual FlexCAN 2.0B ports, and hardware-accelerated security via CAAM and TrustZone.
Technical Context
The MCIMX6DP6AVT8AAR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, NEON MPE coprocessor, and Snoop Control Unit. Its SoC-level architecture integrates dedicated accelerators including VPU (H.264/H.265 decode/encode), dual IPUv3H for real-time image scaling/compositing, and GPU3Dv6 supporting OpenGL ES 3.0 and OpenCL.
Power management is handled by an on-die PMU with DVFS support, temperature sensor, software state retention, and power gating. The device supports boot from multiple media (eMMC, NAND, NOR, SD) and includes HABv4 secure boot with SHA-256, 2048-bit RSA, and eFUSE-based CSU policy enforcement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 852 MHz - enables deterministic real-time response in safety-critical instrument cluster rendering. |
| Graphics Engine | GPU3Dv6 (OpenGL ES 3.0) @ 198 MTri/s - renders complex 3D gauges and animated UIs without CPU load. |
| Video Processing | VPU with 1080p60 decode/encode - supports dual-display video playback and camera feed overlay in ADAS dashboards. |
| Memory Interface | 64-bit DDR3/DDR3L-1066 & LPDDR2-800 - provides >6.4 GB/s bandwidth for multi-layer display compositing and buffer streaming. |
| Automotive Interfaces | 2× FlexCAN 2.0B @ 1 Mbps + MLB150 - connects to vehicle CAN bus and MOST audio networks without external transceivers. |
| Security | CAAM (16 KB secure RAM) + TrustZone + A-HABv4 - enables secure boot, DRM-protected media, and encrypted OTA updates. |
| Temperature Range | –40°C to +125°C (junction) - qualified for under-hood and dashboard mounting in automotive ECUs. |
Pinout & Package
MCIMX6DP6AVT8AAR is housed in a 21 mm × 21 mm FCPBGA package with 624 balls and 0.8 mm pitch, lidded construction for thermal reliability in automotive environments. Pin assignments follow the standardized i.MX 6 series signal naming convention (EB792) and are documented in Section 6 of IMX6DQPAEC Rev. 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling. |
| VDD_SOC | SoC Logic Power | 1.2 V ±3% supply for L2 cache, GPC, CCM, and interconnect - shares regulator domain with VDD_ARM in many designs. |
| VDD_DDR | DDR Memory Interface | 1.35 V (DDR3L) or 1.5 V (DDR3) supply - must meet tight slew rate and ripple specs per JEDEC standards. |
| BOOT_MODE[1:0] | Boot Configuration | Strapped inputs determining boot source (eMMC, NAND, SPI NOR) - sampled at POR and locked until reset. |
| CAN1_TX / CAN1_RX | FlexCAN Channel 1 | Differential signaling pair for CAN 2.0B bus - requires external 120 Ω termination and isolated transceiver for EMI robustness. |
| MLB_CLK / MLB_DATA | MediaLB Interface | 150 Mbps serial link for MOST network audio transport - uses differential LVDS signaling with internal termination. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across all domains reduces active power by up to 40% vs fixed-frequency operation. |
| Dual IPUv3H Image Processors | Enables simultaneous 1080p input de-interlacing, color space conversion, and overlay compositing for HUD + cluster fusion. |
| Hardware ASRC | Supports concurrent 10-channel sample rate conversion (e.g., 44.1 kHz audio sources → 48 kHz system clock) with <–120 dB THD+N. |
| PCIe v2.0 x1 Endpoint/Root | Enables direct connection to automotive radar sensors or cellular modems without bridge ICs or protocol translation. |
| Secure Non-Volatile Storage (SNVS) | Includes tamper-resistant SRTC and eFUSE bank for cryptographic key storage and lifecycle state tracking. |
Applications
| Reconfigurable Instrument Cluster | High-Performance Infotainment |
|---|---|
Use Scenario: Digital cockpit with dynamic gauge layouts, ADAS alerts, and navigation overlays rendered across dual 1280×720 displays. IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, driving LCD/LVDS/HDMI display pipelines and decoding camera feeds. Use Value: GPU3Dv6 and dual IPUv3H enable real-time 3D rendering and 1080p video compositing at <16 ms latency - meeting ASIL-B timing constraints. | Use Scenario: In-vehicle multimedia hub supporting Bluetooth audio streaming, HDMI mirroring, rear-seat entertainment, and voice-controlled navigation. IC Role / Device Role / Timing Role: Central multimedia SoC managing USB OTG, eMMC storage, HDMI Tx, MIPI DSI, and dual-band Wi-Fi/BT coexistence. Use Value: Integrated VPU and CAAM allow secure 1080p HEVC decode and DRM-protected content playback without external codecs or security co-processors. |
| Automotive Head-Up Display (HUD) | Advanced Driver Assistance Systems (ADAS) Dashboard Fusion |
Use Scenario: Projection-based HUD displaying speed, warnings, and AR navigation onto windshield with precise geometric correction. IC Role / Device Role / Timing Role: Real-time graphics processor generating warped, perspective-corrected frames synchronized to vehicle speed and steering angle inputs. Use Value: GPU2Dv3 BitBlt engine performs pixel-perfect affine transforms and alpha blending at 60 fps - eliminating need for FPGA-based geometry engines. | Use Scenario: Integrated dashboard combining forward-camera ADAS alerts (FCW, LDW), surround-view stitching, and blind-spot monitoring into unified UI. IC Role / Device Role / Timing Role: Vision processing hub receiving MIPI CSI-2 feeds from 4 cameras, running ISP algorithms, and fusing outputs via IPUv3H. Use Value: Dual IPUv3H units process two 1080p30 camera streams concurrently while GPU3Dv6 renders fused top-down view - all within 100 ms end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT8AAR | Quad-core Cortex-A9 @ 852 MHz; adds two additional CPU cores and higher VPU throughput. | Better suited for multi-OS partitioning (e.g., QNX + Android VM) and heavier compute workloads like AI-based vision pre-processing. | Select when application requires >2 concurrent high-priority tasks or ISO 26262 ASIL-D partitioning across cores. |
| MCIMX8MQ6AVT8AC | Arm Cortex-A53 quad-core @ 1.5 GHz; includes ARMv8 crypto extensions, 1080p60 VP9 decode, and PCIe v3.0. | Targets next-gen infotainment with Android 12+, virtualization, and cloud-connected services - lacks MLB and legacy CAN flexibility. | Select for new designs requiring long-term roadmap support beyond 2027 and enhanced security compliance (e.g., UNECE R155). |
Compared with MCIMX6DP6AVT8AAR, MCIMX6QP6AVT8AAR offers higher parallel compute density for safety-critical redundancy, while MCIMX8MQ6AVT8AC provides modern ISA features and longer product lifecycle but requires board redesign due to different package and peripheral set.
Availability
MCIMX6DP6AVT8AAR is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and ADAS display fusion modules requiring stable component supply across extended production lifecycles.
Supply support for MCIMX6DP6AVT8AAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6DualPlus family was designed specifically for automotive human-machine interfaces requiring functional safety, real-time graphics, and hardware-enforced security - targeting ASIL-B compliant digital cockpits and infotainment systems.
FAQ
What is the maximum DDR3L memory speed supported by MCIMX6DP6AVT8AAR?
The MCIMX6DP6AVT8AAR supports DDR3L-1066 (533 MHz clock) with 64-bit bus width, delivering up to 6.4 GB/s theoretical bandwidth. This is validated per JEDEC JESD79-3F specification and requires matched trace lengths and controlled impedance routing on PCB to maintain signal integrity at 1066 MT/s data rates. The MMDC controller also supports interleaving across dual channels for improved effective throughput in MCIMX6DP6AVT8AAR designs.
Does MCIMX6DP6AVT8AAR include hardware support for secure boot?
Yes, MCIMX6DP6AVT8AAR implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, version control, and warm boot capability. Boot ROM enforces chain-of-trust starting from immutable fuses (CSU policy), through signed bootloader images stored in eMMC or NAND, to authenticated OS kernels. All cryptographic operations are accelerated by the CAAM module, ensuring MCIMX6DP6AVT8AAR meets UNECE R155 cybersecurity management system requirements.
Can MCIMX6DP6AVT8AAR drive multiple displays simultaneously?
Yes, MCIMX6DP6AVT8AAR supports up to four active displays concurrently via its integrated display subsystem: one parallel RGB interface (24-bit, up to WUXGA@60Hz), one HDMI 1.4 port, one dual-channel LVDS interface (up to WUXGA@60Hz), and one MIPI DSI interface (2 lanes, up to 1 Gbps). The dual IPUv3H units handle independent scaling, rotation, and alpha blending per display path, enabling MCIMX6DP6AVT8AAR to drive a digital cluster, center console, HUD, and rear-seat display simultaneously with hardware-accelerated composition.
What automotive communication interfaces are integrated into MCIMX6DP6AVT8AAR?
MCIMX6DP6AVT8AAR integrates two FlexCAN 2.0B controllers (1 Mbps each), one MLB150 interface (150 Mbps), and an ESAI audio interface supporting up to 260 kHz sampling in 7.1 channel mode. These interfaces enable direct connection to vehicle CAN buses, MOST audio networks, and high-fidelity multichannel audio codecs without external bridge ICs - a key requirement for MCIMX6DP6AVT8AAR deployment in premium automotive platforms.
Is MCIMX6DP6AVT8AAR pin-compatible with other i.MX 6DualPlus variants?
Yes, all i.MX 6DualPlus FCPBGA-624 packages including MCIMX6DP6AVT8AAR, MCIMX6DP4AVT8AA, and MCIMX6DP6AVT1AA share identical ball mapping, signal naming, and mechanical footprint per IMX6DQPAEC Rev. 3. This allows frequency- and feature-scaling within the same PCB layout - for example, upgrading from 852 MHz to 1 GHz (MCIMX6DP6AVT1AA) or disabling VPU (MCIMX6DP4AVT8AA) without hardware changes. MCIMX6DP6AVT8AAR maintains full pin compatibility across automotive-grade DP-series parts.
MCIMX6DP6AVT8AAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6DP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6DP6AVT8AAR FAQ
1.How can I place an order for MCIMX6DP6AVT8AAR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6DP6AVT8AAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6DP6AVT8AAR reliable?
The price and inventory of MCIMX6DP6AVT8AAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6DP6AVT8AAR is usually 5 days.
3.What payment methods are accepted for MCIMX6DP6AVT8AAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6DP6AVT8AAR transactions.
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4.How is shipping managed for MCIMX6DP6AVT8AAR?
MCIMX6DP6AVT8AAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6DP6AVT8AAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6DP6AVT8AAR?
For technical support, including MCIMX6DP6AVT8AAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6DP6AVT8AAR requirements.
6.How does Aetrix verify that MCIMX6DP6AVT8AAR is sourced from the original manufacturer or authorized distributors?
All MCIMX6DP6AVT8AAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6DP6AVT8AAR meets industry standards.
7.What is the process for return or replacement of MCIMX6DP6AVT8AAR?
All MCIMX6DP6AVT8AAR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6DP6AVT8AAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6DP6AVT8AAR part is unused and in its original packaging.
Return procedure for MCIMX6DP6AVT8AAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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